LH5763J-70 datasheet, PDF - EEWORLD Datasheet

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LH5763J-70: DescriptionUVPROM, 8KX8, 70ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, GLASS SEALED, CERDIP-28; Categorystorage storage; File Size174KB，7 Pages; ManufacturerSHARP; Websitehttp://sharp-world.com/products/device/

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LH5763J-70 Overview

UVPROM, 8KX8, 70ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, GLASS SEALED, CERDIP-28

LH5763J-70 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SHARP
package instruction	0.600 INCH, WINDOWED, GLASS SEALED, CERDIP-28
Reach Compliance Code	unknown
Maximum access time	70 ns
JESD-30 code	R-CDIP-T28
JESD-609 code	e0
memory density	65536 bit
Memory IC Type	UVPROM
memory width	8
Number of functions	1
Number of terminals	28
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8KX8
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

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LH5763J-70 Related Products

	LH5763J-70	LH5763-90	LH5763J-90
Description	UVPROM, 8KX8, 70ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, GLASS SEALED, CERDIP-28	OTP ROM, 8KX8, 90ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	UVPROM, 8KX8, 90ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, GLASS SEALED, CERDIP-28
Is it Rohs certified?	incompatible	incompatible	incompatible
Maker	SHARP	SHARP	SHARP
package instruction	0.600 INCH, WINDOWED, GLASS SEALED, CERDIP-28	0.600 INCH, PLASTIC, DIP-28	0.600 INCH, WINDOWED, GLASS SEALED, CERDIP-28
Reach Compliance Code	unknown	unknown	unknown
Maximum access time	70 ns	90 ns	90 ns
JESD-30 code	R-CDIP-T28	R-PDIP-T28	R-CDIP-T28
JESD-609 code	e0	e0	e0
memory density	65536 bit	65536 bit	65536 bit
Memory IC Type	UVPROM	OTP ROM	UVPROM
memory width	8	8	8
Number of functions	1	1	1
Number of terminals	28	28	28
word count	8192 words	8192 words	8192 words
character code	8000	8000	8000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C
organize	8KX8	8KX8	8KX8
Output characteristics	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	5.25 V	5.25 V	5.25 V
Minimum supply voltage (Vsup)	4.75 V	4.75 V	4.75 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V
surface mount	NO	NO	NO
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal location	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

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