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SKY77607

Description
Multiband Multimode Power Amplifier Module for Quad-Band GSM / EDGE and Dual-Band (Band I and VIII) WCDMA / HSDPA / HSUPA / HSPA+ Handsets
File Size106KB,3 Pages
ManufacturerSkyworks
Websitehttp://www.skyworksinc.com
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SKY77607 Overview

Multiband Multimode Power Amplifier Module for Quad-Band GSM / EDGE and Dual-Band (Band I and VIII) WCDMA / HSDPA / HSUPA / HSPA+ Handsets

PRODUCT SUMMARY
SKY77607 Multiband Multimode Power Amplifier Module for
Quad-Band GSM / EDGE and Dual-Band (Band I and VIII)
WCDMA / HSDPA / HSUPA / HSPA+ Handsets
Applications
Quad-band cellular handsets:
-
Class 4 GSM850 / EGSM900
-
Class 1 DCS1800 / PCS1900
-
Class E2 GSM850 / EGSM900 / DCS1800 / PCS1900
-
Class 12 multi-slot EGPRS
-
Multi-band 3G handsets
-
Broadband WCDMA/HSDPA/HSUPA-modulated handsets –
Bands I, VIII
Description
Skyworks SKY77607 is a hybrid multimode, multiband Power
Amplifier Module (PAM) that supports 2.5G and 3G handsets, and
operates efficiently in GSM, EGPRS, EDGE and WCDMA modes.
The PAM consists of a GSM800/EGSM900 PA block, a
DCS1800/PCS1900 PA block, separate blocks for WCDMA
operating in low / high bands, RF I/O ports internally matched to
50
Ω
to reduce the number of external components, a logic
control block for multiple power control levels and band enable
functions in both cellular and UMTS. Extremely low leakage
current maximizes handset standby time.
GSM/EDGE:
The SKY77607 uses a new compact architecture to
support GSM850, EGSM900, DCS1800 and PCS1900 bands. The
PAM also supports 2.5G Class 12 Enhanced General Packet Radio
Service (EGPRS) multi-slot operation and EDGE linear modulation.
WCDMA:
The SKY77607 uses Load Insensitive Power Amplifier
(LIPA) circuitry to support WCDMA, High-Speed Downlink Packet
Access (HSDPA), and High-Speed Uplink Packet Access (HSUPA)
modulations at moderate antenna Voltage Standing-Wave Ratio
(VSWR). This functionality covers multiple bands for 3GPP,
including bands I, VIII, and operates at different power modes.
The module is fully controllable via three line logic and band
enable interfaces. The InGaP/GaAs die and passive components
are mounted on a multi-layer laminate substrate and the
assembly encapsulated with plastic overmold. The SKY77607
Surface-Mounted Technology (SMT) package offers for a highly
manufacturable, low-cost solution.
Figure 1 shows a functional block diagram and Figure 2 shows
the pad locations.
Features
Hybrid module architecture, w/ separate GSM, WCDMA paths
50
Ω
I/O impedances, integrated DC blocking all ports
Separate single-ended I/O for GSM and WCDMA
Integrated coupler w/ coupled and isolated ports for 3G band
operation
CMOS-compatible three-line logic input, HB enable / LB enable
Both 3G VCC stages can attach to battery or buck DC/DC
Ultra-compact low profile package
-
5 mm x 7 mm x 0.9 mm
-
24-pad configuration
2.5G Features
-
GPRS Class 12 multi-slot operation
-
Three level RF Pout control using digital logic interface.
-
Linear PA with bias optimization for efficiency/linearity
tradeoff in 8PSK mode
3G Features
-
WCDMA mode supports output power, bandwidth for bands
I, VIII
-
Two level P
OUT
RF P
OUT
control using digital logic interface
-
Linear balanced with bias optimization, low/high mode gain
switch for best efficiency / linearity trade-off
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
201239A • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • February 8, 2010
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