Junction Temperature .....................................................+150NC
Operating Temperature Range .......................... -40NC to +85NC
Storage Temperature Range............................ -65NC to +150NC
Bump Temperature (soldering) Reflow ...........................+230NC
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
"Open source" can mean many things in hardware design: open specifications, free designs, designs where patent/copyright protection has expired...Therefore, the value of open source hardware varies. M...
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Recently,
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introduction
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introduction
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Radio frequency (RF) testing is a critical step in embedded system development and verification, particularly in industries such as telecommunications, aerospace, automotive, and the Internet...[Details]
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RF/Wirelessly
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