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MAX3374EEBL-T

Description
SPECIALTY INTERFACE CIRCUIT, PBGA9, 1.50 X 1.50 MM, UCSP-9
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size1MB,29 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
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MAX3374EEBL-T Overview

SPECIALTY INTERFACE CIRCUIT, PBGA9, 1.50 X 1.50 MM, UCSP-9

MAX3374EEBL-T Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
MakerRochester Electronics
Parts packaging codeBGA
package instruction1.50 X 1.50 MM, UCSP-9
Contacts9
Reach Compliance Codeunknown
Other featuresUSED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION
Interface integrated circuit typeINTERFACE CIRCUIT
JESD-30 codeS-PBGA-B9
length1.52 mm
Humidity sensitivity level1
Number of functions2
Number of terminals9
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Package shapeSQUARE
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)240
Certification statusCOMMERCIAL
Maximum seat height0.67 mm
Maximum supply voltage5.5 V
Minimum supply voltage1.2 V
Nominal supply voltage3.3 V
Supply voltage 1-max5.5 V
Mains voltage 1-minute1.65 V
Supply voltage1-Nom3.3 V
surface mountYES
technologyBICMOS
Temperature levelINDUSTRIAL
Terminal surfaceNOT SPECIFIED
Terminal formBALL
Terminal pitch0.5 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature20
width1.52 mm
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MAX3374EEBL-T Related Products

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Description SPECIALTY INTERFACE CIRCUIT, PBGA9, 1.50 X 1.50 MM, UCSP-9 SPECIALTY INTERFACE CIRCUIT, PBGA9, 1.50 X 1.50 MM, UCSP-9 SPECIALTY INTERFACE CIRCUIT, PBGA12, 1.50 X 2 MM, UCSP-12 SPECIALTY INTERFACE CIRCUIT, PBGA12, 1.50 X 2 MM, UCSP-12 SPECIALTY INTERFACE CIRCUIT, PBGA9, 1.50 X 1.50 MM, UCSP-9 SPECIALTY INTERFACE CIRCUIT, PBGA9, 1.50 X 1.50 MM, UCSP-9
Is it lead-free? Contains lead Contains lead Lead free Contains lead Lead free Contains lead
Parts packaging code BGA BGA BGA BGA BGA BGA
package instruction 1.50 X 1.50 MM, UCSP-9 1.50 X 1.50 MM, UCSP-9 1.50 X 2 MM, UCSP-12 1.50 X 2 MM, UCSP-12 1.50 X 1.50 MM, UCSP-9 1.50 X 1.50 MM, UCSP-9
Contacts 9 9 12 12 9 9
Reach Compliance Code unknown unknown unknown unknown unknown unknown
Other features USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION
Interface integrated circuit type INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT
JESD-30 code S-PBGA-B9 S-PBGA-B9 R-PBGA-B12 R-PBGA-B12 S-PBGA-B9 S-PBGA-B9
length 1.52 mm 1.52 mm 2.02 mm 2.02 mm 1.52 mm 1.52 mm
Humidity sensitivity level 1 1 1 1 1 1
Number of functions 2 2 4 4 2 2
Number of terminals 9 9 12 12 9 9
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code VFBGA VFBGA VFBGA VFBGA VFBGA VFBGA
Package shape SQUARE SQUARE RECTANGULAR RECTANGULAR SQUARE SQUARE
Package form GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) 240 240 240 240 240 240
Certification status COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Maximum seat height 0.67 mm 0.67 mm 0.67 mm 0.67 mm 0.67 mm 0.67 mm
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V
Nominal supply voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Supply voltage 1-max 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Mains voltage 1-minute 1.65 V 1.65 V 1.65 V 1.65 V 1.65 V 1.65 V
Supply voltage1-Nom 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES
technology BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Terminal form BALL BALL BALL BALL BALL BALL
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 20 20 20 20 20 20
width 1.52 mm 1.52 mm 1.54 mm 1.54 mm 1.52 mm 1.52 mm
Maker Rochester Electronics Rochester Electronics Rochester Electronics - Rochester Electronics Rochester Electronics

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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