EEWORLDEEWORLDEEWORLD

Part Number

Search

3-HCIS132-01TT

Description
IC Socket, PGA132, 132 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,
CategoryThe connector    socket   
File Size146KB,2 Pages
ManufacturerAdvanced Interconnections Corp.
Download Datasheet Parametric View All

3-HCIS132-01TT Overview

IC Socket, PGA132, 132 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,

3-HCIS132-01TT Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerAdvanced Interconnections Corp.
Reach Compliance Codecompliant
ECCN codeEAR99
Other features1.0 OZ. AVG. INSERTION FORCE
body width1.3 inch
subject depth0.165 inch
body length1.3 inch
Contact structure13X13
Contact to complete cooperationSN-PB ON NI
Contact completed and terminatedTin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Contact materialBE-CU
Contact styleRND PIN-SKT
Device slot typeIC SOCKET
Type of equipment usedPGA132
Shell materialGLASS FILLED THERMOPLASTIC
JESD-609 codee0
Plug contact pitch0.1 inch
Installation methodSTRAIGHT
Number of contacts132
Maximum operating temperature260 °C
Minimum operating temperature-60 °C
PCB contact patternRECTANGULAR
PCB contact row spacing0.1 mm
Terminal pitch2.54 mm
Termination typeSOLDER
Low Insertion Force
PGA Sockets
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
Molded & FR-4 Low Insertion Force PGA Sockets
.100
(2.54)
.062
(1.57)
Molded
PC Board
FR-4
PC Board
Features:
• As low as 1 oz.(28.34 g) average insertion
force per pin.
• Multiple finger contacts for reliability.
• Over 500 PGA footprints available.
• Closed bottom terminal for 100% anti-
wicking of solder.
• Tapered entry for ease of insertion.
• To fit .100” (2.54 mm) grid.
• Easily customized to fit your application.
How To Order
1 oz. (28.34 g) Average Insertion Force Sockets
1
Footprint Dash #
If Applicable*
Body Type
CIS - Standard Molded
HCIS - High Temp. Molded
FIS - FR-4
Number of Pins
004 to 484
*See pages 37 - 64
for PGA footprints
CIS
068
-01
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See next page
for terminal types
Terminals and Contacts:
Terminal: Brass - Copper Alloy (C36000)
ASTM-B-16
Contact: Beryllium Copper (C17200)
ASTM-B-194
How To Order
2.5 oz. (70.85 g) Average Insertion Force Sockets
1
Footprint Dash #
If Applicable*
Body Type
CS - Standard Molded
HCS - High Temp. Molded
FS - FR-4
Number of Pins
004 to 484
*See pages 37 - 64
for PGA footprints
Solder Preform:
63% Tin, 37% Lead
CS
068
-01
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Plating:
Terminal: Gold over Nickel or
Tin-Lead over Nickel
Contact: Gold over Nickel or
Tin-Lead over Nickel
Gold per MIL-G-45204
Tin-Lead per MIL-P-81728
Nickel per QQ-N-290
Terminal Type
See next page
for terminal types
Sealant Options
RTV
Seal
Body Material:
CS/CIS -
Glass Filled Thermoplastic
Polyester (P.B.T.), U.L. Rated 94V-O,
-60˚C to 140˚C (-76˚F to 284˚F)
HCS/HCIS -
High Temp. Glass Filled
Thermoplastic (P.P.S.) , U.L. Rated 94V-O,
-60˚C to 260˚C (-76˚F to 500˚F)
FS/FIS -
FR-4 Fiberglass Epoxy Board,
U.L. Rated 94V-O, Index 140˚C (284˚F)
RTV Sealed
To order: Add RTV to end of part #
Note: RTV not available with HCS or HCIS Insulators
Tape Sealed
To order: Add 3M to end of part #
Page 32
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
Plan to acquire a security company
[align=left][font=宋体][size=10.5pt]The company intends to acquire a security company. The acquired company must at least meet the following conditions: [/size][/font][/align][align=left][font=宋体][size=...
yongmei Talking about work
How to implement hard shutdown protection in XP EMBEDDED? It doesn't matter if the data is not saved when shutting down, as long as the operating system is not damaged.
I am working on a project related to XP EMBEDDED recently. The project requires the ability to implement a hard shutdown, which is to unplug the power directly, and is different from the shutdown butt...
hamsun2008 Embedded System
Designing a compact, efficient and high-performance multi-parameter patient monitor
Continuously measuring patient vital signs such as heart rate, respiratory rate and blood oxygen saturation (SpO2) is critical to providing effective care, and the ability to measure these signs simul...
EEWORLD社区 TI Technology Forum
Help on Hongxiang 5509 FLASH self-loading
Has anyone programmed the FLASH self-loading of the Hongxiang DSP5509 development board? How should the CPLD code be updated? Or is there any method that can be taught?...
wushaojay DSP and ARM Processors
Sample application activity 1: Wistar chip
[b]:handshake Chengdu Weststar Chip Co., Ltd. [color=blue][/color][/b][url=http://www.weststarchips.com][color=blue][b]http://www.weststarchips.com[/b][/color][/url][color=blue][/color] [color=#0000ff...
EEWORLD社区 Suggestions & Announcements

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2336  422  2429  2879  2891  48  9  49  58  59 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号