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P0406FC3.3C-LF-T75-1

Description
Trans Voltage Suppressor Diode, 250W, 3.3V V(RWM), Bidirectional, 6 Element, Silicon, ROHS AND REACH COMPLIANT, FLIP CHIP-6
CategoryDiscrete semiconductor    diode   
File Size624KB,9 Pages
ManufacturerProTek Devices
Websitehttp://www.protekdevices.com/
Environmental Compliance  
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P0406FC3.3C-LF-T75-1 Overview

Trans Voltage Suppressor Diode, 250W, 3.3V V(RWM), Bidirectional, 6 Element, Silicon, ROHS AND REACH COMPLIANT, FLIP CHIP-6

P0406FC3.3C-LF-T75-1 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerProTek Devices
Parts packaging codeFLIP-CHIP
package instructionR-XBGA-B6
Contacts6
Reach Compliance Codecompliant
ECCN codeEAR99
Minimum breakdown voltage4 V
ConfigurationCOMMON CATHODE, 6 ELEMENTS
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 codeR-XBGA-B6
JESD-609 codee1
Maximum non-repetitive peak reverse power dissipation250 W
Number of components6
Number of terminals6
Package body materialUNSPECIFIED
Package shapeRECTANGULAR
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)270
polarityBIDIRECTIONAL
Certification statusNot Qualified
Maximum repetitive peak reverse voltage3.3 V
surface mountYES
technologyAVALANCHE
Terminal surfaceTin/Silver/Copper (Sn96.0Ag3.5Cu0.5)
Terminal formBALL
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
05155
Only One Name Means ProTek’Tion™
P0406FC3.3C - P0406FC36C
250w FliP ChiP tvs aRRay
DesCRiPtion
The P0406FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Dis-
charge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 require-
ments. These devices are ideally suited for handheld devices, PCMCIA and SMART cards.
This series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 250 Watts per line for an 8/20µs waveform. In addition, the
P0406FCxxC series features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their low inductance
virtually eliminates overshoot voltage due to package inductance.
FeatuRes
Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns
ESD Protection > 25 kilovolts
Available in Voltages Ranging from 3.3V to 36V
250 Watts Peak Pulse Power per Line (tp = 8/20µs)
Protection for 3 to 5 Lines
RoHS Compliant
REACH Compliant
aPPliCations
Cellular Phones
MCM Boards
Wireless Communication Circuits
IR LEDs
SMART & PCMCIA Cards
MeChaniCal ChaRaCteRistiCs
Standard EIA Chip Size: 0406
Approximate Weight: 0.73 milligrams
Lead-Free Plating
Solder Reflow Temperature:
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
Flammability Rating UL 94V-0
8mm Tape per EIA Standard 481
Top Contacts: Solder Bump 0.004” in Height (Nominal)
Pin ConFiGuRation
05155.R7 9/12
Page 1
www.protekdevices.com

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Description Trans Voltage Suppressor Diode, 250W, 3.3V V(RWM), Bidirectional, 6 Element, Silicon, ROHS AND REACH COMPLIANT, FLIP CHIP-6 Trans Voltage Suppressor Diode, 250W, 15V V(RWM), Bidirectional, 6 Element, Silicon, ROHS AND REACH COMPLIANT, FLIP CHIP-6 Trans Voltage Suppressor Diode, 250W, 8V V(RWM), Bidirectional, 6 Element, Silicon, ROHS AND REACH COMPLIANT, FLIP CHIP-6 Trans Voltage Suppressor Diode, 250W, 24V V(RWM), Bidirectional, 6 Element, Silicon, ROHS AND REACH COMPLIANT, FLIP CHIP-6 Trans Voltage Suppressor Diode, 250W, 36V V(RWM), Bidirectional, 6 Element, Silicon, ROHS AND REACH COMPLIANT, FLIP CHIP-6 Trans Voltage Suppressor Diode, 250W, 5V V(RWM), Bidirectional, 6 Element, Silicon, ROHS AND REACH COMPLIANT, FLIP CHIP-6 Trans Voltage Suppressor Diode, 250W, 12V V(RWM), Bidirectional, 6 Element, Silicon, ROHS AND REACH COMPLIANT, FLIP CHIP-6
Is it lead-free? Lead free Lead free Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to
Parts packaging code FLIP-CHIP FLIP-CHIP FLIP-CHIP FLIP-CHIP FLIP-CHIP FLIP-CHIP FLIP-CHIP
package instruction R-XBGA-B6 R-XBGA-B6 R-XBGA-B6 R-XBGA-B6 R-XBGA-B6 R-XBGA-B6 R-XBGA-B6
Contacts 6 6 6 6 6 6 6
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Minimum breakdown voltage 4 V 16.7 V 8.5 V 26.7 V 40 V 6 V 13.3 V
Configuration COMMON CATHODE, 6 ELEMENTS COMMON CATHODE, 6 ELEMENTS COMMON CATHODE, 6 ELEMENTS COMMON CATHODE, 6 ELEMENTS COMMON CATHODE, 6 ELEMENTS COMMON CATHODE, 6 ELEMENTS COMMON CATHODE, 6 ELEMENTS
Diode component materials SILICON SILICON SILICON SILICON SILICON SILICON SILICON
Diode type TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 code R-XBGA-B6 R-XBGA-B6 R-XBGA-B6 R-XBGA-B6 R-XBGA-B6 R-XBGA-B6 R-XBGA-B6
JESD-609 code e1 e1 e1 e1 e1 e1 e1
Maximum non-repetitive peak reverse power dissipation 250 W 250 W 250 W 250 W 250 W 250 W 250 W
Number of components 6 6 6 6 6 6 6
Number of terminals 6 6 6 6 6 6 6
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 270 270 270 270 270 270 270
polarity BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum repetitive peak reverse voltage 3.3 V 15 V 8 V 24 V 36 V 5 V 12 V
surface mount YES YES YES YES YES YES YES
technology AVALANCHE AVALANCHE AVALANCHE AVALANCHE AVALANCHE AVALANCHE AVALANCHE
Terminal surface Tin/Silver/Copper (Sn96.0Ag3.5Cu0.5) Tin/Silver/Copper (Sn96.0Ag3.5Cu0.5) Tin/Silver/Copper (Sn96.0Ag3.5Cu0.5) Tin/Silver/Copper (Sn96.0Ag3.5Cu0.5) Tin/Silver/Copper (Sn96.0Ag3.5Cu0.5) Tin/Silver/Copper (Sn96.0Ag3.5Cu0.5) Tin/Silver/Copper (Sn96.0Ag3.5Cu0.5)
Terminal form BALL BALL BALL BALL BALL BALL BALL
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Maker ProTek Devices ProTek Devices ProTek Devices - ProTek Devices ProTek Devices ProTek Devices
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