IC OT PLD, 2.5 ns, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24, Programmable Logic Device
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | National Semiconductor(TI ) |
| package instruction | DIP, DIP24,.3 |
| Reach Compliance Code | unknown |
| Other features | PROGRAMMABLE OUTPUT POLARITY; SECURITY FUSE |
| Architecture | PAL-TYPE |
| JESD-30 code | R-PDIP-T24 |
| JESD-609 code | e0 |
| length | 31.915 mm |
| Dedicated input times | 16 |
| Number of I/O lines | |
| Number of entries | 16 |
| Output times | 4 |
| Number of product terms | 32 |
| Number of terminals | 24 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | |
| organize | 16 DEDICATED INPUTS, 0 I/O |
| Output function | COMBINATORIAL |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | -4.5 V |
| Programmable logic type | OT PLD |
| propagation delay | 2.5 ns |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| surface mount | NO |
| technology | ECL100K |
| Temperature level | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| PAL10016P4-2NC | PAL1016P4-2NC | PAL10016P4-2JM | PAL1016P4-2JC | PAL1016P4-2JM | PAL10016P4-2JC | |
|---|---|---|---|---|---|---|
| Description | IC OT PLD, 2.5 ns, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24, Programmable Logic Device | IC OT PLD, 2.5 ns, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24, Programmable Logic Device | IC OT PLD, 3 ns, CDIP24, CERAMIC, DIP-24, Programmable Logic Device | IC OT PLD, 2.5 ns, CDIP24, CERAMIC, DIP-24, Programmable Logic Device | IC OT PLD, 3 ns, CDIP24, CERAMIC, DIP-24, Programmable Logic Device | IC OT PLD, 2.5 ns, CDIP24, CERAMIC, DIP-24, Programmable Logic Device |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) |
| package instruction | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| Architecture | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE |
| JESD-30 code | R-PDIP-T24 | R-PDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| Dedicated input times | 16 | 16 | 16 | 16 | 16 | 16 |
| Number of entries | 16 | 16 | 16 | 16 | 16 | 16 |
| Output times | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of product terms | 32 | 32 | 32 | 32 | 32 | 32 |
| Number of terminals | 24 | 24 | 24 | 24 | 24 | 24 |
| Maximum operating temperature | 85 °C | 75 °C | 85 °C | 75 °C | 75 °C | 85 °C |
| organize | 16 DEDICATED INPUTS, 0 I/O | 16 DEDICATED INPUTS, 0 I/O | 16 DEDICATED INPUTS, 0 I/O | 16 DEDICATED INPUTS, 0 I/O | 16 DEDICATED INPUTS, 0 I/O | 16 DEDICATED INPUTS, 0 I/O |
| Output function | COMBINATORIAL | COMBINATORIAL | COMBINATORIAL | COMBINATORIAL | COMBINATORIAL | COMBINATORIAL |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | -4.5 V | -5.2 V | -4.5 V | -5.2 V | -5.2 V | -4.5 V |
| Programmable logic type | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD |
| propagation delay | 2.5 ns | 2.5 ns | 3 ns | 2.5 ns | 3 ns | 2.5 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | 5.08 mm | 5.715 mm | 5.715 mm | 5.715 mm | 5.715 mm |
| surface mount | NO | NO | NO | NO | NO | NO |
| technology | ECL100K | ECL10K | ECL | ECL | ECL | ECL |
| Temperature level | OTHER | COMMERCIAL EXTENDED | OTHER | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |