MASK ROM, 16KX8, 250ns, CMOS, PQFP54
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Hitachi (Renesas ) |
| package instruction | QFP, QFP54,.77X1.0,40 |
| Reach Compliance Code | unknown |
| Maximum access time | 250 ns |
| JESD-30 code | R-PQFP-G54 |
| JESD-609 code | e0 |
| memory density | 131072 bit |
| Memory IC Type | MASK ROM |
| memory width | 8 |
| Number of terminals | 54 |
| word count | 16384 words |
| character code | 16000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | -20 °C |
| organize | 16KX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QFP |
| Encapsulate equivalent code | QFP54,.77X1.0,40 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.00003 A |
| Maximum slew rate | 0.025 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1 mm |
| Terminal location | QUAD |

| HN613128FP | HN613128P | |
|---|---|---|
| Description | MASK ROM, 16KX8, 250ns, CMOS, PQFP54 | MASK ROM, 16KX8, 250ns, CMOS, PDIP28 |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | Hitachi (Renesas ) | Hitachi (Renesas ) |
| package instruction | QFP, QFP54,.77X1.0,40 | DIP, DIP28,.6 |
| Reach Compliance Code | unknown | unknown |
| Maximum access time | 250 ns | 250 ns |
| JESD-30 code | R-PQFP-G54 | R-PDIP-T28 |
| JESD-609 code | e0 | e0 |
| memory density | 131072 bit | 131072 bit |
| Memory IC Type | MASK ROM | MASK ROM |
| memory width | 8 | 8 |
| Number of terminals | 54 | 28 |
| word count | 16384 words | 16384 words |
| character code | 16000 | 16000 |
| Maximum operating temperature | 70 °C | 70 °C |
| Minimum operating temperature | -20 °C | -20 °C |
| organize | 16KX8 | 16KX8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QFP | DIP |
| Encapsulate equivalent code | QFP54,.77X1.0,40 | DIP28,.6 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | IN-LINE |
| power supply | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified |
| Maximum standby current | 0.00003 A | 0.00003 A |
| Maximum slew rate | 0.025 mA | 0.025 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | YES | NO |
| technology | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | THROUGH-HOLE |
| Terminal pitch | 1 mm | 2.54 mm |
| Terminal location | QUAD | DUAL |