DPST, 2 Func, 2 Channel, CMOS, CDIP14
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Harris |
| package instruction | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| Analog Integrated Circuits - Other Types | DPST |
| JESD-30 code | R-GDIP-T14 |
| JESD-609 code | e0 |
| Nominal Negative Supply Voltage (Vsup) | -15 V |
| normal position | NO |
| Number of channels | 2 |
| Number of functions | 2 |
| Number of terminals | 14 |
| Nominal off-state isolation | 40 dB |
| Maximum on-state resistance (Ron) | 50 Ω |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| output | SEPARATE OUTPUT |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | +-15 V |
| Certification status | Not Qualified |
| Maximum supply current (Isup) | 1 mA |
| Nominal supply voltage (Vsup) | 15 V |
| surface mount | NO |
| Maximum disconnect time | 250 ns |
| Maximum connection time | 300 ns |
| switch | BREAK-BEFORE-MAKE |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| HI1-302/883 | |
|---|---|
| Description | DPST, 2 Func, 2 Channel, CMOS, CDIP14 |
| Is it Rohs certified? | incompatible |
| Maker | Harris |
| package instruction | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| Analog Integrated Circuits - Other Types | DPST |
| JESD-30 code | R-GDIP-T14 |
| JESD-609 code | e0 |
| Nominal Negative Supply Voltage (Vsup) | -15 V |
| normal position | NO |
| Number of channels | 2 |
| Number of functions | 2 |
| Number of terminals | 14 |
| Nominal off-state isolation | 40 dB |
| Maximum on-state resistance (Ron) | 50 Ω |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| output | SEPARATE OUTPUT |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | +-15 V |
| Certification status | Not Qualified |
| Maximum supply current (Isup) | 1 mA |
| Nominal supply voltage (Vsup) | 15 V |
| surface mount | NO |
| Maximum disconnect time | 250 ns |
| Maximum connection time | 300 ns |
| switch | BREAK-BEFORE-MAKE |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |