CYStech Electronics Corp.
NPN Epitaxial Planar Transistor
Spec. No. : C823A3
Issued Date : 2006.10.16
Revised Date :
Page No. : 1/5
BTN6718A3
Description
The BTN6718A3 is designed for general purpose medium power amplifier and switching applications.
Features
•
Low collector saturation voltage
•
High breakdown voltage, V
CEO
=100V (min.)
•
High collector current, I
C(max)
=1A (DC)
•
Pb-free package
Symbol
BTN6718A3
Outline
TO-92
B：Base
C：Collector
E：Emitter
ECB
Absolute Maximum Ratings
(Ta=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current (DC)
Collector Current (Pulse)
Power Dissipation
Thermal Resistance, Junction to Ambient
Junction Temperature
Storage Temperature
Note : Pulse test, P
W
≤
10ms, Duty
≤
50%.
Symbol
V
CBO
V
CEO
V
EBO
I
C
I
CP
P
D
R
θJA
Tj
Tstg
Limits
100
100
5
1
2
(Note)
850
147
150
-55~+150
Unit
V
V
V
A
A
mW
°C/W
°C
°C
BTN6718A3
CYStek Product Specification
CYStech Electronics Corp.
Characteristics
(Ta=25°C)
Symbol
BV
CBO
BV
CEO
BV
EBO
I
CBO
I
EBO
*V
CE(SAT)
*h
FE
1
*h
FE
2
*h
FE
3
f
T
Cob
Min.
100
100
5
-
-
-
90
100
20
50
-
Typ.
-
-
-
-
-
-
-
-
-
-
-
Max.
-
-
-
100
100
350
-
300
-
-
20
Unit
V
V
V
nA
nA
mV
-
-
-
MHz
pF
Spec. No. : C823A3
Issued Date : 2006.10.16
Revised Date :
Page No. : 2/5
Test Conditions
I
C
=100μA
I
C
=1mA
I
E
=10μA
V
CB
=80V, I
E
=0
V
EB
=4V, I
C
=0
I
C
=350mA, I
B
=35mA
V
CE
=1V, I
C
=50mA
V
CE
=1V, I
C
=250mA
V
CE
=1V, I
C
=500mA
V
CE
=10V, I
C
=50mA, f=100MHz
V
CB
=10V, I
E
=0A, f=1MHz
*Pulse Test: Pulse Width
≤380
μ
s, Duty Cycle≤2%
Ordering Information
Device
BTN6718A3
Package
TO-92
(Pb-free)
Shipping
2000 pcs / Tape & Box
Marking
N6718
BTN6718A3
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves
Current Gain vs Collector Current
1000
1000
VCE(SAT)
Current Gain---HFE
VCE=2V
Spec. No. : C823A3
Issued Date : 2006.10.16
Revised Date :
Page No. : 3/5
Saturation Voltage vs Collector Current
Saturation Voltage-(mV)
IC=40IB
100
VCE=1V
100
IC=20IB
IC=10IB
10
1
10
100
1000
10000
Collector Current ---IC(mA)
10
1
10
100
1000
10000
Collector Current ---IC(mA)
Saturation Voltage vs Collector Current
10000
VBESAT@IC=10IB
1000
Power Derating Curve
Power Dissipation-PD(mW)
Saturation Voltage-(mV)
800
600
400
1000
200
100
1
10
100
1000
10000
Collector Current ---IC(mA)
0
0
50
100
150
200
Ambient Temperature ---TA(℃)
BTN6718A3
CYStek Product Specification
CYStech Electronics Corp.
TO-92 Taping Outline
H2A H2A
D2
Spec. No. : C823A3
Issued Date : 2006.10.16
Revised Date :
Page No. : 4/5
H2
H2
A
H3
H4 H
L
L1
H1
F1F2
T2
T
T1
P1
P
P2
D1
D
W1
W
DIM
A
D
D1
D2
F1,F2
F1,F2
H
H1
H2
H2A
H3
H4
L
L1
P
P1
P2
T
T1
T2
W
W1
-
Item
Component body height
Tape Feed Diameter
Lead Diameter
Component Body Diameter
Component Lead Pitch
F1-F2
Height Of Seating Plane
Feed Hole Location
Front To Rear Deflection
Deflection Left Or Right
Component Height
Feed Hole To Bottom Of Component
Lead Length After Component Removal
Lead Wire Enclosure
Feed Hole Pitch
Center Of Seating Plane Location
4 Feed Hole Pitch
Over All Tape Thickness
Total Taped Package Thickness
Carrier Tape Thickness
Tape Width
Adhesive Tape Width
20 pcs Pitch
Millimeters
Min.
4.33
3.80
0.36
4.33
2.40
-
15.50
8.50
-
-
-
-
-
2.50
12.50
5.95
50.30
-
-
0.36
17.50
5.00
253
Max.
4.83
4.20
0.53
4.83
2.90
±0.3
16.50
9.50
1
1
27
21
11
-
12.90
6.75
51.30
0.55
1.42
0.68
19.00
7.00
255
BTN6718A3
CYStek Product Specification
CYStech Electronics Corp.
TO-92 Dimension
Marking:
Spec. No. : C823A3
Issued Date : 2006.10.16
Revised Date :
Page No. : 5/5
A
B
1
2
3
α
2
N6718
α
3
C
D
H
I
E
F
G
α
1
Style: Pin 1.Emitter 2.Collector 3.Base
3-Lead TO-92 Plastic Package
CYStek Package Code: A3
*: Typical
DIM
A
B
C
D
E
F
Inches
Min.
Max.
0.1704 0.1902
0.1704 0.1902
0.5000
-
0.0142 0.0220
-
*
0.0500
0.1323 0.1480
Millimeters
Min.
Max.
4.33
4.83
4.33
4.83
12.70
-
0.36
0.56
-
*
1.27
3.36
3.76
DIM
G
H
I
α1
α2
α3
Inches
Min.
Max.
0.0142 0.0220
-
*
0.1000
-
*
0.0500
-
*
5°
-
*
2°
-
*
2°
Millimeters
Min.
Max.
0.36
0.56
-
*
2.54
-
*
1.27
-
*
5°
-
*
2°
-
*
2°
Notes:
1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
•
Lead: 42 Alloy ; solder plating
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTN6718A3
CYStek Product Specification
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