Standard SRAM, 16KX1, 25ns, ECL, CDIP20, CERDIP-20
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Hitachi （Renesas ） |
| Parts packaging code | DIP |
| package instruction | DIP, DIP20,.3 |
| Contacts | 20 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 25 ns |
| I/O type | SEPARATE |
| JESD-30 code | R-GDIP-T20 |
| JESD-609 code | e0 |
| length | 25.16 mm |
| memory density | 16384 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 1 |
| Negative supply voltage rating | -5.2 V |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 20 |
| word count | 16384 words |
| character code | 16000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 75 °C |
| Minimum operating temperature | |
| organize | 16KX1 |
| Output characteristics | OPEN-EMITTER |
| Exportable | NO |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP20,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | -5.2 V |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| surface mount | NO |
| technology | ECL |
| Temperature level | COMMERCIAL EXTENDED |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| HM10480 | HM10480F | |
|---|---|---|
| Description | Standard SRAM, 16KX1, 25ns, ECL, CDIP20, CERDIP-20 | Standard SRAM, 16KX1, 25ns, ECL, CDFP20, FP-20 |
| Is it lead-free? | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | Hitachi （Renesas ） | Hitachi （Renesas ） |
| Parts packaging code | DIP | DFP |
| package instruction | DIP, DIP20,.3 | DFP, FL20,.3 |
| Contacts | 20 | 20 |
| Reach Compliance Code | unknown | unknown |
| ECCN code | EAR99 | EAR99 |
| Maximum access time | 25 ns | 25 ns |
| I/O type | SEPARATE | SEPARATE |
| JESD-30 code | R-GDIP-T20 | R-GDFP-F20 |
| JESD-609 code | e0 | e0 |
| memory density | 16384 bit | 16384 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM |
| memory width | 1 | 1 |
| Negative supply voltage rating | -5.2 V | -5.2 V |
| Number of functions | 1 | 1 |
| Number of ports | 1 | 1 |
| Number of terminals | 20 | 20 |
| word count | 16384 words | 16384 words |
| character code | 16000 | 16000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 75 °C | 75 °C |
| organize | 16KX1 | 16KX1 |
| Output characteristics | OPEN-EMITTER | OPEN-EMITTER |
| Exportable | NO | NO |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | DFP |
| Encapsulate equivalent code | DIP20,.3 | FL20,.3 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | FLATPACK |
| Parallel/Serial | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED |
| power supply | -5.2 V | -5.2 V |
| Certification status | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | 2.35 mm |
| surface mount | NO | YES |
| technology | ECL | ECL |
| Temperature level | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | FLAT |
| Terminal pitch | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
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