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●
Structure
●
Product
●
Type
●
Figure
1.
2.
3.
4.
5.
6.
Silicon Monolithic Integrated Circuit
7 x 7 Matrix LED DRIVER for Mobile Phone
BH6948GU
Highly effective Charge Pump circuit that can be switched 1 time, 1.5 times,
and 2 times pressure automatically. (190mA / MAX)
7-channel LED DRIVER that can contorol PWM
(IoMAX = 31mA/ch, Current step = 1mA)
7-channel PMOS-SW controlled with 1/8TDMA
It is possible to make 49(7X7) LED shine by PMOS-SW and the LED driver
SPI Interface
Wafer Level CSP pacage for space constrained applications
62pin (4.1mm×4.1 mm height = 1.0mm-max)
●
Absolute Maximum Ratings (Ta = 25℃)
Parameter
Maximum Supply Voltage
Power Dissipation
※
Operating Temperature Range
Storage Temperature Range
※
Symbol
V
MAX
Pd
T
opr
T
stg
Rating
5.5
1.47
-30½+85
-55½+125
Unit
V
W
℃
℃
When using more than at Ta=25℃, it is reduced 14.7mW per 1℃.
When RHOM specification board 50mm X 58mm mounting.
Cautions : A device may be destroyed when it is used on the conditions beyond this value.
Moreover, the usual operation is not guaranteed.
●
Operating Conditions
Parameter
VBAT1 Voltage
※1
VBATCP Voltage
※1
DVDD1 Voltage
※2
DVDD2 Voltage
※2
※1
49LED lighting
※2
DVDD1
≦
DVDD2
◎This
product is not especially designed to be protected from radioactivity.
Status of this document.
The Japanese version of this document is the formal specification.
A customer may use this translation version only for reference to help reading the formal version.
If there are any differences in translation version of this document, formal version takes priority.
Symbol
V
BAT1
V
BATCP
V
DVDD1
V
DVDD2
Range
3.15½4.5
1.7½3.1
2.7½3.1
Unit
V
V
V
V
Block
VREF/BGR
DCDC
I/O
Logic
REV. B
2/4
●
Electrical Characteristics
(Unless otherwise specified, Ta=25℃,VBAT1=VBATCP=VBATCP1-3=3.6V,DVDD1=1.8V,DVDD2=2.85V)
Parameter
Stand-by Circuit Current
Circuit
Current
DC-DC Converter Current1
DC-DC Converter Current2
DC-DC Converter Current3
CPOUT Voltage1
CPOUT Output Current1
CPOUT Voltage2
CPOUT Output Current2
DCDC
Converter
CPOUT Voltage3
CPOUT Output Current3
CPOUT Voltage4
CPOUT Output Current4
Oscillator Frequency
PMOS Switch
Leak Current when OFF
(SW1½7 total)
Output Current1
Output Current2、3
Current Driver
(Lo-Mode,
LED1~7)
Output Current4½31
Output Current matching1
Output Current matching2
Leak Current when OFF
(SW1½7 total)
Current Driver
(RGB with PWM
:LED1~7)
Under Voltage
Lockout
Soft-Start
Short Circuit
Protector
Over Current
Protector
Over Voltage
Protector
LED Dropout
Detector
PWM on duty1
PWM on duty2
PWM on duty3
UVLO Threshold
UVLO Hysteresis
SS Mode Time
SCP Threshold
Delay Time
Reset Time
OCP Threshold
OVP Threshold
Detect Voltage
Input “H” Level
SPI I/F
Input “L” Level
“H” Level Input Current
“L” Level Input Current
Input ”H” Level
RSTB
Input “L” Level
”H” Level Input Current
“L” Level Input Current
Symbol
I
ST
I
QCP1
I
QCP2
I
QCP3
V
CP1
I
CP1
V
CP2
I
CP2
V
CP3
I
CP3
V
CP4
I
CP4
fosc
I
LEAKP
I
O
1
I
O2
I
O4
Mat1
Mat2
I
LEAK
PWMD1
PWMD2
PWMD3
V
UVLO
V
UVLO
T
SS
V
SCP
T
DLY
T
RST
I
OCP
Vovp
V
DR
V
IH
V
IL
I
IH
I
IH
V
IH
V
IL
I
IH
I
IL
MIN
-
-
-
-
4.55
-
4.55
-
5.1
-
5.1
-
0.96
-
-8.5
-8.0
-7.0
-
-
-
1.54
43.7
84.6
2.0
50
1.6
1.0
8
80
-
5.50
0.36
1.4
-0.3
-
-
1.4
-0.3
-
-
Spec
TYP
0
0.93
6.4
4.8
4.75
-
4.75
-
5.3
-
5.3
-
1.20
-
-
-
-
-
-
-
5.04
47.2
88.1
2.25
100
2.0
1.2
10
100
790
5.62
0.40
-
-
0
0
-
-
0
0
MAX
8.8
1.4
9.6
7.2
4.95
190
4.95
190
5.5
190
5.5
190
1.44
7.0
+8.5
+8.0
+7.0
11.5
10
7.0
8.54
40.7
91.6
2.6
150
2.4
1.4
12
120
-
5.74
0.44
DVDD1
+0.3
0.4
1
1
DVDD1
+0.3
0.4
1
1
Units
uA
mA
mA
mA
V
mA
V
mA
V
mA
V
mA
MHz
μA
%
%
%
%
%
uA
%
%
%
V
mV
ms
V
mS
mS
mA
V
V
V
V
uA
uA
V
V
uA
uA
Condition
Stand-by mode (RSTB=”H”)
1times mode
1.5times mode (CPOUT=4.75V)
2times mode (CPOUT=4.75V)
1.5times mode No Load
1.5times mode, VCPOUT>4V
49 LED lighting
2.0times mode No Load
2.0times mode, VCPOUT>4V
49 LED lighting
1.5times mode No Load
1.5times mode, VCPOUT>4V
49 LED lighting
2.0times mode No Load
2.0times mode, VCPOUT>4V
49 LED lighting
When
35H(MATRIXCNT)bit0(START)=0
I=1mA Setting
I=2½3mA Setting
I=4½31mA Setting
I=1½3mA Setting,
Mat1=(IoMax-IoMin)/IoMinx100
I=4½31mA Setting
Mat2=(IoMax-IoMin)/IoMinx100
When
35H(MATRIXCNT)bit0(START)=0
PWM1½7SET=5digit
PWM1½7SET=32digit
PWM1½7SET=58digit
VBAT falling
CPOUT falling
REV. B
3/4
●
Block Diagram
VBAT
VBATCP
VBATCP1
VBATCP2
VBATCP3
C1P
C2M
C1M
C2P
VBAT
D2
●
GNDCP
CPIN2
Terminal List
CPIN1
F8
F1 E2 F2
G1
H6
H7
H4
H5
H2
G8
VBAT1
FBGA62R1 FBGA62R1
BALL Name BALL No.
TEST1
H3
G3
FUNCTION
Test terminal 1 (※ Please be sure connect to GND)
Power supply for SW1½7
P-MOS SW3 output
P-MOS SW1 output
P-MOS SW7 output
LED1 driver output
GND for LED1½3
Test terminal 2 (※ Please be sure connect to GND)
P-MOS SW5 output
P-MOS SW4 output
Power supply for SW1½7
P-MOS SW2 output
LED7 driver output
LED6 driver output
LED2 driver output
LED3 driver output
GND for VREF, IREF
P-MOS SW6 output
LED Constant Current Driver Current setting Terminal
Test terminal 3 (※ Please be sure connect to GND)
GND for LED4½7
LED5 driver output
LED4 driver output
Stabilization Power Supply for IREF, VSATDET, OSC
Power supply for BGR, VREF, SCP
Standard for OSC, VSATDET, IREF
Reset terminal
GND terminal
4 line serial interface CLK
4 line serial interfac DATAIN
GND for internal logic
Device version
Power supply for charge pump
GND terminal
GND terminal
4 line serial interface CE
4 line serial interface DATAOUT
Power supply for interface
Power supply for internal logic
Power Supply for Charge Pump Section
Power Supply for Charge Pump Section
TEST terminal 4 (※ Please be sure connect to GND)
Test output terminal (※ Please should be left open when used)
GND terminal
GND terminal
Power Supply for Charge Pump section
Power Supply for Charge Pump section Step-up Voltage Circuit
TEST terminal 5 (※ Please be sure to connect to VBAT)
Charge Pump section Constant Voltage Output
GND terminal
GND terminal
GND terminal
GND terminal
GND for Charge pump section
GND terminal
Charge Pump section Flying Capacitor2 on Side of Plus
Charge Pump section Constant Voltage Output
Charge Pump section Flying Capacitor1 on Side of Plus
Charge Pump section Flying Capacitor2 on Side of Minus
Power Supply for Charge Pump section Step-up Voltage Circuit
Charge Pump section Flying Capacitor1 on Side of Minus
GND terminal
CPOUT 1
A1
A2
A3
A4
A5
A6
A7
A8
B1
B2
B3
B4
B5
B6
B7
B8
C1
C2
C4
C5
C6
C7
C8
D1
D2
D3
D4
D5
D6
D7
D8
E1
E2
E3
E4
E5
E6
E7
E8
F1
F2
F3
F4
F6
F7
F8
G1
G2
G3
G4
G5
G6
G7
G8
H1
H2
H3
H4
H5
H6
H7
H8
Charge pump
x1, x1.5, x2
CPOUT 2
CPOUTSW
SW3
VREF12
D3
D1
BGR /
VREF
VREF
OSC
CPOUTSW
CPOUTSW1
T06
A2
B3
SW1
SW7
LED1
GNDLE2
IREF
C4
C1
SW7
SW 6
SW5
SW4
SW3
SW2
SW1
A5
C2
IREF
T05
T04
Logic
TDMA
T03
T02
T01
T00
TEST2
B1
GNDA
D5,E3,E4,
F6,F7,G4,
GND
G5,G6,G7,
H1,H8
SW5
B2
SW4
A3
B4
A4
DVDD1
E7
CPOUTSW1
SW2
LED7
LED6
LED2
LED3
GNDA
SW6
IREF
TEST3
GNDLE3
LED5
RSTB
D4
CE
E5
CLK
D6
DI
D7
DO
E6
SPI/IF
TDMA
PWM
SLOPE
31mA /ch
1 mA step
TDMA
TDMA
TDMA
GNDLE 2
A7
LED7
LED6
B5
B6
LED5
LED4
LED3
C7
C8
B8
B7
A6
DGND
D8
TDMA
TDMA
TDMA
DVER
LED2
LED1
E1
TDMA
PWM
DVDD2
E8
G2
A1
A8
C5
F3
TEST1 TEST2 TEST3 TEST4 TEST5
VBAT
F4
GNDLE3
C6
LED4
VREF
TEST0
VBAT1
VREF12
●
Package Outline
RSTB
GND
CLK
DI
DGND
BH6948
DVER
VBATCP2
GND
GND
Lot No.
CE
DO
DVDD1
DVDD2
VBATCP1
VBATCP3
TEST4
TESTO
GND
GND
VBATCP
CPIN1
TEST5
CPOUT2
GND
GND
GND
GND
GNDCP
GND
C2P
CPOUT1
C1P
C2M
CPIN2
C1M
REV. B
GND
4/4
●
Use-related Cautions
(1) Absolute maximum ratings
If applied voltage (V
MAX
), operating temperature range (Topr), or other absolute maximum ratings are exceeded, there is a risk of
damage. Since it is not possible to identify short, open, or other damage modes, if special modes in which absolute maximum
ratings are exceeded are assumed, consider applying fuses or other physical safety measures.
(2) Power supply lines
In the design of the board pattern, make power supply and GND line wiring low impedance.
When doing so, although the digital power supply and analog power supply are the same potential, separate the digital power
supply pattern and analog power supply pattern to deter digital noise from entering the analog power supply due to the common
impedance of the wiring patterns. Similarly take pattern design into account for GND lines as well.
When there is a small signal GND and a large current GND, it is recommended that you separate the large current GND pattern
and small signal GND pattern and provide single point grounding at the reference point of the set so that voltage variation due to
resistance components of the pattern wiring and large currents do not cause the small signal GND voltage to change. Take care
that the GND wiring pattern of externally attached components also does not change.
Furthermore, for all power supply pins of the LSI, in conjunction with inserting capacitors between power supply and GND pins,
when using electrolytic capacitors, determine constants upon adequately confirming that capacitance loss occurring at low
temperatures is not a problem for various characteristics of the capacitors used.
(3) GND voltage
Make the potential of a GND pin such that it will be the lowest potential even if operating below that. In addition, confirm that
there are no pins for which the potential becomes less than a GND by actually including transition phenomena.
(4) Shorts between pins and misinstallation
When installing in the set board, pay adequate attention to orientation and placement discrepancies of the LSI. If it is installed
erroneously, there is a risk of LSI damage. There also is a risk of damage if it is shorted by a foreign substance getting between
pins or between a pin and a power supply or GND.
(5) Operation in strong magnetic fields
Be careful when using the LSI in a strong magnetic field, since it may malfunction.
(6) Input pins
Parasitic elements inevitably are formed on an LSI structure due to potential relationships. Because parasitic elements operate,
they give rise to interference with circuit operation and may be the cause of malfunctions as well as damage. Accordingly, take
care not to apply a lower voltage than GND to an input pin or use the LSI in other ways such that parasitic elements operate.
Moreover, do not apply a voltage to an input pin when the power supply voltage is not being applied to the LSI. Furthermore,
when the power supply voltage is being applied, make each input pin a voltage less than the power supply voltage as well as within
the guaranteed values of electrical characteristics.
(7) Externally attached capacitors
When using ceramic capacitors for externally attached capacitors, determine constants upon taking into account a lowering of the
rated capacitance due to DC bias and capacitance change due to factors such as temperature.
(8) Thermal shutdown circuit (TSD)
When the junction temperature becomes higher, the thermal shutdown circuit operates and turns the switch OFF. The thermal
shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or
guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation.
(9) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual
states of use.
(10)Test
terminal and unused terminal processing
Please process a test terminal and unused terminal according to explanations of the function manual and the application note, etc.
to be unquestionable while real used. Moreover, please inquire of the person in charge of our company about the terminal without
the explanation especially.
(11)Rush
current
For ICs with more than one power supply, it is possible that rush current may flow instantaneously due to the internal powering
sequence and delays. Therefore, give special consideration to power coupling capacitance, power wring, width of GND wiring, and
routing of wiring.
REV. B
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, commu-
nication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of
any of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
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obtain a license or permit under the Law.
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More detail product informations and catalogs are available, please contact us.
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R0039A