HFCT-5951TLZ/TGZ/ATLZ/ATGZ and
HFCT-5952TLZ/TGZ/ATLZ/ATGZ
Single Mode SFF Transceivers for SONET OC-12/SDH STM-4 (S4.1)
Part of the Avago METRAK family
Data Sheet
Description
The HFCT-595xTLZ/TGZ/ATLZ/ATGZ SFF transceivers are
high performance, cost effective modules for serial optical
data communication applications specified at SONET/SDH
622 Mbit/s for Intermediate Reach links.
All modules are designed for single mode fiber and
operate at a nominal wavelength of 1300 nm. They in-
corporate high performance, reliable, long wavelength
optical device and proven circuit technology to give long
life and consistent service.
The transmitter section consists of a Fabry Perot Laser
(FP). The transmitter has full IEC 825 and CDRH Class 1 eye
safety.
The receiver section uses a MOVPE grown planar PIN pho-
todetector for low dark current and excellent responsivity.
A pseudo-ECL logic interface simplifies interface to
external circuitry.
These transceivers are supplied in 2 x 5 and 2 x 10 DIP style
footprint with the LC fiber connector interface and are
fully compliant with SFF Multi Source Agreement (MSA).
Features
•
RoHS Compliant
•
HFCT-595xTLZ/TGZ/ATLZ/ATGZ are compliant to the
intermediate reach SONET OC-12/SDH STM-4 (S4.1)
specifications
•
Multisourced 2 x 5 and 2 x 10 package styles with LC
receptacle
•
Single +3.3 V power supply
•
Temperature range:
0°C to +70 °C
-40 °C to +85 °C
HFCT-595xTLZ/TGZ:
HFCT-595xATLZ/ATGZ
•
Wave solder and aqueous wash process compatible
•
Manufactured in an ISO9002 certified facility
•
Performance
HFCT-595xTLZ/TGZ/ATLZ/ATGZ:
Links of 15 km with 9/125
µm
SMF
•
Fully Class 1 CDRH/IEC 825 compliant
•
Pin Outs:
HFCT-5951TLZ/TGZ/ATLZ/ATGZ
HFCT-5952TLZ/TGZ/ATLZ/ATGZ
2x5
2 x 10
Applications
•
SONET/SDH equipment interconnect, STS-12/SDH
STM-4 rate
•
Intermediate reach (up to 15 km) ATM links
Functional Description
Receiver Section
Design
The receiver section contains an InGaAs/InP photo
detector and a preamplifier mounted in an optical subas-
sembly. This optical subassembly is coupled to a postamp/
decision circuit.
The postamplifier is ac coupled to the preamplifier as il-
lustrated in Figure 1. The coupling capacitors are large
enough to pass the SONET/SDH test pattern at 622 MBd
without significant distortion or performance penalty. If
a lower signal rate, or a code which has significantly more
low frequency content is used, sensitivity, jitter and pulse
distortion could be degraded.
Figure 1 also shows a filter function which limits the
bandwidth of the preamp output signal. The filter is
designed to bandlimit the preamp output noise and thus
improve the receiver sensitivity.
These components will reduce the sensitivity of the receiver
as the signal bit rate is increased above 622 Mb/s.
The device incorporates a photodetector bias circuit. This
output must be connected to V
CC
and can be monitored
by connecting through a series resistor (see application
section).
Noise Immunity
The receiver includes internal circuit components to filter
power supply noise. However under some conditions
of EMI and power supply noise, external power supply
filtering may be necessary (see application section).
The Signal Detect Circuit
The signal detect circuit works by sensing the peak level of
the received signal and comparing this level to a reference.
The SD output is low voltage TTL.
PHOTODETECTOR
BIAS
TRANS-
IMPEDANCE
PRE-
AMPLIFIER
FILTER
AMPLIFIER
DATA OUT
PECL
OUTPUT
BUFFER
DATA OUT
GND
SIGNAL
DETECT
CIRCUIT
TTL
OUTPUT
BUFFER
SD
Figure 1. Receiver Block Diagram
2
Functional Description
Transmitter Section
Design
The transmitter section uses a Fabry Perot (FP) laser as
its optical source, see Figure 2. The package has been
designed to be compliant with IEC 825 eye safety require-
ments under any single fault condition. The optical output
is controlled by a custom IC that detects the laser output
via the monitor photodiode. This IC provides both dc and
ac current drive to the laser to ensure correct modulation,
eye diagram and extinction ratio over temperature, supply
voltage and operating life.
The transmitter section also includes monitor circuitry for
both the laser diode bias current and laser diode optical
power.
FP
LASER
DATA
DATA
PECL
INPUT
LASER
MODULATOR
PHOTODIODE
(rear facet monitor)
Note 1
B
MON
(+)
B
MON
(-)
Note 1
LASER BIAS
DRIVER
P
MON
(+)
P
MON
(-)
Note 1
Note 1: THESE FUNCTIONS ONLY AVAILABLE ON 2 x 10 PINOUT DESIGN
LASER BIAS
CONTROL
Figure 2. Simplified Transmitter Schematic
3
Package
The overall package concept for the Avago transceiver
consists of four basic elements; two optical subassem-
blies and two electrical subassemblies. They are housed as
illustrated in the block diagram in Figure 3.
The package outline drawing and pin out are shown in
Figures 4, 5 and 6. The details of this package outline and
pin out are compliant with the multisource definition of
the 2 x 5 and 2 x 10 DIP.
The electrical subassemblies consist of high volume mul-
tilayer printed circuit boards on which the IC and various
surface-mounted passive circuit elements are attached.
The receiver electrical subassembly includes an internal
shield for the electrical and optical subassemblies to
ensure high immunity to external EMI fields.
The optical subassemblies are each attached to their re-
spective transmit or receive electrical subassemblies.
These two units are than fitted within the outer housing
of the transceiver that is molded of filled nonconduc-
tive plastic to provide mechanical strength. The housing
is then encased with a metal EMI protective shield. Four
ground connections are provided for connecting the EMI
shield to signal ground.
The PCB’s for the two electrical subassemblies both carry
the signal pins that exit from the bottom of the trans-
ceiver. The solder posts are fastened into the molding
of the device and are designed to provide the mechani-
cal strength required to withstand the loads imposed on
the transceiver by mating with the LC connectored fiber
cables. Although they are not connected electrically to
the transceiver, it is recommended to connect them to
chassis ground.
R
X
SUPPLY
Note 3
PHOTO DETECTOR
BIAS Note 2
DATA OUT
QUANTIZER IC
DATA OUT
SIGNAL
DETECT
T
X
GROUND
DATA IN
DATA IN
Tx DISABLE
B
MON
(+) Note 1
B
MON
(-) Note 1
P
MON
(+) Note 1
P
MON
(-) Note 1
R
X
GROUND
Note 1
LASER BIAS
MONITORING
LASER DRIVER
AND CONTROL
CIRCUIT
LASER DIODE
OUTPUT POWER
MONITORING
Note 1
LASER
OPTICAL
SUBASSEMBLY
LC
RECEPTACLE
PIN PHOTODIODE
PREAMPLIFIER
SUBASSEMBLY
T
X
SUPPLY
CASE
Note 1: THESE FUNCTIONS ONLY AVAILABLE ON 2 x 10 PINOUT DESIGN
Note 2: CONNECTED TO R
X
V
CC
IN 2 x 5 DESIGN
Note 3: NOSE CLIP PROVIDES CONNECTION TO CHASSIS GROUND FOR BOTH EMI AND THERMAL DISSIPATION.
Figure 3. Block Diagram.
4
15.0 ± 0.2
(0.591 ± 0.008)
(
13.59 + 0
- 0.2
0.535 +0
-0.008
)
TOP VIEW
13.59
(0.535)
MAX
6.25
(0.246)
10.8 ± 0.2
(0.425 ± 0.008)
48.5 ± 0.2
(1.91 ± 0.008)
4.06 ± 0.1
(0.16 ± 0.004)
9.8
(0.386)
MAX
3.81 ± 0.15
(0.15 ± 0.006)
9.6 ± 0.2
(0.378 ±0.008)
Ø 1.07 ± 0.1
(0.042 ± 0.004)
19.5 ±0.3
(0.768 ±0.012)
1 ± 0.1
(0.039 ± 0.004)
SIDE VIEW
48.5 ± 0.2
(1.91 ± 0.008)
10.16 ± 0.1
(0.4 ± 0.004)
FRONT VIEW
0.25 ± 0.1
(0.01 ± 0.004)
20 x 0.5 ± 0.2
(0.02 ± 0.008)
1.78 ± 0.1
(0.07 ± 0.004)
1 ± 0.1
(0.039 ± 0.004)
BACK VIEW
G MODULE - NO EMI NOSE SHIELD
9.8
(0.386)
MAX
Ø 1.07 ± 0.1
(0.042 ± 0.004)
19.5 ±0.3
(0.768 ±0.012)
1 ± 0.1
(0.039 ± 0.004)
SIDE VIEW
3.81 ± 0.1
(0.15 ± 0.004)
0.25 ± 0.1
(0.01 ± 0.004)
20 x 0.5 ± 0.2
(0.02 ± 0.008)
1.78 ± 0.1
(0.07 ± 0.004)
20 x 0.25 ± 0.1
(PIN THICKNESS)
(0.01 ± 0.004)
NOTE: END OF PINS
CHAMFERED
BOTTOM VIEW
DIMENSIONS IN MILLIMETERS (INCHES)
DIMENSIONS SHOWN ARE NOMINAL. ALL DIMENSIONS MEET THE MAXIMUM PACKAGE OUTLINE DRAWING IN THE SFF MSA.
Figure 4. HFCT-595xTLZ/TGZ/ATLZ/ATGZ Package Outline Drawing (2 x 10 Design shown)
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