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CRZ30TE85L

Description
DIODE 30 V, 0.7 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, 3-2A1A, 2 PIN, Voltage Regulator Diode
CategoryDiscrete semiconductor    diode   
File Size163KB,5 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
Download Datasheet Parametric View All

CRZ30TE85L Overview

DIODE 30 V, 0.7 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, 3-2A1A, 2 PIN, Voltage Regulator Diode

CRZ30TE85L Parametric

Parameter NameAttribute value
MakerToshiba Semiconductor
package instructionR-PDSO-F2
Contacts2
Manufacturer packaging code3-2A1A
Reach Compliance Codeunknown
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance30 Ω
JESD-30 codeR-PDSO-F2
JESD-609 codee0
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
polarityUNIDIRECTIONAL
Maximum power dissipation0.7 W
Certification statusNot Qualified
Nominal reference voltage30 V
surface mountYES
technologyZENER
Terminal surfaceTIN LEAD
Terminal formFLAT
Terminal locationDUAL
Maximum voltage tolerance10%
Working test current10 mA
CRY62~CRZ47
TOSHIBA Zener Diode
Silicon Epitaxial Type
CRY62~CRZ47
Applications:
Communication, Control and
Measurement Equipment
Constant Voltage Regulation
Transient Suppressors
Average power dissipation: P = 0.7 W
Zener voltage: V
Z
= 6.2~47 V
Suitable for compact assembly due to small surface-mount package
“S−FLAT
TM
” (Toshiba package name)
Unit: mm
Absolute Maximum Ratings
(Ta = 25
°C
)
Characteristic
Power dissipation
Junction temperature
Storage temperature range
Symbol
P
T
j
T
stg
Rating
700
−40
~ 150
−40
~ 150
Unit
mW
°C
°C
JEDEC
JEITA
Note: Using continuously under heavy loads (e.g. the application of high
TOSHIBA
3-2A1A
temperature/current/voltage and the significant change in
Weight: 0.013 g (typ.)
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report
and estimated failure rate, etc).
Standard Soldering Pad
Unit: mm
1.2
1.2
2.8
Start of commercial production
1999-09
1
2013-11-01
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