DPSD4MX32RY5-DP-XX122I datasheet, PDF

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DPSD4MX32RY5-DP-XX122I: DescriptionSynchronous DRAM Module, 4MX32, CMOS, LEADLESS, STACK, TSOP-80; Categorystorage storage; File Size225KB，2 Pages; ManufacturerB&B Electronics Manufacturing Company

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DPSD4MX32RY5-DP-XX122I Overview

Synchronous DRAM Module, 4MX32, CMOS, LEADLESS, STACK, TSOP-80

DPSD4MX32RY5-DP-XX122I Parametric

Parameter Name	Attribute value
Maker	B&B Electronics Manufacturing Company
Parts packaging code	QMA
package instruction	,
Contacts	80
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	FOUR BANK PAGE BURST
Other features	AUTO/SELF REFRESH
JESD-30 code	R-XQMA-N80
memory density	134217728 bit
Memory IC Type	SYNCHRONOUS DRAM MODULE
memory width	32
Number of functions	1
Number of ports	1
Number of terminals	80
word count	4194304 words
character code	4000000
Operating mode	SYNCHRONOUS
organize	4MX32
Package body material	UNSPECIFIED
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified
self refresh	YES
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Terminal form	NO LEAD
Terminal location	QUAD

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4Mx32, 7.5 - 15ns, P12, M-Densus

30A225-02

128 Megabit Synchronous DRAM

DPSD4MX32RY5

High Density Memory Device

PRELIMINARY

PIN-OUT DIAGRAM

M-Densus

DESCRIPTION:

The

M-Densus

series is a family of interchangeable

memory modules. The 128 Megabit SDRAM is a member

of this family which utilizes the new and innovative space

saving TSOP stacking technology. The modules are

constructed with 4 Meg x 16 SDRAMs.

This 128 Megabit

M-Densus

module, DPSD4MX32RY5,

has been designed to allow 32 Output Data lines utilizing

two 4 Meg x 16 SDRAM TSOP monolithics. Utilizing this

M-Densus

family allows the memory board designer to

upgrade the memory in their products without redesigning

the memory board, thus saving time and money.

FEATURES:

•

Configuration Available:

4 Meg x 32 bit

•

Clock Frequency:

[1]

, 83

[1]

, 100, 125

[2]

, 133

[2]

MHz (max.)

•

PC100 and PC133 Compatable

•

3.3V Supply

•

LVTTL Compatible I/O

•

Four Bank Operation

•

Programmable Burst Type, Burst Length,

and CAS Latency

•

4096 Cycles / 64 ms

•

Auto and Self Refresh

•

Package: TSOP Leadless Stack

NOTES: [1] Available in Military and Industrial Temperature Ranges Only.

[2] Available in Commercial Temperature Range Only.

FUNCTIONAL BLOCK DIAGRAM

A0 - A11

BA0, BA1

DQ0 - DQ32

CAS

RAS

DQM0, DQM1

CKE

CLK

/ V

DDQ

/ V

SSQ

N.C.

PIN NAMES

Row Address:

A0 - A11

Column Address: A0 - A7

Bank Select Address

Data In / Data Out

Chip Select

Column Address Strobes

Row Address Enables

Data Write Enable

Data Inputs/Output Masks

Clock Enable

System Clock

Power Supply/Ground

Data Output Power/Ground

No Connect

30A225-02

REV. B

This document contains information on a product that is currently released

to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the

right to change products or specifications herein without prior notice.

DPSD4MX32RY5-DP-XX122I Related Products

	DPSD4MX32RY5-DP-XX122I	DPSD4MX32RY5-DP-XXP12M	DPSD4MX32RY5-DP-XXP12I	DPSD4MX32RY5-DP-XX122M	DPSD4MX32RY5-DP-XX102I	DPSD4MX32RY5-DP-XX102M	DPSD4MX32RY5-DP-XX152I	DPSD4MX32RY5-DP-XX152M
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Maker	B&B Electronics Manufacturing Company	B&B Electronics Manufacturing Company	B&B Electronics Manufacturing Company	B&B Electronics Manufacturing Company	B&B Electronics Manufacturing Company	B&B Electronics Manufacturing Company	B&B Electronics Manufacturing Company	B&B Electronics Manufacturing Company
Parts packaging code	QMA	QMA	QMA	QMA	QMA	QMA	QMA	QMA
Contacts	80	80	80	80	80	80	80	80
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
JESD-30 code	R-XQMA-N80	R-XQMA-N80	R-XQMA-N80	R-XQMA-N80	R-XQMA-N80	R-XQMA-N80	R-XQMA-N80	R-XQMA-N80
memory density	134217728 bit	134217728 bit	134217728 bit	134217728 bit	134217728 bit	134217728 bit	134217728 bit	134217728 bit
Memory IC Type	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE
memory width	32	32	32	32	32	32	32	32
Number of functions	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1
Number of terminals	80	80	80	80	80	80	80	80
word count	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words
character code	4000000	4000000	4000000	4000000	4000000	4000000	4000000	4000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
organize	4MX32	4MX32	4MX32	4MX32	4MX32	4MX32	4MX32	4MX32
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
self refresh	YES	YES	YES	YES	YES	YES	YES	YES
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD

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