MASK ROM, 8KX8, 250ns, CMOS, PDIP28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Hitachi (Renesas ) |
| package instruction | DIP, DIP28,.6 |
| Reach Compliance Code | unknown |
| Maximum access time | 250 ns |
| JESD-30 code | R-PDIP-T28 |
| JESD-609 code | e0 |
| memory density | 65536 bit |
| Memory IC Type | MASK ROM |
| memory width | 8 |
| Number of terminals | 28 |
| word count | 8192 words |
| character code | 8000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | -20 °C |
| organize | 8KX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum slew rate | 0.025 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |

| HN61364P | HN61364FP | |
|---|---|---|
| Description | MASK ROM, 8KX8, 250ns, CMOS, PDIP28 | MASK ROM, 8KX8, 250ns, CMOS, PQFP54 |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | Hitachi (Renesas ) | Hitachi (Renesas ) |
| package instruction | DIP, DIP28,.6 | QFP, QFP54,.77X1.0,40 |
| Reach Compliance Code | unknown | unknown |
| Maximum access time | 250 ns | 250 ns |
| JESD-30 code | R-PDIP-T28 | R-PQFP-G54 |
| JESD-609 code | e0 | e0 |
| memory density | 65536 bit | 65536 bit |
| Memory IC Type | MASK ROM | MASK ROM |
| memory width | 8 | 8 |
| Number of terminals | 28 | 54 |
| word count | 8192 words | 8192 words |
| character code | 8000 | 8000 |
| Maximum operating temperature | 70 °C | 70 °C |
| Minimum operating temperature | -20 °C | -20 °C |
| organize | 8KX8 | 8KX8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | QFP |
| Encapsulate equivalent code | DIP28,.6 | QFP54,.77X1.0,40 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | FLATPACK |
| power supply | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified |
| Maximum slew rate | 0.025 mA | 0.025 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | NO | YES |
| technology | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | GULL WING |
| Terminal pitch | 2.54 mm | 1 mm |
| Terminal location | DUAL | QUAD |