P6KE SERIES
GLASS PASSIVATED JUNCTION TRAN-
SIENT VOLTAGE SUPPRESSOR
CHENG- YI
ELECTRONIC
VOLTAGE 6.8 to 440 VOLTS
600 WATT PEAK POWER
5.0 WATTS STEADY STATE
DO-15
FEATURES
Plastic package has Underwrites Laboratory
Flammability Classification 94V-O
Glass passivated chip junction in DO-15 package
400W surge capability at 1 ms
Excellent clamping capability
Low zener impedance
Fast response time: typically less than 1.0 ps
from 0 volts to BV min.
Typical I
R
less than 1 A above 10V
High tempreature soldering guaranteed:
260
0
C/10 seconds /.375",(9.5mm)
lead length/51bs.,(2.3kg) tension
MECHANICAL DATA
Case:JEDEC DO-15 Molded plastic
Terminals:Plated Axial leads, solderable per MIL-STD-202, Method 208
Polarity:Color band denotes cathode except Bipolar
Mounting Position:Any
Weight:0.015 ounce, 0.4 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25
0
C ambient temperature unless otherwise specified.
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
RATINGS
Peak Pulse Power Dissipation at T
A
=25
0
C, T
P
=1ms
(NOTE 1)
Steady Power Dissipation at T
L
=75
0
C
Lead Lengths .375",(9.5mm)
(NOTE 2)
Peak Forward Surge Current 8.3ms Single Half Sine-Wave
Superimposed on Rated Load(JEDEC Method)
(NOTE 3)
Operating Junction and Storage Temperature Range
SYMBOL
P
PK
P
D
VALUE
Minimum 6000
5.0
UNITS
Watts
Watts
Amps
0
I
FSM
T
J
, T
STG
100
-65 to + 175
C
Notes: 1. Non-repetitive current pulse, per Fig.3 and derated above T
A
=25
0
C per Fig.2
2. Measured on copper Leaf area of 1.57 in
2
(40mm
2
)
3. 8.3mm single half sine-wave, duty cycle=4 pulses minutes maximum.
P6KE SERIES
GLASS PASSIVATED JUNCTION TRAN-
SIENT VOLTAGE SUPPRESSOR
CHENG- YI
ELECTRONIC
RATING AND CHARACTERISTICS CURVES
P6KE SERIES
Fig. 1 - PEAK PULSE POWER VS PULSE TIME
PEAK PULSE POWER (P
PP
) OR CURRENT (l
PP
)
DERATING PERCENTAGE %
100
Fig. 2 - PULSE DERATING CURVE
P
PPM
, PEAK PULSE POWER, kW
100
Non-Repetitive
Pulse waveform
Shown in Flgure 3
T
A
=25
0
C
75
10
50
1.0
25
0.1
0.1 s
1.0 s
10 s
100 s
1.0ms
10ms
0
0
25
50
75
100
125
150
175
200
td, PULSE WIDTH,
SEC
T
A
, AMBIENT TEMPERATURE,
0
C
Fig. 3 - PULSE WAVEFORM
150
Fig. 4 - TYPICAL JUNCTION CAPACIT
ANCE
UNIDIRECTIONAL
6,000
4,000
0
TJ=25C
f=1.0MHz
Vsig=50mVp-p
I
PPM
, PEAK PULSE CURRENT, %
tf=10 se
Peak Value
Ippm
T
A
=25
0
C
Pulse Width (td) is Defined
as the Poitn Where the Peak
Current Decays to 50% of Ipp
2,000
Measursd at
Zero Bias
100
CJ, CAPACITANCE, pF
Half Value-Ipp
2
50
10/1000 sec Waveform
as Defined by R.E.A
1,000
800
600
400
200
100
80
60
40
20
Measursd at
Stand-Off
Voltage(V
MW
)
0
0
td
1.0
2.0
E-kt
3.0
4.0
t, TIME, ms
Pm
(AV)
STEADY STATE POWER DISSIPATION, WATTS
Fig. 5 - STEADY STATE POWER
DERATING CURVE
5.00
10
1.0
2.0
10 20
100 200
V(
WM
), REVERSE STAND-OFF VOLT
AGE,
VOLTS
Fig. 6 - MAXIMUM NON-REPETITIVE
3.75
PEAK FORWARD SURGE CURRENT
I
FSM
, PEAK FORWARD SURGE CURRENT
AMPERES
200
TJ=TJ max
2.50
l
=375"(9.5mm)
100
8.3ms Single Half Sine Wave
JEDEC Method
1.25
20mmx20mmx1mm
Copper Heat Sinks
(0.8"x0.8"x.040")
50
0
0
25
50
75
100
125
0
150
175
200
T
L
, LEAD TEMPERATURE, C
10
1
5
10
50
100
NUMBER OF CYCLES AT 60 Hz
Microchip MCU
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