K4N56163QF-ZC33 datasheet, PDF

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K4N56163QF-ZC33: DescriptionDDR DRAM, 16MX16, 0.47ns, CMOS, PBGA84, FBGA-84; Categorystorage storage; File Size324KB，19 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/; Environmental Compliance

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K4N56163QF-ZC33 Overview

DDR DRAM, 16MX16, 0.47ns, CMOS, PBGA84, FBGA-84

K4N56163QF-ZC33 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SAMSUNG
Parts packaging code	BGA
package instruction	TFBGA, BGA84,9X15,32
Contacts	84
Reach Compliance Code	compliant
ECCN code	EAR99
access mode	FOUR BANK PAGE BURST
Maximum access time	0.47 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	300 MHz
I/O type	COMMON
interleaved burst length	4,8
JESD-30 code	R-PBGA-B84
JESD-609 code	e1
length	13 mm
memory density	268435456 bit
Memory IC Type	DDR DRAM
memory width	16
Humidity sensitivity level	2
Number of functions	1
Number of ports	1
Number of terminals	84
word count	16777216 words
character code	16000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	95 °C
Minimum operating temperature
organize	16MX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA84,9X15,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
power supply	1.8 V
Certification status	Not Qualified
refresh cycle	8192
Maximum seat height	1.2 mm
self refresh	YES
Continuous burst length	4,8
Maximum slew rate	0.37 mA
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	11 mm

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K4N56163QF-GC

256M gDDR2 SDRAM

256Mbit gDDR2 SDRAM

Revision 1.8

May 2005

INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,

AND IS SUBJECT TO CHANGE WITHOUT NOTICE.

NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,

TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL

INFORMATION IN THIS DOCUMENT IS PROVIDED

ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.

1. For updates or additional information about Samsung products, contact your nearest Samsung office.

2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar

applications where Product failure could result in loss of life or personal or physical harm, or any military or

defense application, or any governmental procurement to which special terms or provisions may apply.

* Samsung Electronics reserves the right to change products or specification without notice.

- 1 -

Rev. 1.8 May 2005

K4N56163QF-ZC33 Related Products

	K4N56163QF-ZC33	K4N56163QF-ZC36	3470-52	K4N56163QF-ZC25	K4N56163QF-GC36	34THE	350-D02-2
Description	DDR DRAM, 16MX16, 0.47ns, CMOS, PBGA84, FBGA-84	DDR DRAM, 16MX16, 0.5ns, CMOS, PBGA84, FBGA-84	MAGNETFELD-MESSGERÄT	DDR DRAM, 16MX16, 0.4ns, CMOS, PBGA84, FBGA-84	DDR DRAM, 16MX16, 0.5ns, CMOS, PBGA84, FBGA-84	Ten Turns Servo or Bushing Mount Hall Effect	Outdoor Use Waterproof I/O Connectors
Is it Rohs certified?	conform to	conform to	-	conform to	incompatible	-	-
Maker	SAMSUNG	SAMSUNG	-	SAMSUNG	SAMSUNG	-	-
Parts packaging code	BGA	BGA	-	BGA	BGA	-	-
package instruction	TFBGA, BGA84,9X15,32	TFBGA, BGA84,9X15,32	-	TFBGA, BGA84,9X15,32	TFBGA, BGA84,9X15,32	-	-
Contacts	84	84	-	84	84	-	-
Reach Compliance Code	compliant	compliant	-	compliant	compliant	-	-
ECCN code	EAR99	EAR99	-	EAR99	EAR99	-	-
access mode	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	-	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	-	-
Maximum access time	0.47 ns	0.5 ns	-	0.4 ns	0.5 ns	-	-
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	-	AUTO/SELF REFRESH	AUTO/SELF REFRESH	-	-
Maximum clock frequency (fCLK)	300 MHz	275 MHz	-	400 MHz	275 MHz	-	-
I/O type	COMMON	COMMON	-	COMMON	COMMON	-	-
interleaved burst length	4,8	4,8	-	4,8	4,8	-	-
JESD-30 code	R-PBGA-B84	R-PBGA-B84	-	R-PBGA-B84	R-PBGA-B84	-	-
length	13 mm	13 mm	-	13 mm	13 mm	-	-
memory density	268435456 bit	268435456 bit	-	268435456 bit	268435456 bit	-	-
Memory IC Type	DDR DRAM	DDR DRAM	-	DDR DRAM	DDR DRAM	-	-
memory width	16	16	-	16	16	-	-
Number of functions	1	1	-	1	1	-	-
Number of ports	1	1	-	1	1	-	-
Number of terminals	84	84	-	84	84	-	-
word count	16777216 words	16777216 words	-	16777216 words	16777216 words	-	-
character code	16000000	16000000	-	16000000	16000000	-	-
Operating mode	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	-	-
Maximum operating temperature	95 °C	95 °C	-	95 °C	95 °C	-	-
organize	16MX16	16MX16	-	16MX16	16MX16	-	-
Output characteristics	3-STATE	3-STATE	-	3-STATE	3-STATE	-	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	-	-
encapsulated code	TFBGA	TFBGA	-	TFBGA	TFBGA	-	-
Encapsulate equivalent code	BGA84,9X15,32	BGA84,9X15,32	-	BGA84,9X15,32	BGA84,9X15,32	-	-
Package shape	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	-	-
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	-	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	-	-
Peak Reflow Temperature (Celsius)	260	260	-	260	NOT SPECIFIED	-	-
power supply	1.8 V	1.8 V	-	1.8 V	1.8 V	-	-
Certification status	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	-	-
refresh cycle	8192	8192	-	8192	8192	-	-
Maximum seat height	1.2 mm	1.2 mm	-	1.2 mm	1.2 mm	-	-
self refresh	YES	YES	-	YES	YES	-	-
Continuous burst length	4,8	4,8	-	4,8	4,8	-	-
Maximum slew rate	0.37 mA	0.35 mA	-	0.43 mA	0.35 mA	-	-
Maximum supply voltage (Vsup)	1.9 V	1.9 V	-	1.9 V	1.9 V	-	-
Minimum supply voltage (Vsup)	1.7 V	1.7 V	-	1.7 V	1.7 V	-	-
Nominal supply voltage (Vsup)	1.8 V	1.8 V	-	1.8 V	1.8 V	-	-
surface mount	YES	YES	-	YES	YES	-	-
technology	CMOS	CMOS	-	CMOS	CMOS	-	-
Temperature level	OTHER	OTHER	-	OTHER	OTHER	-	-
Terminal form	BALL	BALL	-	BALL	BALL	-	-
Terminal pitch	0.8 mm	0.8 mm	-	0.8 mm	0.8 mm	-	-
Terminal location	BOTTOM	BOTTOM	-	BOTTOM	BOTTOM	-	-
Maximum time at peak reflow temperature	40	40	-	40	NOT SPECIFIED	-	-
width	11 mm	11 mm	-	11 mm	11 mm	-	-

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