256KX8 MASK PROM, 200ns, PDIP40, PLASTIC, DIP-40
| Parameter Name | Attribute value |
| Maker | Renesas Electronics Corporation |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 40 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 200 ns |
| Spare memory width | 16 |
| JESD-30 code | R-PDIP-T40 |
| length | 52.8 mm |
| memory density | 2097152 bit |
| Memory IC Type | MASK ROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 40 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256KX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 15.24 mm |
| HN62412P | HN62412FP | HN62422FP | HN62422TFP | HN62412TFP | HN62422P | |
|---|---|---|---|---|---|---|
| Description | 256KX8 MASK PROM, 200ns, PDIP40, PLASTIC, DIP-40 | 256KX8 MASK PROM, 200ns, PQFP44, PLASTIC, QFP-44 | 256KX8 MASK PROM, 150ns, PQFP44, PLASTIC, QFP-44 | 256KX8 MASK PROM, 150ns, PQFP44, PLASTIC, TQFP-44 | 256KX8 MASK PROM, 200ns, PQFP44, PLASTIC, TQFP-44 | 256KX8 MASK PROM, 150ns, PDIP40, PLASTIC, DIP-40 |
| Parts packaging code | DIP | QFP | QFP | QFP | QFP | DIP |
| package instruction | DIP, | QFP, | QFP, | TQFP, | TQFP, | DIP, |
| Contacts | 40 | 44 | 44 | 44 | 44 | 40 |
| Reach Compliance Code | unknown | compli | unknown | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 200 ns | 200 ns | 150 ns | 150 ns | 200 ns | 150 ns |
| Spare memory width | 16 | 16 | 16 | 16 | 16 | 16 |
| JESD-30 code | R-PDIP-T40 | S-PQFP-G44 | S-PQFP-G44 | S-PQFP-G44 | S-PQFP-G44 | R-PDIP-T40 |
| length | 52.8 mm | 14 mm | 14 mm | 14 mm | 14 mm | 52.8 mm |
| memory density | 2097152 bit | 2097152 bi | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit |
| Memory IC Type | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 40 | 44 | 44 | 44 | 44 | 40 |
| word count | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| character code | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | QFP | QFP | TQFP | TQFP | DIP |
| Package shape | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR |
| Package form | IN-LINE | FLATPACK | FLATPACK | FLATPACK, THIN PROFILE | FLATPACK, THIN PROFILE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | 3.05 mm | 3.05 mm | 1.1 mm | 1.1 mm | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.25 V | 5.25 V | 5.5 V | 5.25 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.75 V | 4.75 V | 4.5 V | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES | YES | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 2.54 mm |
| Terminal location | DUAL | QUAD | QUAD | QUAD | QUAD | DUAL |
| width | 15.24 mm | 14 mm | 14 mm | 14 mm | 14 mm | 15.24 mm |
| Maker | Renesas Electronics Corporation | - | Renesas Electronics Corporation | - | Renesas Electronics Corporation | Renesas Electronics Corporation |