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DPS512X16BY3-30I

Description
SRAM Module, 1MX8, 30ns, CMOS, CQCC48, LEADLESS, SLCC-48
Categorystorage    storage   
File Size840KB,10 Pages
ManufacturerB&B Electronics Manufacturing Company
Download Datasheet Parametric View All

DPS512X16BY3-30I Overview

SRAM Module, 1MX8, 30ns, CMOS, CQCC48, LEADLESS, SLCC-48

DPS512X16BY3-30I Parametric

Parameter NameAttribute value
MakerB&B Electronics Manufacturing Company
Parts packaging codeLCC
package instructionAQCCN,
Contacts48
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time30 ns
Other featuresUSER CONFIGURABLE AS 512K X 16
JESD-30 codeR-CQCC-N48
length22.098 mm
memory density8388608 bit
Memory IC TypeSRAM MODULE
memory width8
Number of functions1
Number of ports1
Number of terminals48
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize1MX8
Output characteristics3-STATE
ExportableYES
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeAQCCN
Package shapeRECTANGULAR
Package formCHIP CARRIER, PIGGYBACK
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height17.9578 mm
Minimum standby current2 V
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
width12.7 mm
8 Megabit High Speed CMOS SRAM
DPS512X16Cn3/DPS512X16Bn3
DESCRIPTION:
The DPS512X16Cn3/DPS512X16Bn3 High Speed SRAM ‘’STACK’’
modules are a revolutionary new memory subsystem using Dense-Pac
Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC).
Available in straight leaded, ‘’J’’ leaded or gullwing leaded packages,
or mounted on a 50-pin PGA co-fired ceramic substrate. The module
packs 8-Megabits of low-power CMOS static RAM in an area as small
as 0.463 in
2
, while maintaining a total height as low as 0.705 inches.
The DPS512X16Cn3/DPS512X16Bn3 STACK modules contain eight
individual 128K x 8 SRAMs, each packaged in a hermetically sealed
SLCC, making the modules suitable for commercial, industrial and
military applications.
The DPS512X16Bn3 has one active low Chip Enable (CE) and while
the DPS512X16Cn3 an active low Chip Enable (CE) and an active high
Select Line (SEL).
By using SLCCs, the ‘’Stack’’ family of modules offer a higher board
density of memory than available with conventional through-hole,
surface mount or hybrid techniques.
SLCC Stack
Straight Leaded
Stack
FEATURES:
Organizations Available: 512Kx16 or 1024Kx8
Access Times: 20*, 25, 30, 35, 45ns
Fully Static Operation - No clock or refresh required
Single +5V Power Supply,
±
10% Tolerance
TTL Compatible
Common Data Inputs and Outputs
Low Data Retention Voltage: 2.0V min.
Packages Available:
48 - Pin SLCC Stack
48 - Pin Straight Leaded Stack
48 - Pin ‘’J’’ Leaded Stack
48 - Pin Gullwing Leaded Stack
50 - Pin PGA Dense-Stack
‘’J’’ Leaded
Stack
*
Commercial only.
Dense-Stack
Gullwing
Leaded Stack
30A097-38
REV. D
This document contains information on a product that is currently released
to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the
right to change products or specifications herein without prior notice.
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