SYS322000ZKI-020 datasheet, PDF

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SYS322000ZKI-020: DescriptionSRAM Module, 2MX32, 20ns, CMOS, PLASTIC, ZIP-72; Categorystorage storage; File Size178KB，8 Pages; ManufacturerMOSAIC; Websitehttp://www.mosaicsemi.com/

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SYS322000ZKI-020 Overview

SRAM Module, 2MX32, 20ns, CMOS, PLASTIC, ZIP-72

SYS322000ZKI-020 Parametric

Parameter Name	Attribute value
Maker	MOSAIC
Parts packaging code	ZIP
package instruction	,
Contacts	72
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	20 ns
JESD-30 code	R-XZMA-T72
memory density	67108864 bit
Memory IC Type	SRAM MODULE
memory width	32
Number of functions	1
Number of terminals	72
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2MX32
Package body material	UNSPECIFIED
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	THROUGH-HOLE
Terminal location	ZIG-ZAG

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2M x 32 SRAM MODULE

SYS322000ZK-015/020/025

11403 West Bernado Court, Suite 100, San Diego, CA 92127.

Tel No: (619) 674 2233, Fax No: (619) 674 2230

Issue 1.2 : April 1999

Features

•

Access Times of 15/20/25 ns.

72 Pin Zig-zag-In-line Package (ZIP).

5 Volt Supply ± 10%.

Operating Power (32bit mode)

7.60W (Max)

Standby Current (CMOS)

935mW (Max)

Completely Static Operation.

Equal Access and Cycle Times.

All Inputs and Outputs Directly TTL Compatible.

On-board Supply Decoupling Capacitors.

Description

The SYS322000ZK is a plastic 64Mbit Static

RAM Module offered in a low profile 72 pin ZIP

package, organised as 2M x 32. The module

utilises sixteen 512K x 8 SRAM's housed in

TSOP II packages, surface mounted onto a dual

FR4 epoxy PCB construction.

Four chip selects and the highest order address

line are used to independently enable the eight

bytes as well as the high or low block of

addressable memory space. Reading or Writing

is executed on individual or any combination of

multiple bytes.

The module also incorporates on-board

decoupling.

Block Diagram

See page 7.

Pin Definition

TOP VIEW

PD4

PD1

VCC

A14

CS1

CS3

A16

GND

D16

D17

D18

D19

A10

A11

A12

A13

D20

D21

D22

D23

GND

A19

PD3

GND

PD2

D10

D11

D12

D13

D14

D15

GND

A15

CS2

CS4

A17

D24

D25

D26

D27

VCC

D28

D29

D30

D31

A18

A20

Pin Functions

Address Inputs

Data Input/Output

Chip Selects

Write Enable

Output Enable

No Connect

Power (+5V)

Ground

A0 - A20

D0 - D31

CS1~4

GND

Package Details

Plastic 72 Pin ZIP

PD2 = PD3 = GND

PD1 = PD4 = OPEN

SYS322000ZKI-020 Related Products

	SYS322000ZKI-020	SYS322000ZK-015	SYS322000ZK-020	SYS322000ZK-025	SYS322000ZKI-015	SYS322000ZKI-025
Description	SRAM Module, 2MX32, 20ns, CMOS, PLASTIC, ZIP-72	SRAM Module, 2MX32, 15ns, CMOS, PLASTIC, ZIP-72	SRAM Module, 2MX32, 20ns, CMOS, PLASTIC, ZIP-72	SRAM Module, 2MX32, 25ns, CMOS, PLASTIC, ZIP-72	SRAM Module, 2MX32, 15ns, CMOS, PLASTIC, ZIP-72	SRAM Module, 2MX32, 25ns, CMOS, PLASTIC, ZIP-72
Maker	MOSAIC	MOSAIC	MOSAIC	MOSAIC	MOSAIC	MOSAIC
Parts packaging code	ZIP	ZIP	ZIP	ZIP	ZIP	ZIP
Contacts	72	72	72	72	72	72
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	20 ns	15 ns	20 ns	25 ns	15 ns	25 ns
JESD-30 code	R-XZMA-T72	R-XZMA-T72	R-XZMA-T72	R-XZMA-T72	R-XZMA-T72	R-XZMA-T72
memory density	67108864 bit	67108864 bit	67108864 bit	67108864 bit	67108864 bit	67108864 bit
Memory IC Type	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE
memory width	32	32	32	32	32	32
Number of functions	1	1	1	1	1	1
Number of terminals	72	72	72	72	72	72
word count	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words
character code	2000000	2000000	2000000	2000000	2000000	2000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	70 °C	70 °C	85 °C	85 °C
organize	2MX32	2MX32	2MX32	2MX32	2MX32	2MX32
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal location	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG

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