FIFO, 2KX9, 50ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, DIP-28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Maxim |
| Parts packaging code | DIP |
| package instruction | 0.600 INCH, DIP-28 |
| Contacts | 28 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Maximum access time | 50 ns |
| Other features | RETRANSMIT |
| Maximum clock frequency (fCLK) | 15.38 MHz |
| period time | 65 ns |
| JESD-30 code | R-PDIP-T28 |
| JESD-609 code | e0 |
| length | 36.83 mm |
| memory density | 18432 bit |
| Memory IC Type | OTHER FIFO |
| memory width | 9 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 2048 words |
| character code | 2000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 2KX9 |
| Exportable | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum standby current | 0.002 A |
| Maximum slew rate | 0.12 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| DS2011-50 | DS2011D-50 | DS2011D-120 | DS2011-80 | DS2011R-65 | DS2011R-80 | DS2011D-65 | DS2011N-50 | |
|---|---|---|---|---|---|---|---|---|
| Description | FIFO, 2KX9, 50ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, DIP-28 | FIFO, 2KX9, 50ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, DIP-28 | FIFO, 2KX9, 120ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, DIP-28 | FIFO, 2KX9, 80ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, DIP-28 | FIFO, 2KX9, 65ns, Asynchronous, CMOS, PQCC32 | FIFO, 2KX9, 80ns, Asynchronous, CMOS, PQCC32, | FIFO, 2KX9, 65ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, DIP-28 | FIFO, 2KX9, 50ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, DIP-28 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | not_compliant | _compli | _compli | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| Maximum access time | 50 ns | 50 ns | 120 ns | 80 ns | 65 ns | 80 ns | 65 ns | 50 ns |
| Maximum clock frequency (fCLK) | 15.38 MHz | 15.38 MHz | 7.14 MHz | 10 MHz | 12.5 MHz | 10 MHz | 12.5 MHz | 15.38 MHz |
| JESD-30 code | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PQCC-J32 | R-PQCC-J32 | R-PDIP-T28 | R-PDIP-T28 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 18432 bit | 18432 bi | 18432 bi | 18432 bit | 18432 bit | 18432 bit | 18432 bit | 18432 bit |
| Memory IC Type | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO |
| memory width | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
| Number of terminals | 28 | 28 | 28 | 28 | 32 | 32 | 28 | 28 |
| word count | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
| character code | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C |
| organize | 2KX9 | 2KX9 | 2KX9 | 2KX9 | 2KX9 | 2KX9 | 2KX9 | 2KX9 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP | QCCJ | QCCJ | DIP | DIP |
| Encapsulate equivalent code | DIP28,.6 | DIP28,.3 | DIP28,.3 | DIP28,.6 | LDCC32,.5X.6 | LDCC32,.5X.6 | DIP28,.3 | DIP28,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.002 A | 0.002 A | 0.002 A | 0.002 A | 0.002 A | 0.002 A | 0.002 A | 0.002 A |
| Maximum slew rate | 0.12 mA | 0.12 mA | 0.12 mA | 0.12 mA | 0.12 mA | 0.12 mA | 0.12 mA | 0.12 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | YES | YES | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD | DUAL | DUAL |
| Parts packaging code | DIP | DIP | DIP | DIP | - | - | DIP | DIP |
| package instruction | 0.600 INCH, DIP-28 | 0.300 INCH, DIP-28 | 0.300 INCH, DIP-28 | 0.600 INCH, DIP-28 | - | - | 0.300 INCH, DIP-28 | 0.600 INCH, DIP-28 |
| Contacts | 28 | 28 | 28 | 28 | - | - | 28 | 28 |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | - | - | EAR99 | EAR99 |
| Other features | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | - | - | RETRANSMIT | RETRANSMIT |
| period time | 65 ns | 65 ns | 140 ns | 100 ns | - | - | 80 ns | - |
| length | 36.83 mm | 34.795 mm | 34.795 mm | 36.83 mm | - | - | 34.795 mm | 36.83 mm |
| Number of functions | 1 | 1 | 1 | 1 | - | - | 1 | 1 |
| Exportable | NO | NO | NO | NO | - | - | NO | NO |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - | - | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED |
| Maximum seat height | 5.08 mm | 4.572 mm | 4.572 mm | 5.08 mm | - | - | 4.572 mm | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | - | 5.5 V | - |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | - | 4.5 V | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED |
| width | 15.24 mm | 7.62 mm | 7.62 mm | 15.24 mm | - | - | 7.62 mm | 15.24 mm |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 | - |
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