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HCF4044BM013TR

Description
IC,LATCH,QUAD,1-BIT,CMOS,SOP,16PIN,PLASTIC
Categorylogic    logic   
File Size506KB,7 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Environmental Compliance
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HCF4044BM013TR Overview

IC,LATCH,QUAD,1-BIT,CMOS,SOP,16PIN,PLASTIC

HCF4044BM013TR Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSTMicroelectronics
package instructionSOP, SOP16,.25
Reach Compliance Codecompliant
JESD-30 codeR-PDSO-G16
JESD-609 codee4
Load capacitance (CL)50 pF
Logic integrated circuit typeR-S LATCH
Number of digits1
Number of functions4
Number of terminals16
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP16,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE
method of packingTAPE AND REEL
power supply5/15 V
Prop。Delay @ Nom-Sup300 ns
Certification statusNot Qualified
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL

HCF4044BM013TR Related Products

HCF4044BM013TR HCF4044BE HCF4043BM HCF4043BE
Description IC,LATCH,QUAD,1-BIT,CMOS,SOP,16PIN,PLASTIC IC,LATCH,QUAD,1-BIT,CMOS,DIP,16PIN,PLASTIC IC,LATCH,QUAD,1-BIT,CMOS,SOP,16PIN,PLASTIC IC,LATCH,QUAD,1-BIT,CMOS,DIP,16PIN,PLASTIC
Is it Rohs certified? conform to incompatible incompatible incompatible
Maker STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Reach Compliance Code compliant not_compliant not_compliant _compli
JESD-30 code R-PDSO-G16 R-PDIP-T16 R-PDSO-G16 R-PDIP-T16
JESD-609 code e4 e0 e0 e0
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type R-S LATCH R-S LATCH R-S LATCH R-S LATCH
Number of digits 1 1 1 1
Number of functions 4 4 4 4
Number of terminals 16 16 16 16
Maximum operating temperature 125 °C 85 °C 85 °C 85 °C
Minimum operating temperature -55 °C -40 °C -40 °C -40 °C
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP DIP SOP DIP
Encapsulate equivalent code SOP16,.25 DIP16,.3 SOP16,.25 DIP16,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE IN-LINE SMALL OUTLINE IN-LINE
power supply 5/15 V 3/15 V 3/15 V 3/15 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
surface mount YES NO YES NO
technology CMOS CMOS CMOS CMOS
Temperature level MILITARY INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING THROUGH-HOLE GULL WING THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL
Prop。Delay @ Nom-Sup 300 ns 300 ns 300 ns -
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