JTS(X)81102G0-1V2A datasheet, PDF

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JTS(X)81102G0-1V2A: DescriptionTelecom Circuit, 1-Func, Bipolar, DIE; CategoryWireless rf/communication Telecom circuit; File Size361KB，13 Pages; ManufacturerAtmel (Microchip)

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JTS(X)81102G0-1V2A Overview

Telecom Circuit, 1-Func, Bipolar, DIE

JTS(X)81102G0-1V2A Parametric

Parameter Name	Attribute value
Maker	Atmel (Microchip)
Parts packaging code	DIE
package instruction	DIE,
Reach Compliance Code	unknown
JESD-30 code	X-XUUC-N
Negative supply voltage rating	-5 V
Number of functions	1
Package body material	UNSPECIFIED
encapsulated code	DIE
Package shape	UNSPECIFIED
Package form	UNCASED CHIP
Certification status	Not Qualified
Nominal supply voltage	5 V
surface mount	YES
technology	BIPOLAR
Telecom integrated circuit types	TELECOM CIRCUIT
Terminal form	NO LEAD
Terminal location	UPPER

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TS81102G0

8/10 bit – 2 GSPS 1:8/1:4 DEMUX

DESCRIPTION

The DEMUX is designed to fit with TCS high speed ADC

TS8387 and TS8388B and further G’core ADC 2 and

4GSPS family.

This DEMUX allows users to process the high speed out-

put data stream down to processor speed. It uses the very

high speed bipolar technology (25 GHz NPN cutt–off fre-

quency) B6HF from SIEMENS.

MAIN FEATURES

Programmable Demux ratio :

. 1:4 : Data Rate max=1GSPS,

D (8b/10b)

< 3.7 / 4.1 W

(ECL 50

output)

. 1:8 : Data Rate max=2GSPS,

D (8b/10b)

< 5.1/ 5.9 W

(ECL 50

output)

. 1:16 with 1 TS8388 and 2 DEMUX.

Parallel output mode.

8 /10 bit, with nap mode for the 2 unused bit.

ECL Differential input data.

DataReady or DataReady/2 input clock.

Input clock sampling delay adjust.

Single ended output data :

. Adjustable common mode and swing

. Logic threshold reference output

. (ECL, PECL, TTL).

Asynchronous reset.

Synchronous reset

(to be confirmed).

ADC + DEMUX multi–channel applications :

. Stand–alone delay adjust cell for ADCs sampling

instant alignment

Differential data ready output.

Built–in self test (BIST).

Dual supply V

= –5 V, Vcc = +5 V,

Radiation tolerance oriented design (more than

100Krad (Si) expected).

SCREENING

TCS standard screening level.

Mil–PRF–38535, QML level Q for hermetic package only

(TBC)

Space screening level according to ESA/SCC 9000

(TBC)

Temperature range : 0°C < Tc < +70

°C

–40°C <Tc < +85°C

1/13

– Evaluation board for TBGA 240 package

– Hermetic package :

CI–CGA 360 on request only

– Package : TBGA 240

Tape Ball Grid Array (cavity down)

May 1999

TS81102G0

Table of Contents

1. BLOCK DIAGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2. PACKAGE DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

2.1. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

2.2. TBGA 240 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.3. Outline dimensions - 240 Tape Ball Grid Array . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3. MAIN FUNCTIONS DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.1. Programmable Demux ratio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.2. Parallel output mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.3. Input clock sampling delay adjust . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.4. Asynchronous reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.5. ADC + DEMUX mono-channel applications : . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.6. ADC + DEMUX multi-channel applications with asynchronous reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.7. Synchronous Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.8. ADC + DEMUX multi-channel applications with synchronous reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.9. 1:16 conversion ratio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3.10. Counter programmable state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3.11. Pipeline delay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3.12. 8 /10 bit, with nap mode for the 2 unused bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3.13. ECL Differential input data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3.14. 50 ohms Differential output data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3.15. Single ended output data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

3.16. Differential Data Ready output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

3.17. Built-in Self Test (BIST) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

4. ORDERING INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

2/13

JTS(X)81102G0-1V2A Related Products

	JTS(X)81102G0-1V2A	JTS(X)81102G0-1V3A	JTS(X)81102G0-1V1A
Description	Telecom Circuit, 1-Func, Bipolar, DIE	Telecom Circuit, 1-Func, Bipolar, DIE	Telecom Circuit, 1-Func, Bipolar, DIE
Maker	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)
Parts packaging code	DIE	DIE	DIE
package instruction	DIE,	DIE,	DIE,
Reach Compliance Code	unknown	unknown	unknown
JESD-30 code	X-XUUC-N	X-XUUC-N	X-XUUC-N
Negative supply voltage rating	-5 V	-5 V	-5 V
Number of functions	1	1	1
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIE	DIE	DIE
Package shape	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
Package form	UNCASED CHIP	UNCASED CHIP	UNCASED CHIP
Certification status	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage	5 V	5 V	5 V
surface mount	YES	YES	YES
technology	BIPOLAR	BIPOLAR	BIPOLAR
Telecom integrated circuit types	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT
Terminal form	NO LEAD	NO LEAD	NO LEAD
Terminal location	UPPER	UPPER	UPPER

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