LH57128-25 datasheet, PDF - EEWORLD Datasheet

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LH57128-25: DescriptionOTP ROM, 16KX8, 250ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28; Categorystorage storage; File Size176KB，7 Pages; ManufacturerSHARP; Websitehttp://sharp-world.com/products/device/

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LH57128-25 Overview

OTP ROM, 16KX8, 250ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28

LH57128-25 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SHARP
package instruction	0.600 INCH, PLASTIC, DIP-28
Reach Compliance Code	unknown
Maximum access time	250 ns
JESD-30 code	R-PDIP-T28
JESD-609 code	e0
memory density	131072 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	28
word count	16384 words
character code	16000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

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LH57128-25 Related Products

	LH57128-25	LH57128J-25	LH57128N-25
Description	OTP ROM, 16KX8, 250ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	UVPROM, 16KX8, 250ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, GLASS SEALED, CERDIP-28	OTP ROM, 16KX8, 250ns, CMOS, PDSO28, 0.450 INCH, PLASTIC, SOP-28
Is it Rohs certified?	incompatible	incompatible	incompatible
Maker	SHARP	SHARP	SHARP
package instruction	0.600 INCH, PLASTIC, DIP-28	0.600 INCH, WINDOWED, GLASS SEALED, CERDIP-28	0.450 INCH, PLASTIC, SOP-28
Reach Compliance Code	unknown	unknown	unknown
Maximum access time	250 ns	250 ns	250 ns
JESD-30 code	R-PDIP-T28	R-CDIP-T28	R-PDSO-G28
JESD-609 code	e0	e0	e0
memory density	131072 bit	131072 bit	131072 bit
Memory IC Type	OTP ROM	UVPROM	OTP ROM
memory width	8	8	8
Number of functions	1	1	1
Number of terminals	28	28	28
word count	16384 words	16384 words	16384 words
character code	16000	16000	16000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C
organize	16KX8	16KX8	16KX8
Output characteristics	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY
encapsulated code	DIP	DIP	SOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	SMALL OUTLINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V
surface mount	NO	NO	YES
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	GULL WING
Terminal location	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

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