MC10H164PDS datasheet, PDF - EEWORLD Datasheet

MC10H164PDS: DescriptionIC,LOGIC MUX,SINGLE,8-INPUT,ECL,DIP,16PIN,PLASTIC; Categorylogic logic; File Size109KB，2 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MC10H164PDS Overview

IC,LOGIC MUX,SINGLE,8-INPUT,ECL,DIP,16PIN,PLASTIC

	MC10H164PDS	MC10H164L	MC10H164LD	MC10H164PS	MC10H164PD
Description	IC,LOGIC MUX,SINGLE,8-INPUT,ECL,DIP,16PIN,PLASTIC	IC,LOGIC MUX,SINGLE,8-INPUT,ECL,DIP,16PIN,CERAMIC	IC,LOGIC MUX,SINGLE,8-INPUT,ECL,DIP,16PIN,CERAMIC	IC,LOGIC MUX,SINGLE,8-INPUT,ECL,DIP,16PIN,PLASTIC	IC,LOGIC MUX,SINGLE,8-INPUT,ECL,DIP,16PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	NXP	NXP	NXP	NXP	NXP
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
JESD-30 code	-	R-XDIP-T16	R-XDIP-T16	R-PDIP-T16	R-PDIP-T16
JESD-609 code	-	e0	e0	e0	e0
Logic integrated circuit type	-	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER
Number of functions	-	1	1	1	1
Number of entries	-	8	8	8	8
Number of terminals	-	16	16	16	16
Maximum operating temperature	-	70 °C	70 °C	70 °C	70 °C
Package body material	-	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	DIP	DIP	DIP	DIP
Encapsulate equivalent code	-	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	IN-LINE	IN-LINE	IN-LINE	IN-LINE
surface mount	-	NO	NO	NO	NO
technology	-	ECL	ECL	ECL	ECL
Temperature level	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	-	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	-	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	-	DUAL	DUAL	DUAL	DUAL

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