M38510/11401BGX datasheet, PDF

Datasheet> All Categories > Analog mixed-signal IC> Amplifier circuit> M38510/11401BGX

M38510/11401BGX: DescriptionOperational Amplifier, 1 Func, 7000uV Offset-Max, MBCY8, METAL CAN-8; CategoryAnalog mixed-signal IC Amplifier circuit; File Size200KB，23 Pages; ManufacturerPrecision Monolithics Inc

Download Datasheet Parametric View All

M38510/11401BGX Overview

Operational Amplifier, 1 Func, 7000uV Offset-Max, MBCY8, METAL CAN-8

M38510/11401BGX Parametric

Parameter Name	Attribute value
Maker	Precision Monolithics Inc
package instruction	METAL CAN-8
Reach Compliance Code	unknown
Amplifier type	OPERATIONAL AMPLIFIER
Maximum input offset voltage	7000 µV
JESD-30 code	O-MBCY-W8
Negative supply voltage upper limit	-22 V
Nominal Negative Supply Voltage (Vsup)	-15 V
Number of functions	1
Number of terminals	8
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	METAL
Package shape	ROUND
Package form	CYLINDRICAL
Certification status	Not Qualified
Supply voltage upper limit	22 V
Nominal supply voltage (Vsup)	15 V
surface mount	NO
Temperature level	MILITARY
Terminal form	WIRE
Terminal location	BOTTOM

Preview

Download Datasheet

View All

INCH-POUND

MIL-M-38510/114B

20 August 2003

SUPERSEDING

MIL-M-38510/114A

09 November 1979

MILITARY SPECIFICATION

MICROCIRCUITS, LINEAR, BI-FET OPERATIONAL AMPLIFIERS, MONOLITHIC SILICON

Reactivated after 20 August 2003 and may be used for either new or existing design acquisitions.

This specification is approved for use by all Departments and Agencies of the Department of Defense.

The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF-38535.

1. SCOPE

1.1 Scope. This specification covers the detail requirements for monolithic silicon, BI-FET operational amplifier

microcircuit. Two product assurance classes and a choice of case outlines and lead finishes are provided and are

reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been superseded by

MIL-PRF-38535, (see 6.3)

1.2 Part number. The part number should be in accordance with MIL-PRF-38535, and as specified herein.

1.2.1 Device types. The device types are internally compensated and should be as follows:

Device type

Circuit

Operational amplifier, JFET input, low power

Operational amplifier, JFET input, wide band

Operational amplifier, JFET input, wide band, undercompensated

Operational amplifier, JFET input, low power, low offset

Operational amplifier, JFET input, wide band, low offset

Operational amplifier, JFET input, wide band, under compensated, low offset

1.2.2 Device class. The device class should be the product assurance level as defined in MIL-PRF-38535.

1.2.3 Case outline. The case outline should be as designated in MIL-STD-1835 and as follows:

Outline letter

Descriptive designator

MACY1-X8

GDFP1-F10 or CDFP2-F10

GDIP1-T8 or CDIP2-T8

Terminals

Package style

Can

Flat pack

Dual-in-line

Comments, suggestions, or questions on this document should be addressed to: Commander, Defense

Supply Center Columbus, ATTN: DSCC-VAS, 3990 East Broad St., Columbus, OH 43216-5000, or emailed

to linear@dscc.dla.mil. Since contact information can change, you may want to verify the currency of this

address information using the ASSIST Online database at www.dodssp.daps.mil.

AMSC N/A

DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.

FSC 5962

MIL-M-38510/114B

3. REQUIREMENTS

3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a

manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before

contract award (see 4.3 and 6.4).

3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as

specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the

QM plan shall not affect the form, fit, or function as described herein.

3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as

specified in MIL-PRF-38535 and herein.

3.3.1 Terminal connections. The terminal connections shall be as specified on figure 1.

3.3.2 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available to

the qualifying activity and the preparing activity (DSCC-VA) upon request.

3.3.3 Case outlines. The case outlines shall be as specified in 1.2.3.

3.4 Lead material and finish. The lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).

3.5 Electrical performance characteristics. The electrical performance characteristics are as specified in table I,

and apply over the full recommended ambient operating temperature range, unless otherwise specified.

3.5.1 Offset null circuits. The nulling inputs shall be capable of being nulled 1 mV beyond the specified offset

voltage limits for –55°C

≤

125°C using the circuit of figure 2.

3.5.2 Instability oscillations. The devices shall be free of oscillations when operated in the test circuits

of this specification.

3.6 Rebonding. Rebonding shall be in accordance with MIL-PRF-38535.

3.7 Electrical test requirements. Electrical test requirements for each device class shall be the subgroups

specified in table II. The electrical tests for each subgroup are described in table III.

3.8 Marking. Marking shall be in accordance with MIL-PRF-38535.

3.9 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group

number 49 (see MIL-PRF-38535, appendix A).

Recommended Resources

Single pulse signal generating circuit e

20W 40-500kHz power amplifier 03

Novel thyristor temperature control circuit

Roxy 2185 color TV protection circuit

Video amplifier circuit: TDA5112

Computer motherboard circuit diagram 830_38

A simple question about ad conversion: I want to use AD conversion to collect data with a sampling frequency of 1280 Hz, collect 128 points and process them, and then collect the next data after processing; Due to the high frequency requir...; zhijun0906 Microcontroller MCU

Want to develop an impact test system: Want to develop an impact test system Impact test monitoring system 89C51 single-chip computer system to display and control the analog and digital signals of the two channels collected by PCI in real...; alltest168 MCU

How to use a single chip microcomputer to control the conduction angle of the thyristor!!!: [img]http://image.baidu.com/i?ct=503316480&z=0&tn=baiduimagedetail&word=MOC3061&in=26629&cl=2&cm=1&sc=0&lm=-1&pn=34&rn=1&di=1797799616&ln=35[/img] As shown in the figure, how to control the conduction...; bestden Embedded System

[I contribute to the Xilinx Resource Center] Sample code (Xilinx_VHDL): Example Code (Xilinx_VHDL)...; wanghongyang FPGA/CPLD

A brief introduction to some basic knowledge related to lighting: [hide]1. Light The essence of light is electromagnetic waves, which is a very small part of the entire electromagnetic spectrum. Light is a form of energy; light is electromagnetic waves radiated to t...; 探路者 LED Zone

[Recruitment] Foreign company recruits smart card R&D engineer (Beijing): Bachelor degree or above, major in computer, electronic engineering, etc.? Proficient in VC, VB, C, C++, Java and assembly language for development? More than 2 years of development experience in the ...; yunfei1019 Embedded System

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components