Charge Device Model (CDM) ....................................................... 1000V
Machine Model (MM) ..................................................................... 100V
NOTES: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability.
(2) Pins 2 and 6 on SO-8 package, pins 2 and 5 on SO-16 package,
and pins 2 and 11 on QFN-16 package > 500V HBM.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
PACKAGE/ORDERING INFORMATION
(1)
PACKAGE
DESIGNATOR
D
"
DTJ
"
D
RGV
SPECIFIED
TEMPERATURE
RANGE
–40°C to +85°C
"
–40°C to +85°C
"
–40°C to +85°C
–40°C to +85°C
PACKAGE
MARKING
OPA2677U
"
OPA2677H
"
OPA2677T
OPA2677
ORDERING
NUMBER
OPA2677U
OPA2677U/2K5
OPA2677H
OPA2677H/2K5
OPA2677T
OPA2677T/2K5
OPA2677IRGVT
OPA2677IRGVR
TRANSPORT
MEDIA, QUANTITY
Rails, 100
Tape and Reel, 2500
Rails, 100
Tape and Reel, 2500
Rails, 48
Tape and Reel, 2500
Tape and Reel, 250
Tape and Reel, 2500
PRODUCT
OPA2677
"
OPA2677
"
OPA2677
OPA2677
PACKAGE-LEAD
SO-8
"
PSO-8
"
SO-16
QFN-16
NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at
www.ti.com.
PIN CONFIGURATIONS
Top View
OPA2677U, H
Out A
–In A
+In A
–V
S
1
2
3
4
8
7
6
5
+V
S
Out B
–In B
+In B
NC
1
2
3
4
5
6
7
8
SO-16
Ch B
Ch A
16 +V
S
15 Out A
14 NC
13 +V
S
(internally connected
to pin 16)
OPA2677T
SO-8, PSO-8
–In A
OPA2677RGV
+In A
NC
–In B
12
11
10
9
NC
–In B
+In B
NC
Out A
16
NC
–In A
+In A
NC
1
2
3
4
5
15
14
13
Out B
+V
S
NC
12 Out B
11 –V
S
10 NC
9
NC
+In A
NC
NC
6
7
8
–V
S
NC
NC
QFN-16
NOTE: Exposed thermal pad on PSO-8 and QFN-16 must be tied to –V
S
.
NC
2
OPA2677
www.ti.com
SBOS126F
ELECTRICAL CHARACTERISTICS: V
S
=
±
6V
Boldface
limits are tested at
+25
°
C.
At T
A
= +25°C, G = +4, R
F
= 402Ω, and R
L
= 100Ω, unless otherwise noted. See Figure 1 for AC performance only.
OPA2677U, H, T, RGV
TYP
PARAMETER
AC PERFORMANCE (see Figure 1)
Small-Signal Bandwidth (V
O
= 0.5V
PP
)
CONDITIONS
G = +1, R
F
= 511Ω
G = +2, R
F
= 475Ω
G = +4, R
F
= 402Ω
G = +8, R
F
= 250Ω
G = +1, R
F
= 511Ω
G = +4, V
O
= 0.5V
PP
G = +4, V
O
= 5V
PP
G = +4, 5V Step
G = +4, V
O
= 2V Step
G = +4, f = 5MHz, V
O
= 2V
PP
R
L
= 100Ω
R
L
≥
500Ω
R
L
= 100Ω
R
L
≥
500Ω
f > 1MHz
f > 1MHz
f > 1MHz
NTSC, G = +2, R
L
= 150Ω
NTSC, G = +2, R
L
= 37.5Ω
NTSC, G = +2, R
L
= 150Ω
NTSC, G = +2, R
L
= 37.5Ω
f = 5MHz, Input Referred
V
O
= 0V, R
L
= 100Ω
V
CM
= 0V
V
CM
= 0V
V
CM
= 0V
V
CM
= 0V
V
CM
= 0V
V
CM
= 0V
+25
°
C
220
200
200
250
0
80
200
2000
1.75
–72
–82
–81
–93
2
16
24
0.03
0.05
0.01
0.04
–92
135
±1.0
±4
±10
±5
±10
±10
±4.5
55
250 || 2
22
22
±5.1
±5.0
±4.8
±500
1.2
–1.6
0.003
±6
±2
18
18
56
–40 to +85
Junction-to-Ambient
Exposed Slug Soldered to Board
Exposed Slug Soldered to Board
125
55
100
50
(7)
°C/W
°C/W
°C/W
°C/W
typ
typ
typ
typ
C
C
C
C
+25
°
C
(1)
MIN/MAX OVER TEMPERATURE
0
°
C to
70
°
C
(2)
–40
°
C to
+85
°
C
(2)
UNITS
MHz
MHz
MHz
MHz
dB
MHz
MHz
V/µs
ns
dBc
dBc
dBc
dBc
nV/√Hz
pA/√Hz
pA/√Hz
%
%
degrees
degrees
dB
kΩ
mV
µV/°C
µA
nA/°C
µA
nA°/C
V
dB
kΩ || pF
Ω
Ω
V
V
V
mA
A
A
Ω
V
V
V
mA
mA
dB
°C
MIN/
TEST
MAX
LEVEL
(3)
min
min
min
min
typ
min
typ
min
typ
max
max
max
max
max
max
max
typ
typ
typ
typ
typ
min
max
max
max
max
max
max
min
min
typ
min
max
min
min
typ
min
typ
typ
typ
typ
max
typ
max
min
min
B
B
B
B
C
B
C
B
C
B
B
B
B
B
B
B
C
C
C
C
C
A
A
B
A
B
A
B
A
A
C
B
B
A
A
C
A
C
C
C
C
A
C
A
A
A
170
170
225
36
1500
168
168
205
32
1450
165
165
200
30
1400
Peaking at a Gain of +1
Bandwidth for 0.1dB Gain Flatness
Large-Signal Bandwidth
Slew Rate
Rise-and-Fall Time
Harmonic Distortion
2nd-Harmonic
3rd-Harmonic
Input Voltage Noise
Noninverting Input Current Noise
Inverting Input Current Noise
NTSC Differential Gain
NTSC Differential Phase
Channel-to-Channel Crosstalk
DC PERFORMANCE
(4)
Open-Loop Transimpedance Gain
Input Offset Voltage
Average Offset Voltage Drift
Noninverting Input Bias Current
Average Noninverting Input Bias Current Drift
Inverting Input Bias Current
Average Inverting Input Bias Current Drift
INPUT
(4)
Common-Mode Input Range (CMIR)
(5)
Common-Mode Rejection Ratio (CMRR)
Noninverting Input Impedance
Minimum Inverting Input Resistance
Maximum Inverting Input Resistance
OUTPUT
(4)
Voltage Output Swing
–70
–80
–80
–91
2.6
20
29
–69
–79
–79
–90
2.9
21
30
–68
–78
–78
–89
3.1
22
31
±10
±
30
±50
±
35
±100
±
4.5
80
76
±5
±10
±32
±50
±40
±100
±4.0
50
75
±5.3
±12
±35
±75
±45
±150
±3.9
49
±
4.1
51
12
35
V
CM
= 0V, Input Referred
Open-Loop
Open-Loop
No Load
R
L
= 100Ω
R
L
= 25Ω
V
O
= 0
V
O
= 0
V
O
= 0
G = +4, f
≤
100kHz
±
4.9
±
4.8
±
380
±4.8
±4.7
±350
±4.7
±4.5
±320
Current Output
Peak Current Output, Sourcing
(6)
Peak Current Output, Sinking
(6)
Closed-Loop Output Impedance
POWER SUPPLY
Specified Operating Voltage
Maximum Operating Voltage
Minimum Operating Voltage
Maximum Quiescent Current
Minimum Quiescent Current
Power-Supply Rejection Ratio (PSRR)
THERMAL CHARACTERISTICS
Specification: U, H, T
Thermal Resistance,
θ
JA
U
SO-8
H
PSO-8
T
SO-16
RGV QFN-16
±
6.3
18.6
17.4
51
±6.3
18.8
16.5
49
±6.3
19.5
16.0
48
V
S
=
±6V
V
S
=
±6V
f = 100kHz, Input Referred
NOTES: (1) Junction temperature = ambient for +25°C specifications.
(2) Junction temperature = ambient at low temperature limit; junction temperature = ambient +23°C at high temperature limit for over temperature
specifications.
(3) Test levels: (A) 100% tested at +25°C. Over temperature limits by characterization and simulation. (B) Limits set by characterization and simulation.
(C) Typical value only for information.
(4) Current is considered positive out of node. V
CM
is the input common-mode voltage.
(5) Tested < 3dB below minimum CMRR specifications at
±CMIR
limits.
(6) Peak output duration should not exceed junction temperature +150°C for extended periods.
(7) Not connecting the exposed slug to the –V
J
plane gives 75°C/W thermal impedance (
θ
JA
).
OPA2677
SBOS126F
www.ti.com
3
ELECTRICAL SPECIFICATIONS: V
S
= +5V
Boldface
limits are tested at
+25
°
C.
At T
A
= +25°C, G = +4, R
F
= 453Ω, and R
L
= 100Ω, unless otherwise noted. See Figure 3 for AC performance only.
OPA2677U, H, T, RGV
TYP
PARAMETER
AC PERFORMANCE (see Figure 3)
Small-Signal Bandwidth (V
O
= 0.5V
PP
)
CONDITIONS
+25
°
C
160
150
150
160
0
70
100
1100
2
–67
–71
–72
–74
2
16
24
–92
110
±0.8
±4
±10
±5
±10
±10
3.7
1.3
52
250 || 2
25
25
4.1
3.5
0.8
1.0
±300
0.02
+5
12.6
V
S
=
±6V
V
S
=
±6V
f = 100kHz, Input Referred
+4
13.6
13.6
52
–40 to +85
Junction-to-Ambient
Exposed Slug Soldered to Board
Exposed Slug Soldered to Board
125
55
100
50
(4)
14.8
12.0
12.6
15.2
11.7
12.6
15.6
11.4
MIN/MAX OVER TEMPERATURE
+25
°
C
(1)
0
°
C to
70
°
C
(2)
–40
°
C to
+85
°
C
(2)
UNITS
MIN/
TEST
MAX
LEVEL
(3)
Peaking at a Gain of +1
Bandwidth for 0.1dB Gain Flatness
Large-Signal Bandwidth
Slew Rate
Rise-and-Fall Time
Harmonic Distortion
2nd-Harmonic
3rd-Harmonic
Input Voltage Noise
Noninverting Input Current Noise
Inverting Input Current Noise
Channel-to-Channel Crosstalk
DC PERFORMANCE
Open-Loop Transimpedance Gain
Input Offset Voltage
Average Offset Voltage Drift
Noninverting Input Bias Current
Average Noninverting Input Bias Current Drift
Inverting Input Bias Current
Average Inverting Input Bias Current Drift
INPUT
Most Positive Input Voltage
Most Negative Input Voltage
Common-Mode Rejection Ratio (CMRR)
Noninverting Input Impedance
Minimum Inverting Input Resistance
Maximum Inverting Input Resistance
OUTPUT
Most Positive Output Voltage
Least Positive Output Voltage
Current Output
Closed-Loop Output Impedance
POWER SUPPLY
Specified Operating Voltage
Maximum Operating Voltage
Minimum Operating Voltage
Maximum Quiescent Current
Minimum Quiescent Current
Power-Supply Rejection Ratio (PSRR)
THERMAL CHARACTERISTICS
Specification: U, H, T
Thermal Resistance,
θ
JA
U
SO-8
H
PSO-8
T
SO-16
RGV QFN-16
G = +1, R
F
= 536Ω
G = +2, R
F
= 511Ω
G = +4, R
F
= 453Ω
G = +8, R
F
= 332Ω
G = +1, R
F
= 511Ω
G = +4, V
O
= 0.5V
PP
G = +4, V
O
= 2V
PP
G = +4, 2V Step
G = +4, V
O
= 2V Step
G = +4, f = 5MHz, V
O
= 2V
PP
R
L
= 100Ω
R
L
≥
500Ω
R
L
= 100Ω
R
L
≥
500Ω
f > 1MHz
f > 1MHz
f > 1MHz
f = 5MHz, Input Referred
V
O
= 0V, R
L
= 100Ω
V
CM
= 0V
V
CM
= 0V
V
CM
= 0V
V
CM
= 0V
V
CM
= 0V
V
CM
= 0V
120
130
130
23
830
118
128
128
20
827
115
125
125
19
825
MHz
MHz
MHz
MHz
dB
MHz
MHz
V/µs
ns
dBc
dBc
dBc
dBc
nV/√Hz
pA/√Hz
pA/√Hz
dB
kΩ
mV
µV/°C
µA
nA/°C
µA
nA°/C
V
V
dB
kΩ || pF
kΩ
kΩ
V
V
V
V
mA
Ω
V
V
V
mA
mA
dB
°C
°C/W
°C/W
°C/W
°C/W
min
min
min
min
typ
min
typ
min
typ
max
max
max
max
max
max
max
typ
min
max
max
max
max
max
max
min
min
min
typ
min
max
min
min
min
min
min
typ
typ
max
typ
max
min
typ
B
B
B
B
C
B
C
B
C
B
B
B
B
B
B
B
C
A
A
B
A
B
A
B
A
A
A
C
B
B
A
A
A
A
A
C
C
A
C
A
A
C
–65
–68
–70
–71
2.6
20
29
–64
–67
–69
–70
2.9
21
30
–63
–66
–68
–69
3.1
22
31
±
3.5
±
30
±
30
±10
±50
72
±100
3.3
1.7
49
15
40
3.9
3.8
1.0
1.1
±
200
70
±4.0
±10
±32
±50
±40
±100
3.2
1.8
48
68
±4.3
±12
±35
±75
±45
±150
3.1
1.9
47
V
CM
= 2.5V, Input Referred
Open-Loop
Open-Loop
No Load
R
L
= 100Ω
No Load
R
L
= 100Ω
V
O
= 0
G = +4, f
≤
100kHz
3.8
3.7
1.1
1.2
±180
3.6
3.5
1.3
1.5
±100
typ
typ
typ
typ
C
C
C
C
NOTES: (1) Junction temperature = ambient for +25°C specifications.
(2) Junction temperature = ambient at low temperature limit; junction temperature = ambient +9°C at high temperature limit for over temperature
specifications.
(3) Test levels: (A) 100% tested at +25°C. Over temperature limits by characterization and simulation. (B) Limits set by characterization and simulation.
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