FIFO, 8KX9, 15ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | SHARP |
| package instruction | 0.300 INCH, PLASTIC, DIP-28 |
| Reach Compliance Code | unknown |
| Maximum access time | 15 ns |
| Other features | RETRANSMIT |
| JESD-30 code | R-PDIP-T28 |
| JESD-609 code | e0 |
| length | 34.7 mm |
| memory density | 73728 bit |
| memory width | 9 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 8192 words |
| character code | 8000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 8KX9 |
| Output characteristics | 3-STATE |
| Exportable | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 4.4 mm |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| LH540205D-15 | LH540205-15 | LH540205U-35 | LH540205U-25 | LH540205U-15 | LH540205U-20 | |
|---|---|---|---|---|---|---|
| Description | FIFO, 8KX9, 15ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | FIFO, 8KX9, 15ns, Asynchronous, CMOS, PDIP28, | FIFO, 8KX9, 35ns, Asynchronous, CMOS, PQCC32, 0.450 INCH, PLASTIC, LCC-32 | FIFO, 8KX9, 25ns, Asynchronous, CMOS, PQCC32, 0.450 INCH, PLASTIC, LCC-32 | FIFO, 8KX9, 15ns, Asynchronous, CMOS, PQCC32, 0.450 INCH, PLASTIC, LCC-32 | FIFO, 8KX9, 20ns, Asynchronous, CMOS, PQCC32, 0.450 INCH, PLASTIC, LCC-32 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | SHARP | SHARP | SHARP | SHARP | SHARP | SHARP |
| package instruction | 0.300 INCH, PLASTIC, DIP-28 | DIP, DIP28,.6 | 0.450 INCH, PLASTIC, LCC-32 | 0.450 INCH, PLASTIC, LCC-32 | 0.450 INCH, PLASTIC, LCC-32 | 0.450 INCH, PLASTIC, LCC-32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| Maximum access time | 15 ns | 15 ns | 35 ns | 25 ns | 15 ns | 20 ns |
| JESD-30 code | R-PDIP-T28 | R-PDIP-T28 | R-PQCC-J32 | R-PQCC-J32 | R-PQCC-J32 | R-PQCC-J32 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 73728 bit | 73728 bit | 73728 bit | 73728 bit | 73728 bit | 73728 bit |
| memory width | 9 | 9 | 9 | 9 | 9 | 9 |
| Number of terminals | 28 | 28 | 32 | 32 | 32 | 32 |
| word count | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
| character code | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| organize | 8KX9 | 8KX9 | 8KX9 | 8KX9 | 8KX9 | 8KX9 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | QCCJ | QCCJ | QCCJ | QCCJ |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | J BEND | J BEND |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | QUAD | QUAD | QUAD | QUAD |
| Other features | RETRANSMIT | - | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT |
| length | 34.7 mm | - | 14 mm | 14 mm | 14 mm | 14 mm |
| Number of functions | 1 | - | 1 | 1 | 1 | 1 |
| Maximum operating temperature | 70 °C | - | 70 °C | 70 °C | 70 °C | 70 °C |
| Output characteristics | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Exportable | NO | - | NO | NO | NO | NO |
| Parallel/Serial | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Maximum seat height | 4.4 mm | - | 3.5 mm | 3.5 mm | 3.5 mm | 3.5 mm |
| Temperature level | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 7.62 mm | - | 11.4 mm | 11.4 mm | 11.4 mm | 11.4 mm |
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