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HM62V16256CLBPI-7

Description
Standard SRAM, 256KX16, 70ns, CMOS, PBGA48, 0.75 MM PITCH, CSP-48
Categorystorage    storage   
File Size130KB,18 Pages
ManufacturerHitachi (Renesas )
Websitehttp://www.renesas.com/eng/
Download Datasheet Parametric Compare View All

HM62V16256CLBPI-7 Overview

Standard SRAM, 256KX16, 70ns, CMOS, PBGA48, 0.75 MM PITCH, CSP-48

HM62V16256CLBPI-7 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerHitachi (Renesas )
Parts packaging codeBGA
package instructionTFBGA, BGA48,6X8,30
Contacts48
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time70 ns
I/O typeCOMMON
JESD-30 codeS-PBGA-B48
JESD-609 codee0
length6.5 mm
memory density4194304 bit
Memory IC TypeSTANDARD SRAM
memory width16
Number of functions1
Number of terminals48
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256KX16
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Encapsulate equivalent codeBGA48,6X8,30
Package shapeSQUARE
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
power supply2.2/3.6 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Minimum standby current1.5 V
Maximum slew rate0.025 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.2 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch0.75 mm
Terminal locationBOTTOM
width6.5 mm
HM62V16256CBPI Series
Wide Temperature Range Version
4 M SRAM (256-kword
×
16-bit)
ADE-203-1101 (Z)
Preliminary
Rev. 0.0
Aug. 30, 1999
Description
The Hitachi HM62V16256CBPI Series is 4-Mbit static RAM organized 262,144-word
×
16-bit.
HM62V16256CBPI Series has realized higher density, higher performance and low power consumption by
employing Hi-CMOS process technology. It offers low power standby power dissipation; therefore, it is
suitable for battery backup systems. It is packaged in 48 bumps chip size package with 0.75 mm bump pitch
for high density surface mounting. HM62V16256CBPI is suitable for the application of the mobile phone to
reduce both the mount space and weight.
Features
Single 2.5 V and 3.0 V supply: 2.2 V to 3.6 V
Fast access time: 70 ns (max)
Power dissipation:
Active: TBD (typ)
Standby: 2.4
µW
(typ)
Completely static memory.
No clock or timing strobe required
Equal access and cycle times
Common data input and output.
Three state output
Battery backup operation.
2 chip selection for battery backup
Temperature range: –40 to +85°C
Preliminary: The specification of this device are subject to change without notice. Please contact your
nearest Hitachi’s Sales Dept. regarding specification.

HM62V16256CLBPI-7 Related Products

HM62V16256CLBPI-7 HM62V16256CLBPI-7SL
Description Standard SRAM, 256KX16, 70ns, CMOS, PBGA48, 0.75 MM PITCH, CSP-48 Standard SRAM, 256KX16, 70ns, CMOS, PBGA48, 0.75 MM PITCH, CSP-48
Is it Rohs certified? incompatible incompatible
Maker Hitachi (Renesas ) Hitachi (Renesas )
Parts packaging code BGA BGA
package instruction TFBGA, BGA48,6X8,30 TFBGA, BGA48,6X8,30
Contacts 48 48
Reach Compliance Code unknown unknown
ECCN code 3A991.B.2.A 3A991.B.2.A
Maximum access time 70 ns 70 ns
I/O type COMMON COMMON
JESD-30 code S-PBGA-B48 S-PBGA-B48
JESD-609 code e0 e0
length 6.5 mm 6.5 mm
memory density 4194304 bit 4194304 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
memory width 16 16
Number of functions 1 1
Number of terminals 48 48
word count 262144 words 262144 words
character code 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
organize 256KX16 256KX16
Output characteristics 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TFBGA TFBGA
Encapsulate equivalent code BGA48,6X8,30 BGA48,6X8,30
Package shape SQUARE SQUARE
Package form GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
power supply 2.2/3.6 V 2.2/3.6 V
Certification status Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm
Minimum standby current 1.5 V 1.5 V
Maximum slew rate 0.025 mA 0.025 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.2 V 2.2 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V
surface mount YES YES
technology CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL BALL
Terminal pitch 0.75 mm 0.75 mm
Terminal location BOTTOM BOTTOM
width 6.5 mm 6.5 mm

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