SRAM Module, 1MX32, 20ns, CMOS, PSMA72, PLASTIC, SIMM-72
| Parameter Name | Attribute value |
| Maker | Force Technologies Ltd. |
| package instruction | SIMM, |
| Reach Compliance Code | unknown |
| ECCN code | 3A991.B.2.A |
| Maximum access time | 20 ns |
| Other features | WD-MAX |
| JESD-30 code | R-PSMA-N72 |
| length | 107.95 mm |
| memory density | 33554432 bit |
| Memory IC Type | SRAM MODULE |
| memory width | 32 |
| Number of functions | 1 |
| Number of terminals | 72 |
| word count | 1048576 words |
| character code | 1000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 1MX32 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SIMM |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| Parallel/Serial | PARALLEL |
| Maximum seat height | 17.018 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | SINGLE |
| width | 8.89 mm |
| DPS1MX32MW-20C | DPS1MX32ML-35C | DPS1MX32ML-15C | DPS1MX32ML-17C | DPS1MX32MW-15C | DPS1MX32MW-17C | DPS1MX32MW-25C | DPS1MX32MW-35C | |
|---|---|---|---|---|---|---|---|---|
| Description | SRAM Module, 1MX32, 20ns, CMOS, PSMA72, PLASTIC, SIMM-72 | SRAM Module, 1MX32, 35ns, CMOS, PZMA72, PLASTIC, ZIP-72 | SRAM Module, 1MX32, 15ns, CMOS, PZMA72, PLASTIC, ZIP-72 | SRAM Module, 1MX32, 17ns, CMOS, PZMA72, PLASTIC, ZIP-72 | SRAM Module, 1MX32, 15ns, CMOS, PSMA72, PLASTIC, SIMM-72 | SRAM Module, 1MX32, 17ns, CMOS, PSMA72, PLASTIC, SIMM-72 | SRAM Module, 1MX32, 25ns, CMOS, PSMA72, PLASTIC, SIMM-72 | SRAM Module, 1MX32, 25ns, CMOS, PSMA72, PLASTIC, SIMM-72 |
| package instruction | SIMM, | DIMM, | DIMM, | DIMM, | SIMM, | SIMM, | SIMM, | SIMM, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| Maximum access time | 20 ns | 35 ns | 15 ns | 17 ns | 15 ns | 17 ns | 25 ns | 25 ns |
| Other features | WD-MAX | WD-MAX; SEATED HT-CALCULATED | WD-MAX; SEATED HT-CALCULATED | WD-MAX; SEATED HT-CALCULATED | WD-MAX | WD-MAX | WD-MAX | WD-MAX |
| JESD-30 code | R-PSMA-N72 | R-PZMA-T72 | R-PZMA-T72 | R-PZMA-T72 | R-PSMA-N72 | R-PSMA-N72 | R-PSMA-N72 | R-PSMA-N72 |
| length | 107.95 mm | 97.79 mm | 97.79 mm | 97.79 mm | 107.95 mm | 107.95 mm | 107.95 mm | 107.95 mm |
| memory density | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit |
| Memory IC Type | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
| memory width | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 72 | 72 | 72 | 72 | 72 | 72 | 72 | 72 |
| word count | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| character code | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 1MX32 | 1MX32 | 1MX32 | 1MX32 | 1MX32 | 1MX32 | 1MX32 | 1MX32 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SIMM | DIMM | DIMM | DIMM | SIMM | SIMM | SIMM | SIMM |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Maximum seat height | 17.018 mm | 13.97 mm | 13.97 mm | 13.97 mm | 17.018 mm | 17.018 mm | 17.018 mm | 17.018 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | SINGLE | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | SINGLE | SINGLE | SINGLE | SINGLE |
| width | 8.89 mm | 8.89 mm | 8.89 mm | 8.89 mm | 8.89 mm | 8.89 mm | 8.89 mm | 8.89 mm |
| Maker | Force Technologies Ltd. | Force Technologies Ltd. | - | Force Technologies Ltd. | Force Technologies Ltd. | Force Technologies Ltd. | Force Technologies Ltd. | Force Technologies Ltd. |