IC Sockets
XR2
OMRON’s IC Connectors Have Excellent
Reliability and Can Tolerate Momentary
Interruptions in Power.
• Round pins and 4-point (4-finger) contact construction with
contact entry holes that are large for easy insertion.
• IC lead contacts placed high for solid connections.
• A wide product range: open-frame, closed-frame, single-
row, carrier-type DIP terminals, wrap terminals, solder-
sleeve terminals, and low-profile DIP terminals.
• Conforms to UL standards (file no. E 103202) and CSA
standards (file no. LR 62678).
■
Construction
Inner clip
Base
■
Contact Dimensions
DIP
Terminals
1.83 dia.
Wrap
Terminals
1.83 dia.
Low-profile DIP
Terminals
1.83 dia.
Solder-sleeve
Terminals
1.83 dia.
Outer sleeve
Carrier
Inner clip
0.79 dia.
1.35 dia.
0.51 dia.
0.635 0.635
Outer sleeve
■
Ratings and Characteristics
Item
Rated current
Rated voltage
Contact resistance
Insulation resistance
Dielectric strength
Contact insertion
(See note.)
Contact removal
(See note.)
Insertion durability
Gold plated
Gold flash plated
1A
300 VAC
20 mΩ max. (at 20 mV, 100 mA max.)
1,000 MΩ min. (at 500 VDC)
1,000 VAC for 1 min (leakage current: 1 mA max.)
400 gf (3.92 N) max.
65 gf (0.64 N) min. with gold plating or with solder plating
■
Applicable Wrap Post Wire Sizes
AWG30, AWG28, AWG26, AWG24
(Solid wire: 0.25 to 0.51 mm dia.)
■
Wrap Post Length
3 wires
■
Applicable IC Lead Dimensions
DIP, Wrap, and Solder-sleeve Terminals
Depth
×
width (mm)
Flat lead
Round lead
0.29
±0.09 ×
0.46
±0.08
(See note.)
0.53 dia. max.
0.41 dia. min.
100 times (0.75-μm gold plating), 20 times
50 times (0.25-μm gold plating)
Ambient temperature Operating: –55 to 125°C (with no icing)
Note:
The contact insertion force and contact removal force are for a
test gauge, t = 0.432 mm.
Note:
Do not use wire where the diagonal is more than 0.56 mm.
■
Materials and Finish
Base
Carrier
Inner clip
Outer sleeve
Fiber-glass reinforced PBT resin (UL94V-0)/black
Aluminum
Beryllium copper/nickel base, gold plated
Brass/nickel base, gold flash plating
Low-profile DIP Terminals
Depth
×
width (mm)
Flat lead
Round lead
0.29
±0.09 ×
0.46
±0.08
(See note.)
0.50 dia. max.
0.41 dia. min.
Note:
Do not use wire where the diagonal is more than 0.52 mm.
Note:
For non-standard plating, contact your OMRON representative.
IC Sockets
XR2
111
XR2T Open-frame Sockets with Seal Tape
•
Equipped with seal tape to prevent flux cleaning liquids from entering the Socket.
•
The same round-pin, 4-point contact structure as the RX2A is used for the contacts.
•
The seal tape is made of transparent polyethyle (adhesive portion) and yellow polypropolyene (non-adhesive portion).
■
Dimensions
XR2T-@@11-N
XR2T-2463-N
XR2T-2473-N
XR2T-@@01-N
XR2T-2461-N
XR2T-2471-N
XR2T-@@21-N
XR2T-2467-N
XR2T-2477-N
Dimensions
Adhesive side
Non-adhesive side
No. of contacts Dimensions (mm)
A
8
14
16
18
20
22
24
(See note 1.)
7.62
7.62
7.62
7.62
7.62
10.16
15.24
10.16
7.62
15.24
15.24
15.24
15.24
B
7.62
15.24
17.78
20.32
22.86
25.40
27.94
27.94
27.94
33.02
38.10
48.26
58.42
Seal tape
0.51 dia.
1.33 dia.
24
(See note 2.)
24
(See note 3.)
28
32
40
0.8
±0.05
dia. (DIP terminals)
Mounting holes (bottom view)
48
Note: 1.
XR2T-2411-N/XR2T-2401-N/
XR2A-2421-N
2.
XR2T-2463-N/XR2T-2461-N/
XR2T-2467-N
3.
XR2T-2473-N/XR2T-2471-N/
XR2T-2477-N
■
Ordering Information
Appearance
Sockets with DIP terminals
No. of
contacts
8
14
16
18
20
22
24
24
24
28
32
40
48
Row pitch (A)
(mm)
7.62
7.62
7.62
7.62
7.62
10.16
15.24
10.16
7.62
15.24
15.24
15.24
15.24
With 0.25-μm gold
plating
XR2T-0811-N
XR2T-1411-N
XR2T-1611-N
XR2T-1811-N
XR2T-2011-N
XR2T-2211-N
XR2T-2411-N
XR2T-2463-N
XR2T-2473-N
XR2T-2811-N
XR2T-3211-N
XR2T-4011-N
XR2T-4811-N
With 0.75-μm gold
plating
XR2T-0801-N
XR2T-1401-N
XR2T-1601-N
XR2T-1801-N
XR2T-2001-N
XR2T-2201-N
XR2T-2401-N
XR2T-2461-N
XR2T-2471-N
XR2T-2801-N
XR2T-3201-N
XR2T-4001-N
XR2T-4801-N
With gold flash plating
XR2T-0821-N
XR2T-1421-N
XR2T-1621-N
XR2T-1821-N
XR2T-2021-N
XR2T-2221-N
XR2T-2421-N
XR2T-2467-N
XR2T-2477-N
XR2T-2821-N
XR2T-3221-N
XR2T-4021-N
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IC Sockets
XR2
115
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