L7C161PC10 datasheet, PDF - EEWORLD Datasheet

L7C161PC10: DescriptionStandard SRAM, 16KX4, 10ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28; Categorystorage storage; File Size261KB，6 Pages; ManufacturerLOGIC Devices; Websitehttp://www.logicdevices.com/

Download Datasheet Parametric View All

L7C161PC10 Overview

Standard SRAM, 16KX4, 10ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	LOGIC Devices
Parts packaging code	DIP
package instruction	DIP, DIP28,.3
Contacts	28
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	10 ns
Other features	AUTOMATIC POWER-DOWN; TRANSPARENT WRITE
I/O type	SEPARATE
JESD-30 code	R-PDIP-T28
JESD-609 code	e0
length	35.052 mm
memory density	65536 bit
Memory IC Type	STANDARD SRAM
memory width	4
Humidity sensitivity level	3
Number of functions	1
Number of ports	1
Number of terminals	28
word count	16384 words
character code	16000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16KX4
Output characteristics	3-STATE
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.572 mm
Maximum standby current	0.00025 A
Minimum standby current	2 V
Maximum slew rate	0.17 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

Basics of using software developed by LM3S8962: The forum is going to hold an event, so I'll upload some materials needed for beginners. Beginners can take a look at these two documents, which explain everything from installing the program, running...; wanghongyang Microcontroller MCU

About KernelIoControl: What is the difference between the first parameter of KernelIoControl, IOCTL_HAL_RELEASE_SYSINTR and IOCTL_HAL_REQUEST_SYSINTR: that is, what is the difference between KernelIoControl(IOCTL_HAL_RELEAS...; thinkz Embedded System

The block0img.nb0 generated by wince6.0 of s3c2451 cannot be used: I encountered this problem on wince6.0: blockimg0.nb0 compiled by s3c2450 in VS2005 cannot be used. Has anyone encountered such a problem? I suspect it is a problem with the settings in the .bib file,...; yangtao0123 Embedded System

Experts please give me some advice: What is the difference between embedded and general software programming? Don't laugh at me for being a novice...; zserfv8210 Embedded System

How to check if the FPC flexible circuit board is broken or open: When we encounter the problem of open circuit/broken circuit on FPC, the easiest way is to check whether there is any broken circuit under a microscope. Most of the circuits can be seen through optica...; 方学放 PCB Design

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components