DATA SHEET
DMK2790 Series and DMK2308 Series GaAs Flip-Chip
Schottky Diodes: Singles and Antiparallel Pairs
Applications
Personal Communication Network mixers and circuits
Low-power, fast-switching circuits
Detectors
Features
Designed for high-volume designs
High frequency: 20 GHz to 100 GHz
Exceeds environmental requirements for microwave integrated
circuits and hybrid applications
Designed for low-junction capacitance and low-series
resistance
Low parasitic flip-chip configurations
Skyworks Green™
products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to
Skyworks
Definition of Green™,
document number
SQ04-0074.
Description
This series of Skyworks GaAs Schottky barrier flip-chip diodes
produces excellent high-frequency performance up to millimeter
wave ranges in a mechanically robust, small form factor.
These diodes are comprised of single junction devices (DMK2790
series) and antiparallel pairs (DMK2308 series). These products
offer very low series resistance and capacitance typically
available only in beam-lead devices but without the fragility of
beam leads. The DMK2308 antiparallel pairs are suitable for use
in subharmonically pumped mixers or in limiting circuits.
These diodes are designed to be mounted on hard or soft
substrate PCBs with conductive epoxy or solder.
Typical applications include mixers or detectors in point-to-point
millimeter-wave radios, collision-avoidance automotive radars,
and adaptive cruise-control radar systems.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200660K • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 24, 2013
1
DATA SHEET • FLIP-CHIP SCHOTTKY DIODES: SINGLES AND ANTIPARALLEL PAIRS
Table 1. Flip-Chip Schottky Diodes Absolute Maximum Ratings
Parameter
Forward current
Operating temperature
Junction temperature
Storage temperature
Note:
Symbol
I
F
T
OP
T
J
T
STG
Minimum
Maximum
50
Units
mA
C
C
C
–65
–65
–65
+125
+175
+150
Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION:
Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times. The
DMK2790 series and DMK2308 series are Class 0 ESD devices.
Table 2. Flip-Chip Schottky Diodes Electrical Specifications (Note 1)
(T
OP
= +25
C
Per Junction, Unless Otherwise Noted)
Recommended
Frequency
(GHz)
20 to 100
V
B
@ 10
μA
(Note 2)
(V)
3
C
T
@ 0 V and 1 MHz
(Note 3)
(pF)
Min.
0.04
Max.
0.07
R
S
@ 10 mA
(Ω)
Max.
7
Min.
650
V
F
@ 1 mA
(mV)
Max.
750
Note 1:
Performance is guaranteed only under the conditions listed in this Table.
Note 2:
Breakdown voltage cannot be measured nondestructively in antiparallel configuration.
Note 3:
Junction capacitance plus 0.02 pF (overlay).
Electrical and Mechanical Specifications
The absolute maximum ratings of the flip-chip Schottky diodes
series are provided in Table 1. Electrical specifications are
specified in Table 2. Typical performance characteristics are
provided in Figures 1 through 4.
The SPICE models for the DMK2790 series and DMK2308 series
diodes are shown in Figures 5 and 6, respectively. Associated
SPICE model parameters are provided in Table 3.
Package dimensions are shown in Figures 7 and 8. All flip-chip
Schottky diodes are provided in standard waffle packs or gel
packs (refer to the Ordering Information Table on page 6).
Otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The DMK2790 series and DMK2308 series diodes are rated to
Moisture Sensitivity Level 1 (MSL1) at 260
C.
They can be used
for lead or lead-free soldering. For additional information, refer to
the Skyworks Application Note,
Solder Reflow Information,
document number 200164.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Package and Handling Information
Instructions on the shipping container label regarding exposure to
moisture after the container seal is broken must be followed.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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July 24, 2013 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200660K
DATA SHEET • FLIP-CHIP SCHOTTKY DIODES: SINGLES AND ANTIPARALLEL PAIRS
Typical Parameter Distribution on Wafer
65
60
55
50
45
40
35
30
25
20
15
10
5
0
680
0.080
0.076
0.072
0.068
0.064
0.060
0.056
0.052
0.048
0.044
0.040
0.036
0.032
0.028
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Device Capacitance (pF)
Number of Observations
V
F
= Mixer
DMK2790
x = 719 mV
σ
= 6.3 mV
700
720
740
Bias Voltage (V)
Figure 1. Capacitance/Voltage Variation
V
F
@ 1 mA (mV)
Figure 2. Histogram: Distribution of Forward Voltage
@ 1 mA
x = 0.063 pF
σ
= 0.002 pF
60
55
50
45
40
35
30
25
20
15
10
5
0
0.055
Number of Observations
C
J
= 0.0063 pF
Average
σ
= 0.0014 pF
0.060
0.065
0.070
x = 5.0
σ
= 0.25
165
154
143
132
121
110
99
88
77
66
55
44
33
22
11
0
4.0
4.5
Number of Observations
R
T
= Mixer
DMK2790
x = 5.0
Ω
σ
= 0.25
Ω
5.0
5.5
6.0
Capacitance @ 0 V (pF)
Figure 3. Histogram: Distribution of Total Capacitance
@0V
R
T
@ 10 mA (Ω)
Figure 4. Histogram: Distribution of Resistance
@ 10 mA
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200660K • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 24, 2013
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DATA SHEET • FLIP-CHIP SCHOTTKY DIODES: SINGLES AND ANTIPARALLEL PAIRS
Port
P_Cathode
port = 1
CAP
C
SH
C
= 0.02 pF
IND
L
S
RES
R
1
Diode
Area = 1
Model = Diode_Model
Mode = Nonlinear
Port
P_Anode
port = 2
CAP
C
SH
C
= 0.02 pF
Figure 5. DMK2790 Series SPICE Model
Diode
Area = 1
Model = Diode_Model
Mode = Nonlinear
IND
L
S
CAP
C
SH
C
= 0.026 pF
IND
L
S
RES
R
1
RES
R
1
Port
port = 1
Port
port = 2
CAP
C
SH
C
= 0.026 pF
Diode
Area = 1
Model = Diode_Model
Mode = Nonlinear
Figure 6. DMK2308 Series SPICE Model
Table 3. SPICE Model Parameters
R
1
(Ω)
3
Ls
(nH)
0.15
I
S
(A)
0.5E–12
R
S
(Ω)
4
n
1.05
T
D
(sec)
1E–11
C
JO
(pF)
0.05
M
0.26
E
G
(eV)
1.43
V
J
(V)
0.82
XTI
2
FC
0.5
B
V
(V)
4.0
I
BV
(A)
1E–05
The Epoxy Die Attach Process for GaAs Flip-
Chips
Epoxy Material.
Microelectronic grade conductive epoxy. For
attachment to soft boards, a stress absorbent conductive epoxy
must be used to produce a consistent process and reliable bond.
Cleanness.
Flexible or hard substrates must be clean and free of
contaminants before epoxy die attachment takes place.
Epoxy Dispensing.
Dispense epoxy dot size, approximately
0.008 inch, and a bondlike thickness of approximately 0.001 inch,
between die and substrate. See illustration below:
Die Attachment.
Flip the device, aligning bond pads to dispensed
dots, using an even force of approximately 15 to 30 grams. See
illustration below:
Epoxy Curing.
Cure per manufacturer’s recommendations.
10 Mil Gap
Attachment Quality.
The strength of the die attachment can be
verified by stressing the attachment joint to failure, using a die
shear test on a sample base. Increase the force of the shear test
equipment on the die until the component pops from the surface
of the circuit, recording a gram force value at the time of the
fracture from the substrate.
The value for pass or fail criteria is based on the contact bond pad
size of the die and compared against military standard
requirements.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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July 24, 2013 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200660K
DATA SHEET • FLIP-CHIP SCHOTTKY DIODES: SINGLES AND ANTIPARALLEL PAIRS
0.026 (0.66 mm)
± 0.001 (0.025 mm)
0.008
(0.20 mm)
± 0.001
(0.025 mm)
0.013 (0.33 mm)
± 0.001 (0.025 mm)
0.013
(0.33 mm)
± 0.001
(0.025 mm)
0.005 (0.13 mm)
± 0.001 (0.025 mm)
0.004 (0.10 mm)
± 0.001 (0.025 mm)
Max.
S2194
Figure 7. DMK2790 Series Package Dimensions
0.026 (0.66 mm)
± 0.001 (0.025 mm)
0.008
(0.20 mm)
± 0.001
(0.025 mm)
0.013 (0.33 mm)
± 0.001 (0.025 mm)
0.013
(0.33 mm)
± 0.001
(0.025 mm)
0.005 (0.13 mm)
± 0.001 (0.025 mm)
0.004 (0.10 mm)
± 0.001 (0.025 mm) Max.
S2195
Figure 8. DMK2308 Series Package Dimensions
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200660K • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 24, 2013
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