EE PLD, 15ns, PLS-Type, CMOS, PQCC28, PLASTIC, LCC-28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | AMD |
| Parts packaging code | QLCC |
| package instruction | QCCJ, LDCC28,.5SQ |
| Contacts | 28 |
| Reach Compliance Code | unknown |
| Architecture | PLS-TYPE |
| maximum clock frequency | 25 MHz |
| JESD-30 code | S-PQCC-J28 |
| JESD-609 code | e0 |
| Dedicated input times | 16 |
| Number of I/O lines | |
| Number of entries | 16 |
| Output times | 8 |
| Number of product terms | 48 |
| Number of terminals | 28 |
| Maximum operating temperature | 75 °C |
| Minimum operating temperature | |
| organize | 16 DEDICATED INPUTS, 0 I/O |
| Output function | REGISTERED |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC28,.5SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Programmable logic type | EE PLD |
| propagation delay | 15 ns |
| Certification status | Not Qualified |
| Maximum supply voltage | 5.25 V |
| Minimum supply voltage | 4.75 V |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL EXTENDED |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| PLSCE105H-37JC | PLS105-40JC | PLS105-40RC | PLS105-40PC | PLSCE105H-37RC | PLSCE105H-37PC | |
|---|---|---|---|---|---|---|
| Description | EE PLD, 15ns, PLS-Type, CMOS, PQCC28, PLASTIC, LCC-28 | OT PLD, 15ns, PLS-Type, TTL, PQCC28, PLASTIC, LCC-28 | OT PLD, 15ns, PLS-Type, TTL, PDIP28, 0.300 INCH, SKINNY, PLASTIC, DIP-28 | OT PLD, 15ns, PLS-Type, TTL, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | EE PLD, 15ns, PLS-Type, CMOS, PDIP28, 0.300 INCH, SKINNY, PLASTIC, DIP-28 | EE PLD, 15ns, PLS-Type, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | AMD | AMD | AMD | AMD | AMD | AMD |
| Parts packaging code | QLCC | QLCC | DIP | DIP | DIP | DIP |
| package instruction | QCCJ, LDCC28,.5SQ | QCCJ, LDCC28,.5SQ | DIP, DIP28,.3 | DIP, DIP28,.6 | DIP, DIP28,.3 | DIP, DIP28,.6 |
| Contacts | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| Architecture | PLS-TYPE | PLS-TYPE | PLS-TYPE | PLS-TYPE | PLS-TYPE | PLS-TYPE |
| maximum clock frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| JESD-30 code | S-PQCC-J28 | S-PQCC-J28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| Dedicated input times | 16 | 16 | 16 | 16 | 16 | 16 |
| Number of entries | 16 | 16 | 16 | 16 | 16 | 16 |
| Output times | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of product terms | 48 | 48 | 48 | 48 | 48 | 48 |
| Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 |
| Maximum operating temperature | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C |
| organize | 16 DEDICATED INPUTS, 0 I/O | 16 DEDICATED INPUTS, 0 I/O | 16 DEDICATED INPUTS, 0 I/O | 16 DEDICATED INPUTS, 0 I/O | 16 DEDICATED INPUTS, 0 I/O | 16 DEDICATED INPUTS, 0 I/O |
| Output function | REGISTERED | REGISTERED | REGISTERED | REGISTERED | REGISTERED | REGISTERED |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QCCJ | QCCJ | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | LDCC28,.5SQ | LDCC28,.5SQ | DIP28,.3 | DIP28,.6 | DIP28,.3 | DIP28,.6 |
| Package shape | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Programmable logic type | EE PLD | OT PLD | OT PLD | OT PLD | EE PLD | EE PLD |
| propagation delay | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| Minimum supply voltage | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | NO | NO | NO | NO |
| technology | CMOS | TTL | TTL | TTL | CMOS | CMOS |
| Temperature level | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | QUAD | QUAD | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |