F-212
QSE–028–01–F–D–DP–A–RT1
®
(0,80mm) .0315"
QSE SERIES
QSE–020–01–L–D–A–RT1
QSE–060–01–F–D–A
HIGH SPEED GROUND PLANE SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QSE
Insulator Material:
Liquid Crystal
Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over 50µ" (1,27µm) Ni
Current Rating:
Contacts: 1.3A @ 95°C
Ground Plane: 10.1A @ 95°C
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
225 VAC (5mm Stack Height)
Max Cycles:
100
Unmating Force (-RT1 option):
-RT1 option increases
unmating force up to 50%
RoHS Compliant:
Yes
Board Mates:
QTE
Cable Mates:
EQCD, EQSD, EQDP EQRF
,
(See Application Specific note)
TM
Integral metal plane
for power or ground
®
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EXTENDED LIFE PRODUCT
10 year Mixed Flowing Gas with 50µ" Gold
Call Samtec for maximum cycles mated with QTE
ols
otoc ted
Pr or
Supp
XAUI
®
PCI Express
SATA
et I/O)
MGT (Rock
™
InfiniBand
Processing:
Rated @ 3dB Insertion Loss
QTE/QSE
Type
5mm Stack Height
with PCB effects* w/o PCB effects**
Single-Ended Signaling
–D
9 GHz / 18 Gbps
7.5 GHz / 15 Gbps
Differential Pair Signaling
–D
8 GHz / 16 Gbps
8.5 GHz / 17 Gbps
Differential Pair Signaling
–DP 8.5 GHz / 17 Gbps
––––
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
Performance data for other stack heights and complete test data
available at www.samtec.com?QSE or contact sig@samtec.com
Blade & Beam Design
ALSO
AVAILABLE
Board Spacing Standoffs.
See SO Series.
notes at
Download app ppnote
com/a
www.samtec.
m
@ samtec.co
Contact SIG n protocols
o
for questions
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10mm) .004" max (020-060)
(0,15mm) .006" max (080)
Board Stacking:
For applications requiring
more than two connectors
per board or 4 banks or more,
contact ipg@samtec.com
QSE
PINS PER ROW
NO. OF PAIRS
01
PLATING
OPTION
TYPE
A
OTHER
OPTION
–F
–020, –040, –060, –080
(40 total pins per bank = –D)
APPLICATION
SPECIFIC OPTION
• 14mm, 15mm, 22mm
and 30mm stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please
consult machinery
specifications.)
• 30µ" (0,76µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
• Edge Mount
• 100 positions per row
• Guide Posts and Friction
Lock options.
Call Samtec.
–014, –028, –042, –056
(14 pairs per bank = –D–DP)
= Gold Flash on
Signal Pins and
Ground Plane, Matte
Tin on tails
–D
= Single-
Ended
–K
= (8,25mm) .325"
DIA Polyimide
Film Pick &
Place Pad
–L
= 10µ" (0,25µm) Gold
on Signal Pins
and Ground Plane,
Matte Tin on tails
–D–DP
= Differential
Pair
(–01 only)
–D–DP = (No. of Positions per Row/14) x
(20,00) .7875 + (1,27) .050
–D = (No. of Positions per Row/20) x
(20,00) .7875 + (1,27) .050
02
–TR
= Tape & Reel
Packaging
(N/A on 56 &
80 positions)
(20,00) .7875
–C*
= Electro-Polished
Selective
(7,49)
50µ" (1,27µm) min
.295
Au over 150µ"
(3,81µm) Ni on Signal
Pins in contact area,
10µ" (0,25µm) min
Au over 50µ" (1,27µm)
QTE
MATED
(3,25)
LEAD
HEIGHT
Ni on Ground Plane
.128
STYLE WITH QSE*
in contact area,
Matte Tin over 50µ"
–01
(5,00) .197
(1,27µm) min Ni on
–02
(8,00) .315
all solder tails
–RT1
= Retention
Option
(N/A on 56 &
80 positions
or –L (latch)
option)
(7,24)
.285
01
(0,80)
.0315
(0,15)
.006
–L
= Latching
Option
(N/A on 42,
56, 60 & 80
positions or
–RT1 option)
(3,05)
.120
(0,76)
.030
(0,89)
.035
DIA
–01
(3,81)
.150
–RT1
*Note:
–C Plating passes
10 year MFG testing
Note:
Some lengths, styles
and options are non-standard,
non-returnable.
(3,76)
.148
DIA
(0,64)
.025
–L
–03
–04
–05
–07
(11,00) .433
(16,00) .630
(19,00) .748
(25,00) .984
*Processing
conditions will
affect mated height.
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