Standard SRAM, 64KX4, 12ns, CDIP32, 0.400 INCH, SIDE BRAZED, CERAMIC, DIP-32
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | DIP |
| package instruction | 0.400 INCH, SIDE BRAZED, CERAMIC, DIP-32 |
| Contacts | 32 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Maximum access time | 12 ns |
| Other features | LATCHED DATA OUTPUT |
| I/O type | SEPARATE |
| JESD-30 code | R-CDIP-T32 |
| JESD-609 code | e0 |
| length | 40.894 mm |
| memory density | 262144 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 4 |
| Negative supply voltage rating | -5.2 V |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 65536 words |
| character code | 64000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 75 °C |
| Minimum operating temperature | |
| organize | 64KX4 |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP32,.4 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | -5.2 V |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum slew rate | 0.28 mA |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL EXTENDED |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 10.16 mm |
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