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XR2T-3211-N

Description
DIP24, IC SOCKET
CategoryThe connector   
File Size1MB,12 Pages
ManufacturerOMRON
Websitehttps://www.omron.com
Download Datasheet Parametric View All

XR2T-3211-N Overview

DIP24, IC SOCKET

XR2T-3211-N Parametric

Parameter NameAttribute value
Number of contacts24
Type of equipment usedDIP24
EU RoHS regulationsYes
stateACTIVE
Device slot typeIC SOCKET
Manufacturer SeriesXR2
Contact surface matchingGOLD (10)
Contact coated terminalsGOLD (10)
IC Sockets
XR2
OMRON’s IC Connectors Have Excellent
Reliability and Can Tolerate Momentary
Interruptions in Power.
• Round pins and 4-point (4-finger) contact construction with
contact entry holes that are large for easy insertion.
• IC lead contacts placed high for solid connections.
• A wide product range: open-frame, closed-frame, single-
row, carrier-type DIP terminals, wrap terminals, solder-
sleeve terminals, and low-profile DIP terminals.
• Conforms to UL standards (file no. E 103202) and CSA
standards (file no. LR 62678).
Construction
Inner clip
Base
Contact Dimensions
DIP
Terminals
1.83 dia.
Wrap
Terminals
1.83 dia.
Low-profile DIP
Terminals
1.83 dia.
Solder-sleeve
Terminals
1.83 dia.
Outer sleeve
Carrier
Inner clip
0.79 dia.
1.35 dia.
0.51 dia.
0.635 0.635
Outer sleeve
Ratings and Characteristics
Item
Rated current
Rated voltage
Contact resistance
Insulation resistance
Dielectric strength
Contact insertion
(See note.)
Contact removal
(See note.)
Insertion durability
Gold plated
Gold flash plated
1A
300 VAC
20 mΩ max. (at 20 mV, 100 mA max.)
1,000 MΩ min. (at 500 VDC)
1,000 VAC for 1 min (leakage current: 1 mA max.)
400 gf (3.92 N) max.
65 gf (0.64 N) min. with gold plating or with solder plating
Applicable Wrap Post Wire Sizes
AWG30, AWG28, AWG26, AWG24
(Solid wire: 0.25 to 0.51 mm dia.)
Wrap Post Length
3 wires
Applicable IC Lead Dimensions
DIP, Wrap, and Solder-sleeve Terminals
Depth
×
width (mm)
Flat lead
Round lead
0.29
±0.09 ×
0.46
±0.08
(See note.)
0.53 dia. max.
0.41 dia. min.
100 times (0.75-μm gold plating), 20 times
50 times (0.25-μm gold plating)
Ambient temperature Operating: –55 to 125°C (with no icing)
Note:
The contact insertion force and contact removal force are for a
test gauge, t = 0.432 mm.
Note:
Do not use wire where the diagonal is more than 0.56 mm.
Materials and Finish
Base
Carrier
Inner clip
Outer sleeve
Fiber-glass reinforced PBT resin (UL94V-0)/black
Aluminum
Beryllium copper/nickel base, gold plated
Brass/nickel base, gold flash plating
Low-profile DIP Terminals
Depth
×
width (mm)
Flat lead
Round lead
0.29
±0.09 ×
0.46
±0.08
(See note.)
0.50 dia. max.
0.41 dia. min.
Note:
Do not use wire where the diagonal is more than 0.52 mm.
Note:
For non-standard plating, contact your OMRON representative.
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