CUS01
TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CUS01
Portable Equipment Battery Application
Unit: mm
•
•
•
•
Forward voltage: V
FM
= 0.37 V (max) @I
F
= 0.7 A
Average forward current: I
F (AV)
= 1.0 A
Repetitive peak reverse voltage: V
RRM
= 30 V
Suitable for compact assembly due to small surface-mount package
“US−FLAT
TM
” (Toshiba package name)
Maximum Ratings
(Ta = 25°C)
Characteristics
Repetitive peak reverse voltage
Average forward current
Peak one cycle surge forward current
Junction temperature
Storage temperature range
Symbol
V
RRM
I
F (AV)
I
FSM
T
j
T
stg
Rating
30
1.0
(Note 1)
20 (50 Hz)
−40
to 125
−40
to 150
Unit
V
A
A
°C
°C
JEDEC
JEITA
TOSHIBA
―
3-2B1A
Note 1: T
I
= 86°C: Rectangular waveform (α = 180°), V
R
= 15 V
Weight: 0.004 g (typ.)
Electrical Characteristics
(Ta = 25°C)
Characteristics
Symbol
V
FM (1)
Peak forward voltage
V
FM (2)
V
FM (3)
Repetitive peak reverse current
Junction capacitance
I
RRM (1)
I
RRM (2)
C
j
I
FM
= 0.1 A
I
FM
= 0.7 A
I
FM
= 1.0 A
V
RRM
= 5 V
V
RRM
= 30 V
V
R
= 10 V, f = 1.0 MHz
Device mounted on a ceramic board
(soldering land: 2 mm × 2 mm)
R
th (j-a)
Device mounted on a glass-epoxy
board
(soldering land: 6 mm × 6 mm)
Junction to lead of cathode side
Test Condition
Min
―
―
―
―
―
―
―
Typ.
0.25
0.33
0.39
50
0.5
40
―
Max
―
0.37
―
―
1.5
―
75
°C/W
―
―
―
―
150
30
°C/W
µA
mA
pF
V
Unit
Thermal resistance
(junction to ambient)
Thermal resistance (junction to lead)
R
th (j-I)
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CUS01
Marking
Abbreviation Code
1
Part No.
CUS01
Standard Soldering Pad
Unit: mm
2.0
0.5
0.8
1.1
0.8
Handling Precaution
Schottky barrier diodes have reverse current characteristic compared to the other diodes.
There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage.
This device is V
F
-I
RRM
trade-off type, lower V
F
higher I
RRM
; therefore, thermal runaway might occur when
voltage is applied. Please take forward and reverse loss into consideration during design.
The maximum ratings denote the absolute maximum ratings, which are rated values and must not be exceeded
during operation, even for an instant. The following are the general derating methods that we recommend when
you design a circuit with a device.
V
RRM
:
Use this rating with reference to the above. V
RRM
has a temperature coefficient of 0.1%/°C. Take
this temperature coefficient into account designing a device at low temperature.
We recommend that the worst case current be no greater than 80% of the maximum rating of I
F(AV)
and T
j
be below 100°C. When using this device, take the margin into consideration by using an
allowable Tamax-I
F(AV)
curve.
This rating specifies the non-repetitive peak current. This is only applied for an abnormal operation,
which seldom occurs during the lifespan of the device.
Derate this rating when using a device in order to ensure high reliability. We recommend that the
device be used at a T
j
of below 100°C.
I
F(AV)
:
I
FSM
:
T
j
:
Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When
using a device, please design a circuit board and a soldering land size to match the appropriate thermal resistance
value.
Please refer to the Rectifiers databook for further information.
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CUS01
i
F
– v
F
10
0.5
P
F (AV)
– I
F (AV)
DC
i
F
(A)
Average forward power dissipation
P
F (AV)
(W)
0.4
120°
0.3
α
= 60°
0.2
180°
Instantaneous forward current
Tj = 125°C
1
75°C
0.1
25°C
Rectangular
waveform
0°
α
360°
Conduction
angle:
α
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0.1
0.01
0.0
0.2
0.4
0.6
0.8
1.0
0.0
0.0
Instantaneous forward voltage
v
F
(V)
Average forward current
I
F (AV)
(A)
Ta max – I
F (AV)
140
T
I
max – I
F (AV)
140
Maximum allowable ambient temperature
Ta max (°C)
120
100
80
60
40
20
0
0.0
Maximum allowable lead temperature
T
I
max (°C)
Device mounted on a ceramic board
(board size: 50 mm × 50 mm)
120
100
80
60
40
20
0
0.0
0°
α
360°
Conduction
angle:
α
VR = 15 V
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
α
= 60°
Rectangular
waveform
IF (AV)
120°
180°
DC
Rectangular waveform
IF (AV)
0°
α
360°
Conduction angle:
α
VR = 15 V
0.2
0.4
0.6
α
= 180°
0.8
1.0
1.2
DC
1.4
1.6
Average forward current
I
F (AV)
(A)
Average forward current
I
F (AV)
(A)
r
th (j-a)
– t
10000
Transient thermal impedance
r
th (j-a)
(°C/W)
1000
(1) Device mounted on a ceramic board
Soldering land: 2.0 mm × 2.0 mm
(2) Device mounted on a glass-epoxy board
Soldering land: 6.0 mm × 6.0 mm
(3) Device mounted on a glass-epoxy board
Standard Soldering pad
(3)
(2)
(1)
100
10
1
0.001
0.01
0.1
1
10
100
1000
Time
t (s)
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CUS01
Surge forward current (non-repetitive)
24
Ta = 25°C
f = 50 Hz
20
1000
C
j
– V
R
(typ.)
f = 1 MHz
Ta = 25°C
I
FSM
(A)
Peak surge forward current
12
Junction capacitance
10
100
C
j
100
16
8
4
0
1
(pF)
Number of cycles
10
1
10
100
Reverse voltage
V
R
(V)
I
R
– T
j
100
Pulse test
(typ.)
2.5
Rectangular
waveform
P
R (AV)
– V
R
(typ.)
Average reverse power dissipation
P
R (AV)
(W)
I
R
(mA)
10
20 V
15 V
1
VR = 30 V
2.0
DC
0°
α
360°
Conduction
angle:
α
Tj = 125°C
300°
240°
1.5
Reverse current
10 V
5V
3V
1.0
120°
0.5
60°
180°
0.1
0.01
0
20
40
60
80
100
120
140
0.0
0
10
20
30
Junction temperature
T
j
(°C)
Reverse voltage
V
R
(V)
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CUS01
RESTRICTIONS ON PRODUCT USE
•
The information contained herein is subject to change without notice.
030619EAA
•
The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.
•
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
•
The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
•
TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced
and sold, under any law and regulations.
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2004-07-01
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