EEWORLDEEWORLDEEWORLD

Part Number

Search

DPS1MX32MW-20C

Description
SRAM Module, 1MX32, 20ns, CMOS, PSMA72, PLASTIC, SIMM-72
Categorystorage    storage   
File Size406KB,6 Pages
ManufacturerForce Technologies Ltd.
Download Datasheet Parametric Compare View All

DPS1MX32MW-20C Overview

SRAM Module, 1MX32, 20ns, CMOS, PSMA72, PLASTIC, SIMM-72

DPS1MX32MW-20C Parametric

Parameter NameAttribute value
MakerForce Technologies Ltd.
package instructionSIMM,
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time20 ns
Other featuresWD-MAX
JESD-30 codeR-PSMA-N72
length107.95 mm
memory density33554432 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals72
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX32
Package body materialPLASTIC/EPOXY
encapsulated codeSIMM
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Parallel/SerialPARALLEL
Maximum seat height17.018 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationSINGLE
width8.89 mm

DPS1MX32MW-20C Related Products

DPS1MX32MW-20C DPS1MX32ML-35C DPS1MX32ML-15C DPS1MX32ML-17C DPS1MX32MW-15C DPS1MX32MW-17C DPS1MX32MW-25C DPS1MX32MW-35C
Description SRAM Module, 1MX32, 20ns, CMOS, PSMA72, PLASTIC, SIMM-72 SRAM Module, 1MX32, 35ns, CMOS, PZMA72, PLASTIC, ZIP-72 SRAM Module, 1MX32, 15ns, CMOS, PZMA72, PLASTIC, ZIP-72 SRAM Module, 1MX32, 17ns, CMOS, PZMA72, PLASTIC, ZIP-72 SRAM Module, 1MX32, 15ns, CMOS, PSMA72, PLASTIC, SIMM-72 SRAM Module, 1MX32, 17ns, CMOS, PSMA72, PLASTIC, SIMM-72 SRAM Module, 1MX32, 25ns, CMOS, PSMA72, PLASTIC, SIMM-72 SRAM Module, 1MX32, 25ns, CMOS, PSMA72, PLASTIC, SIMM-72
package instruction SIMM, DIMM, DIMM, DIMM, SIMM, SIMM, SIMM, SIMM,
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time 20 ns 35 ns 15 ns 17 ns 15 ns 17 ns 25 ns 25 ns
Other features WD-MAX WD-MAX; SEATED HT-CALCULATED WD-MAX; SEATED HT-CALCULATED WD-MAX; SEATED HT-CALCULATED WD-MAX WD-MAX WD-MAX WD-MAX
JESD-30 code R-PSMA-N72 R-PZMA-T72 R-PZMA-T72 R-PZMA-T72 R-PSMA-N72 R-PSMA-N72 R-PSMA-N72 R-PSMA-N72
length 107.95 mm 97.79 mm 97.79 mm 97.79 mm 107.95 mm 107.95 mm 107.95 mm 107.95 mm
memory density 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit
Memory IC Type SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE
memory width 32 32 32 32 32 32 32 32
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 72 72 72 72 72 72 72 72
word count 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words
character code 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 1MX32 1MX32 1MX32 1MX32 1MX32 1MX32 1MX32 1MX32
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SIMM DIMM DIMM DIMM SIMM SIMM SIMM SIMM
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Maximum seat height 17.018 mm 13.97 mm 13.97 mm 13.97 mm 17.018 mm 17.018 mm 17.018 mm 17.018 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form NO LEAD THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE NO LEAD NO LEAD NO LEAD NO LEAD
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location SINGLE ZIG-ZAG ZIG-ZAG ZIG-ZAG SINGLE SINGLE SINGLE SINGLE
width 8.89 mm 8.89 mm 8.89 mm 8.89 mm 8.89 mm 8.89 mm 8.89 mm 8.89 mm
Maker Force Technologies Ltd. Force Technologies Ltd. - Force Technologies Ltd. Force Technologies Ltd. Force Technologies Ltd. Force Technologies Ltd. Force Technologies Ltd.
Express delivery, show your board
I am very happy to receive the board. It was sent out at 8 pm last night, but it arrived at 9.40 this morning. It was so fast. Thanks to soso and Zhihui June! They have been busy arranging the board f...
fxw451 Microcontroller MCU
A complete guide to high-efficiency LED driver design
[i=s]This post was last edited by led2015 on 2020-4-29 23:25[/i]As the cost of producing LEDs falls, they are being used in more and more applications, including handheld devices, automotive electroni...
led2015 Power technology
In a four-layer board, can the top and bottom layer components be connected to the bottom layer or power layer at the same time through vias (through holes)?
[i=s]This post was last edited by hbsimon on 2016-12-22 22:47[/i] I am designing a four-layer board. Can the top and bottom layers be connected to the middle bottom layer or power layer through vias (...
hbsimon PCB Design
Please STM32FAE must take a look at this issue
Chip model: "STM32F103C6T6A GHAAV 93 CHN841" This version of TIM4 cannot be used.But this model: "STM32F103C6T6 990VD 93 MYS 806" TIM4 function is normal. Same program, same board, change the chip and...
rgqy stm32/stm8
Failed to open the project!!!
My boss gave me an mtjp project. After I downloaded CS+ from the official website and installed it, when I opened the project, the error "Opening a project failed." [Direct Error Cause] "[b]The specif...
hpu6 Renesas Electronics MCUs
Tomorrow is Valentine's Day, what do you want to do?
Yesterday my sister asked me why I didn’t buy some roses in advance. I said, why buy them? Let’s wait until I get a bunch of them for 5 yuan. Haha, what are you going to do for Valentine’s Day?...
soso Talking

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2210  1240  1085  2423  1311  45  25  22  49  27 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号