Pin Diode, 30V V(BR), Silicon, HERMETIC SEALED, GLASS PACKAGE-2
| Parameter Name | Attribute value |
| Maker | MACOM |
| package instruction | O-LALF-W2 |
| Contacts | 2 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Other features | LOW TURN ON POWER |
| application | LIMITER |
| Minimum breakdown voltage | 30 V |
| Shell connection | ISOLATED |
| Configuration | SINGLE |
| Maximum diode capacitance | 0.3 pF |
| Diode component materials | SILICON |
| Maximum diode forward resistance | 2 Ω |
| Diode type | PIN DIODE |
| JESD-30 code | O-LALF-W2 |
| Minority carrier nominal lifetime | 0.01 µs |
| Number of components | 1 |
| Number of terminals | 2 |
| Package body material | GLASS |
| Package shape | ROUND |
| Package form | LONG FORM |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | POSITIVE-INTRINSIC-NEGATIVE |
| Terminal form | WIRE |
| Terminal location | AXIAL |
| MA47089 | |
|---|---|
| Description | Pin Diode, 30V V(BR), Silicon, HERMETIC SEALED, GLASS PACKAGE-2 |
| Maker | MACOM |
| package instruction | O-LALF-W2 |
| Contacts | 2 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Other features | LOW TURN ON POWER |
| application | LIMITER |
| Minimum breakdown voltage | 30 V |
| Shell connection | ISOLATED |
| Configuration | SINGLE |
| Maximum diode capacitance | 0.3 pF |
| Diode component materials | SILICON |
| Maximum diode forward resistance | 2 Ω |
| Diode type | PIN DIODE |
| JESD-30 code | O-LALF-W2 |
| Minority carrier nominal lifetime | 0.01 µs |
| Number of components | 1 |
| Number of terminals | 2 |
| Package body material | GLASS |
| Package shape | ROUND |
| Package form | LONG FORM |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | POSITIVE-INTRINSIC-NEGATIVE |
| Terminal form | WIRE |
| Terminal location | AXIAL |