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HY62SF8100SLST-20I

Description
Standard SRAM, 128KX8, 200ns, CMOS, PDSO32, 8 X 13.40 MM, STSOP1-32
Categorystorage    storage   
File Size118KB,8 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
Download Datasheet Parametric View All

HY62SF8100SLST-20I Overview

Standard SRAM, 128KX8, 200ns, CMOS, PDSO32, 8 X 13.40 MM, STSOP1-32

HY62SF8100SLST-20I Parametric

Parameter NameAttribute value
MakerSK Hynix
Parts packaging codeTSOP1
package instructionTSOP1,
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time200 ns
JESD-30 codeR-PDSO-G32
JESD-609 codee6
length11.8 mm
memory density1048576 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128KX8
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)2.3 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN BISMUTH
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
width8 mm
HY62SF8100 Series
128Kx8bit full CMOS SRAM
DESCRIPTION
The HY62SF8100 is a high speed, low power and
1M bit full CMOS SRAM organized as 131,072
words by 8bit. The HY62SF8100 uses high
performance full CMOS process technology and
designed for high speed low power circuit
technology. It is particularly well suited for used in
high density low power system application. This
device has a data retention mode that guarantees
data to remain valid at a minimum power supply
voltage of 1.5V.
FEATURES
Fully static operation and Tri-state output
TTL compatible inputs and outputs
Battery backup(LL/SL-part)
-. 1.5V(min) data retention
Standard pin configuration
-. 32 - sTSOPI - 8X13.4(Standard)
Product
Voltage
Speed
No.
(V)
(ns)
HY62SF8100
1.7~2.3
120/150/200
HY62SF8100-I
1.7~2.3
120/150/200
Note 1. Blank : Commercial, I : Industrial
2. Current value is max.
Operation
Current/Icc(mA)
5
5
Standby Current(uA)
LL
SL
5
1
5
1
Temperature
(°C)
0~70
-40~85(I)
PIN CONNECTION
( Top View )
A0
BLOCK DIAGRAM
ROW
DECODER
SENSE AMP
I/O1
A11
A9
A8
A13
/WE
CS2
A15
Vcc
NC
A16
A14
A12
A7
A6
A5
A4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
/OE
A10
/CS1
DQ8
DQ7
DQ6
DQ5
DQ4
Vss
DQ3
DQ2
DQ1
A0
A1
A2
A3
ADD INPUT
BUFFER
BUFFER
COLUMN
DECODER
MEMORY ARRAY
128K x 8
WRITE DRIVER
A16
I/O8
/CS1
CONTROL
LOGIC
CS2
sTSOP I( Stanard )
/OE
/WE
PIN DESCRIPTION
Pin Name
/CS1
CS2
/WE
/OE
Pin Function
Chip Select 1
Chip Select 2
Write Enable
Output Enable
Pin Name
A0 ~ A16
I/O1 ~ I/O8
Vcc
Vss
Pin Function
Address Input
Data Input/Output
Power( 1.7V~2.3V )
Ground
This document is a general product description and is subject to change without notice. Hyundai Electronics does not assume any
responsibility for use of circuits described. No patent licenses are implied.
Rev.08 /Jun. 00
Hyundai Semiconductor

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