LH5764-25 datasheet, PDF - EEWORLD Datasheet

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LH5764-25: DescriptionOTP ROM, 8KX8, 250ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28; Categorystorage storage; File Size175KB，7 Pages; ManufacturerSHARP; Websitehttp://sharp-world.com/products/device/

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LH5764-25 Overview

OTP ROM, 8KX8, 250ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28

LH5764-25 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SHARP
package instruction	0.600 INCH, PLASTIC, DIP-28
Reach Compliance Code	unknown
Maximum access time	250 ns
JESD-30 code	R-PDIP-T28
JESD-609 code	e0
memory density	65536 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	28
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

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LH5764-25 Related Products

	LH5764-25	LH5764N-25	LH5764J-20	LH5764J-25
Description	OTP ROM, 8KX8, 250ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	OTP ROM, 8KX8, 250ns, CMOS, PDSO28, 0.450 INCH, PLASTIC, SOP-28	UVPROM, 8KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, GLASS SEALED, CERDIP-28	UVPROM, 8KX8, 250ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, GLASS SEALED, CERDIP-28
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
package instruction	0.600 INCH, PLASTIC, DIP-28	0.450 INCH, PLASTIC, SOP-28	0.600 INCH, WINDOWED, GLASS SEALED, CERDIP-28	0.600 INCH, WINDOWED, GLASS SEALED, CERDIP-28
Reach Compliance Code	unknown	unknown	unknown	unknown
Maximum access time	250 ns	250 ns	200 ns	250 ns
JESD-30 code	R-PDIP-T28	R-PDSO-G28	R-CDIP-T28	R-CDIP-T28
JESD-609 code	e0	e0	e0	e0
memory density	65536 bit	65536 bit	65536 bit	65536 bit
Memory IC Type	OTP ROM	OTP ROM	UVPROM	UVPROM
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of terminals	28	28	28	28
word count	8192 words	8192 words	8192 words	8192 words
character code	8000	8000	8000	8000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
organize	8KX8	8KX8	8KX8	8KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	SOP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING	THROUGH-HOLE	THROUGH-HOLE
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Maker	SHARP	-	SHARP	SHARP

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