Lead Temperature (Soldering, 10 Seconds) ............. 300°C
THERMAL DATA
K Package:
Thermal Resistance-
Junction to Leads
,
θ
JC
................ 3.0°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
............... 35°C/W
R Package:
Thermal Resistance-
Junction to Leads
,
θ
JC
................ 5.0°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
.............. 40°C/W
T Package:
Thermal Resistance-
Junction to Leads
,
θ
JC
................. 15°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
............ 120°C/W
IG Package:
Thermal Resistance-
Junction to Leads
,
θ
JC
................ 3.5°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
.............. 42°C/W
L Package:
Thermal Resistance-
Junction to Leads
,
θ
JC
................. 35°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
............ 120°C/W
Note A. Junction Temperature Calculation: T
J
= T
A
+ (P
D
x
θ
JA
).
Note B. The above numbers for
θ
JC
are maximums for the limiting
thermal resistance of the package in a standard mount-
ing configuration. The
θ
JA
numbers are meant to be
guidelines for the thermal performance of the device/pc-
board system. All of the above assume no ambient
airflow.
RECOMMENDED OPERATING CONDITIONS
(Note 2 & 3)
Input Voltage Range ..............................-(V
OUT
+ 3.5V) to -36V
Operating Junction
SG137A/SG137
SG237A/SG237
SG337A/SG337
Temperature Range
............................................
-55°C to 150°C
............................................
-25°C to 150°C
............................................. 0°C to 125°C
Note 2. Range over which the device is functional.
Note 3. These ratings are applicable for junction temperatures of less than 135°C.
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, these specifications apply over full operating ambient temperatures for SG137A/SG137 with -55°C
≤
T
A
≤
150°C, SG237A/
SG237 with -25°C
≤
T
A
≤
150°C, SG337A/SG337 with 0°C
≤
T
A
≤
125°C, |V
IN
- V
OUT
| = 5.0V, and for I
OUT
= 500mA (K, R, and IG power packages) and I
OUT
= 100mA (T and L packages). Although power dissipation is internally limited, these specifications are applicable for power dissipations of 2Ω for the T and
L packages, and 20Ω for the K, R, and IG packages. I
MAX
is 1.5A for the K, R, and IG packages and 0.5A for the T and L packages. Low duty cycle pulse
testing techniques are used which maintains junction and case temperatures equal to the ambient temperature.)
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