IDT79RC64V145BGI datasheet, PDF

IDT79RC64V145BGI: DescriptionMultifunction Peripheral, PBGA388, 35 X 35 MM, PLASTIC, BGA-388; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，23 Pages; ManufacturerIDT (Integrated Device Technology)

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IDT79RC64V145BGI Overview

Multifunction Peripheral, PBGA388, 35 X 35 MM, PLASTIC, BGA-388

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
Parts packaging code	BGA
package instruction	35 X 35 MM, PLASTIC, BGA-388
Contacts	388
Reach Compliance Code	not_compliant
Address bus width	64
boundary scan	YES
Bus compatibility	PCI; RC4XXX; RC5XXX
maximum clock frequency	83 MHz
External data bus width	64
JESD-30 code	S-PBGA-B388
JESD-609 code	e0
length	35 mm
Number of I/O lines	17
Number of terminals	388
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA388,26X26,50
Package shape	SQUARE
Package form	GRID ARRAY
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	2.54 mm
Maximum slew rate	760 mA
Maximum supply voltage	3.465 V
Minimum supply voltage	3.135 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
width	35 mm

	IDT79RC64V145BGI	IDT79RC64V145BG
Description	Multifunction Peripheral, PBGA388, 35 X 35 MM, PLASTIC, BGA-388	Multifunction Peripheral, PBGA388, 35 X 35 MM, PLASTIC, BGA-388
Is it Rohs certified?	incompatible	incompatible
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Parts packaging code	BGA	BGA
package instruction	35 X 35 MM, PLASTIC, BGA-388	35 X 35 MM, PLASTIC, BGA-388
Contacts	388	388
Reach Compliance Code	not_compliant	not_compliant
Address bus width	64	64
boundary scan	YES	YES
Bus compatibility	PCI; RC4XXX; RC5XXX	PCI; RC4XXX; RC5XXX
maximum clock frequency	83 MHz	83 MHz
External data bus width	64	64
JESD-30 code	S-PBGA-B388	S-PBGA-B388
JESD-609 code	e0	e0
length	35 mm	35 mm
Number of I/O lines	17	17
Number of terminals	388	388
Maximum operating temperature	85 °C	70 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA
Encapsulate equivalent code	BGA388,26X26,50	BGA388,26X26,50
Package shape	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY
power supply	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified
Maximum seat height	2.54 mm	2.54 mm
Maximum slew rate	760 mA	760 mA
Maximum supply voltage	3.465 V	3.465 V
Minimum supply voltage	3.135 V	3.135 V
Nominal supply voltage	3.3 V	3.3 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM
width	35 mm	35 mm

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