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PAL10016P4-2NC

Description
IC OT PLD, 2.5 ns, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24, Programmable Logic Device
CategoryProgrammable logic devices    Programmable logic   
File Size206KB,6 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
Stay tuned Parametric Compare

PAL10016P4-2NC Overview

IC OT PLD, 2.5 ns, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24, Programmable Logic Device

PAL10016P4-2NC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNational Semiconductor(TI )
package instructionDIP, DIP24,.3
Reach Compliance Codeunknown
Other featuresPROGRAMMABLE OUTPUT POLARITY; SECURITY FUSE
ArchitecturePAL-TYPE
JESD-30 codeR-PDIP-T24
JESD-609 codee0
length31.915 mm
Dedicated input times16
Number of I/O lines
Number of entries16
Output times4
Number of product terms32
Number of terminals24
Maximum operating temperature85 °C
Minimum operating temperature
organize16 DEDICATED INPUTS, 0 I/O
Output functionCOMBINATORIAL
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply-4.5 V
Programmable logic typeOT PLD
propagation delay2.5 ns
Certification statusNot Qualified
Maximum seat height5.08 mm
surface mountNO
technologyECL100K
Temperature levelOTHER
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm

PAL10016P4-2NC Related Products

PAL10016P4-2NC PAL1016P4-2NC PAL10016P4-2JM PAL1016P4-2JC PAL1016P4-2JM PAL10016P4-2JC
Description IC OT PLD, 2.5 ns, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24, Programmable Logic Device IC OT PLD, 2.5 ns, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24, Programmable Logic Device IC OT PLD, 3 ns, CDIP24, CERAMIC, DIP-24, Programmable Logic Device IC OT PLD, 2.5 ns, CDIP24, CERAMIC, DIP-24, Programmable Logic Device IC OT PLD, 3 ns, CDIP24, CERAMIC, DIP-24, Programmable Logic Device IC OT PLD, 2.5 ns, CDIP24, CERAMIC, DIP-24, Programmable Logic Device
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Maker National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI )
package instruction DIP, DIP24,.3 DIP, DIP24,.3 DIP, DIP24,.3 DIP, DIP24,.3 DIP, DIP24,.3 DIP, DIP24,.3
Reach Compliance Code unknown unknown unknown unknown unknown unknown
Architecture PAL-TYPE PAL-TYPE PAL-TYPE PAL-TYPE PAL-TYPE PAL-TYPE
JESD-30 code R-PDIP-T24 R-PDIP-T24 R-GDIP-T24 R-GDIP-T24 R-GDIP-T24 R-GDIP-T24
JESD-609 code e0 e0 e0 e0 e0 e0
Dedicated input times 16 16 16 16 16 16
Number of entries 16 16 16 16 16 16
Output times 4 4 4 4 4 4
Number of product terms 32 32 32 32 32 32
Number of terminals 24 24 24 24 24 24
Maximum operating temperature 85 °C 75 °C 85 °C 75 °C 75 °C 85 °C
organize 16 DEDICATED INPUTS, 0 I/O 16 DEDICATED INPUTS, 0 I/O 16 DEDICATED INPUTS, 0 I/O 16 DEDICATED INPUTS, 0 I/O 16 DEDICATED INPUTS, 0 I/O 16 DEDICATED INPUTS, 0 I/O
Output function COMBINATORIAL COMBINATORIAL COMBINATORIAL COMBINATORIAL COMBINATORIAL COMBINATORIAL
Package body material PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
encapsulated code DIP DIP DIP DIP DIP DIP
Encapsulate equivalent code DIP24,.3 DIP24,.3 DIP24,.3 DIP24,.3 DIP24,.3 DIP24,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply -4.5 V -5.2 V -4.5 V -5.2 V -5.2 V -4.5 V
Programmable logic type OT PLD OT PLD OT PLD OT PLD OT PLD OT PLD
propagation delay 2.5 ns 2.5 ns 3 ns 2.5 ns 3 ns 2.5 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 5.08 mm 5.08 mm 5.715 mm 5.715 mm 5.715 mm 5.715 mm
surface mount NO NO NO NO NO NO
technology ECL100K ECL10K ECL ECL ECL ECL
Temperature level OTHER COMMERCIAL EXTENDED OTHER COMMERCIAL EXTENDED COMMERCIAL EXTENDED OTHER
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 7.62 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm
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