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K7N801801B-HI16

Description
ZBT SRAM, 512KX18, 3.5ns, CMOS, PBGA119, BGA-119
Categorystorage    storage   
File Size536KB,24 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric View All

K7N801801B-HI16 Overview

ZBT SRAM, 512KX18, 3.5ns, CMOS, PBGA119, BGA-119

K7N801801B-HI16 Parametric

Parameter NameAttribute value
MakerSAMSUNG
Parts packaging codeBGA
package instructionBGA,
Contacts119
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time3.5 ns
JESD-30 codeR-PBGA-B119
length22 mm
memory density9437184 bit
Memory IC TypeZBT SRAM
memory width18
Number of functions1
Number of terminals119
word count524288 words
character code512000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512KX18
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeRECTANGULAR
Package formGRID ARRAY
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
width14 mm
K7N803601B
K7N803201B
K7N801801B
Document Title
256Kx36/x32 & 512Kx18 Pipelined NtRAM
TM
256Kx36 & 256Kx32 & 512Kx18-Bit Pipelined NtRAM
TM
Revision History
Rev. No.
0.0
0.1
0.2
1.0
History
1. Initial document.
1. Add x32 org part and industrial temperature part
1. change scan order(1) form 4T to 6T at 119BGA(x18)
1. Final spec release
2. Change I
SB2
form 50mA to 60mA
Draft Date
May. 18. 2001
Aug. 11. 2001
Aug. 28 .2001
Nov. 16. 2001
Remark
Preliminary
Preliminary
Preliminary
Final
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.
-1-
Nov 2001
Rev 1.0
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