D ts e t
aa h e
R c e t r lc r nc
o h se Ee to is
Ma u a t r dCo o e t
n fc u e
mp n n s
R c e tr b a d d c mp n ns ae
o h se rn e
o oet r
ma ua trd u ig ete dewaes
n fcue sn i r i/ fr
h
p rh s d f m te oiia s p l r
uc a e r
o h r n l u pi s
g
e
o R c e tr waes rce td f m
r o h se
fr e rae r
o
te oiia I. Al rce t n ae
h
r nl P
g
l e rai s r
o
d n wi tea p o a o teOC
o e t h p rv l f h
h
M.
P r aetse u igoiia fcoy
at r e td sn r n la tr
s
g
ts p o rmso R c e tr e eo e
e t rga
r o h se d v lp d
ts s lt n t g aa te p o u t
e t oui s o u rne
o
rd c
me t o e c e teOC d t s e t
es r x e d h
M aa h e.
Qu l yOv riw
ai
t
e ve
• IO- 0 1
S 90
•A 92 cr ct n
S 1 0 et ai
i
o
• Qu l e Ma ua trr Ls (
ai d
n fcues it QML MI- R -
) LP F
385
53
•C a sQ Mitr
ls
lay
i
•C a sVS a eL v l
ls
p c ee
• Qu l e S p l r Ls o D sr uos( L )
ai d u pi s it f it b tr QS D
e
i
•R c e trsacic l u pir oD A a d
o h se i
r ia s p l t L n
t
e
me t aln u t a dD A sa d r s
es lid sr n L tn ad .
y
R c e tr lcrnc , L i c mmi e t
o h se Ee t is L C s o
o
tdo
t
s p ligp o u t ta s t f c so r x e t-
u pyn rd cs h t ai y u tme e p ca
s
t n fr u lya daee u loto eoiial
i s o q ai n r q a t h s r n l
o
t
g
y
s p l db id sr ma ua trr.
u pi
e yn ut
y n fcues
T eoiia ma ua trr d ts e t c o a yn ti d c me t e e t tep r r n e
h r n l n fcue’ aa h e a c mp n ig hs o u n r cs h ef ma c
g
s
o
a ds e ic t n o teR c e tr n fcue v rino ti d vc . o h se Ee t n
n p c ai s f h o h se ma ua trd eso f hs e ie R c e tr lcr -
o
o
isg aa te tep r r n eo i s mio d co p o u t t teoiia OE s e ic -
c u rne s h ef ma c ft e c n u tr rd cs o h r n l M p c a
o
s
g
t n .T pc lv le aefr eee c p r o e o l. eti mii m o ma i m rt g
i s ‘y ia’ au s r o rfrn e up s s ny C r n nmu
o
a
r xmu ai s
n
ma b b s do p o u t h rceiain d sg , i lt n o s mpetsig
y e a e n rd c c aa tr t , e in smuai , r a l e t .
z o
o
n
© 2 1 R cetr l t n s LC Al i t R sre 0 1 2 1
0 3 ohs E cr i , L . lRg s eevd 7 1 0 3
e e oc
h
T l r m r, l s v iw wrcl . m
o e n oe p ae it w . e c o
a
e
s
o ec
MC74LCX08
Low−Voltage CMOS Quad
2−Input AND Gate
With 5 V−Tolerant Inputs
The MC74LCX08 is a high performance, quad 2−input AND gate
operating from a 2.3 to 3.6 V supply. High impedance TTL compatible
inputs significantly reduce current loading to input drivers while TTL
compatible outputs offer improved switching noise performance. A V
I
specification of 5.5 V allows MC74LCX08 inputs to be safely driven
from 5.0 V devices.
Current drive capability is 24 mA at the outputs.
Features
http://onsemi.com
MARKING
DIAGRAMS
14
14
1
SOIC−14
D SUFFIX
CASE 751A
1
LCX08
AWLYWW
•
•
•
•
•
•
Designed for 2.3 V to 3.6 V V
CC
Operation
5.0 V Tolerant Inputs − Interface Capability With 5.0 V TTL Logic
LVTTL Compatible
LVCMOS Compatible
24 mA Balanced Output Sink and Source Capability
14
1
TSSOP−14
DT SUFFIX
CASE 948G
14
LCX
08
ALYW
1
Near Zero Static Supply Current (10
mA)
Substantially Reduces
System Power Requirements
•
Latchup Performance Exceeds 500 mA
•
ESD Performance:
Human Body Model >2000 V
Machine Model >200 V
•
Pb−Free Packages are Available*
14
1
SOEIAJ−14
M SUFFIX
CASE 965
14
74LCX08
ALYW
1
A
L, WL
Y
W, WW
=
=
=
=
Assembly Location
Wafer Lot
Year
Work Week
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2005
1
May, 2005 − Rev. 6
Publication Order Number:
MC74LCX08/D
MC74LCX08
V
CC
14
A2
13
B2
12
O2
11
A3
10
B3
9
O3
8
A0
B0
A1
B1
A2
B2
1
A0
2
B0
3
O0
4
A1
5
B1
6
O1
7
GND
A3
B3
1
3
2
4
6
5
13
11
12
10
8
9
O3
O2
O1
O0
Figure 1. Pinout: 14−Lead
(Top View)
Figure 2. Logic Diagram
PIN NAMES
Pins
An, Bn
On
Function
Data Inputs
Outputs
TRUTH TABLE
Inputs
An
L
L
H
H
Bn
L
H
L
H
Outputs
On
L
L
L
H
H = High Voltage Level
L = Low Voltage Level
For I
CC
reasons, DO NOT FLOAT Inputs
MAXIMUM RATINGS
Symbol
V
CC
V
I
V
O
I
IK
I
OK
Parameter
DC Supply Voltage
DC Input Voltage
DC Output Voltage
DC Input Diode Current
DC Output Diode Current
Value
−0.5 to +7.0
−0.5
≤
V
I
≤
+7.0
−0.5
≤
V
O
≤
V
CC
+ 0.5
−50
−50
+50
I
O
I
CC
I
GND
T
STG
DC Output Source/Sink Current
DC Supply Current Per Supply Pin
DC Ground Current Per Ground Pin
Storage Temperature Range
±50
±100
±100
−65 to +150
Output in HIGH or LOW State (Note 1)
V
I
< GND
V
O
< GND
V
O
> V
CC
Condition
Unit
V
V
V
mA
mA
mA
mA
mA
mA
°C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. I
O
absolute maximum rating must be observed.
http://onsemi.com
2
MC74LCX08
RECOMMENDED OPERATING CONDITIONS
Symbol
V
CC
V
I
V
O
I
OH
Supply Voltage
Input Voltage
Output Voltage
HIGH Level Output Current
(HIGH or LOW State)
(3−State)
V
CC
= 3.0 V − 3.6 V
V
CC
= 2.7 V − 3.0 V
V
CC
= 2.3 V − 2.7 V
V
CC
= 3.0 V − 3.6 V
V
CC
= 2.7 V − 3.0 V
V
CC
= 2.3 V − 2.7 V
−40
0
Parameter
Operating
Data Retention Only
Min
2.0
1.5
0
0
Type
2.5, 3.3
2.5, 3.3
Max
3.6
3.6
5.5
V
CC
−24
−12
−8
+24
+12
+8
+85
10
Unit
V
V
V
mA
I
OL
LOW Level Output Current
mA
T
A
Dt/DV
Operating Free−Air Temperature
Input Transition Rise or Fall Rate, V
IN
from 0.8 V to 2.0 V, V
CC
= 3.0 V
°C
ns/V
DC ELECTRICAL CHARACTERISTICS
T
A
= −40°C to +85°C
Symbol
V
IH
Characteristic
HIGH Level Input Voltage (Note 2)
Condition
2.3 V
≤
V
CC
≤
2.7 V
2.7 V
≤
V
CC
≤
3.6 V
V
IL
LOW Level Input Voltage (Note 2)
2.3 V
≤
V
CC
≤
2.7 V
2.7 V
≤
V
CC
≤
3.6 V
V
OH
HIGH Level Output Voltage
2.3 V
≤
V
CC
≤
3.6 V; I
OH
= −100
mA
V
CC
= 2.3 V; I
OH
= −8 mA
V
CC
= 2.7 V; I
OH
= −12 mA
V
CC
= 3.0 V; I
OH
= −18 mA
V
CC
= 3.0 V; I
OH
= −24 mA
V
OL
LOW Level Output Voltage
2.3 V
≤
V
CC
≤
3.6 V; I
OL
= 100
mA
V
CC
= 2.3 V; I
OL
= 8 mA
V
CC
= 2.7 V; I
OL
= 12 mA
V
CC
= 3.0 V; I
OL
= 16 mA
V
CC
= 3.0 V; I
OL
= 24 mA
I
I
I
CC
Input Leakage Current
Quiescent Supply Current
2.3 V
≤
V
CC
≤
3.6 V; 0 V
≤
V
I
≤
5.5 V
2.3
≤
V
CC
≤
3.6 V; V
I
= GND or V
CC
2.3
≤
V
CC
≤
3.6 V; 3.6
≤
V
I
or V
O
≤
5.5 V
DI
CC
Increase in I
CC
per Input
2.3
≤
V
CC
≤
3.6 V; V
IH
= V
CC
− 0.6 V
2. These values of V
I
are used to test DC electrical characteristics only.
V
CC
− 0.2
1.8
2.2
2.4
2.2
0.2
0.6
0.4
0.4
0.55
±5
10
±10
500
mA
mA
mA
V
Min
1.7
2.0
0.7
0.8
V
V
Max
Unit
V
http://onsemi.com
3
MC74LCX08
AC CHARACTERISTICS
t
R
= t
F
= 2.5 ns; R
L
= 500
W
Limits
T
A
= −40°C to +85°C
V
CC
= 3.3 V
±
0.3 V
C
L
= 50 pF
Symbol
t
PLH
t
PHL
t
OSHL
t
OSLH
Parameter
Propagation Delay Time
Input to Output
Output−to−Output Skew
(Note 3)
Waveform
1
Min
1.5
1.5
Max
5.5
5.5
1.0
1.0
V
CC
= 2.7 V
C
L
= 50 pF
Min
1.5
1.5
Max
6.2
6.2
V
CC
= 2.5 V
±
0.2 V
C
L
= 30 pF
Min
1.5
1.5
Max
6.6
6.6
ns
Unit
ns
3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (t
OSHL
) or LOW−to−HIGH (t
OSLH
); parameter
guaranteed by design.
DYNAMIC SWITCHING CHARACTERISTICS
T
A
= +25°C
Symbol
V
OLP
Characteristic
Dynamic LOW Peak Voltage
(Note 4)
V
OLV
Dynamic LOW Valley Voltage
(Note 4)
Condition
V
CC
= 3.3 V, C
L
= 50 pF, V
IH
= 3.3 V, V
IL
= 0 V
V
CC
= 2.5 V, C
L
= 30 pF, V
IH
= 2.5 V, V
IL
= 0 V
V
CC
= 3.3 V, C
L
= 50 pF, V
IH
= 3.3 V, V
IL
= 0 V
V
CC
= 2.5 V, C
L
= 30 pF, V
IH
= 2.5 V, V
IL
= 0 V
Min
Typ
0.8
0.6
−0.8
−0.6
Max
Unit
V
V
V
V
4. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is
measured in the LOW state.
CAPACITIVE CHARACTERISTICS
Symbol
C
IN
C
OUT
C
PD
Parameter
Input Capacitance
Output Capacitance
Power Dissipation Capacitance
Condition
V
CC
= 3.3 V, V
I
= 0 V or V
CC
V
CC
= 3.3 V, V
I
= 0 V or V
CC
10 MHz, V
CC
= 3.3 V, V
I
= 0 V or V
CC
Typical
7
8
25
Unit
pF
pF
pF
ORDERING INFORMATION
Device
MC74LCX08D
MC74LCX08DG
MC74LCX08DR2
MC74LCX08DR2G
MC74LCX08DT
MC74LCX08DTG
MC74LCX08DTR2
MC74LCX08DTR2G
MC74LCX08M
MC74LCX08MEL
MC74LCX08MELG
Package
SOIC−14
SOIC−14
(Pb−Free)
SOIC−14
SOIC−14
(Pb−Free)
TSSOP−14*
TSSOP−14*
TSSOP−14*
TSSOP−14*
SOEIAJ−14
SOEIAJ−14
SOEIAJ−14
(Pb−Free)
Shipping
†
55 Units / Rail
55 Units / Rail
2500 Tape & Reel
2500 Tape & Reel
96 Units / Rail
96 Units / Rail
2500 Tape & Reel
2500 Tape & Reel
50 Units / Rail
2000 Tape & Reel
2000 Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
http://onsemi.com
4