IDT707288L25PFI datasheet, PDF

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IDT707288L25PFI: DescriptionDual-Port SRAM, 64KX16, 25ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM, TQFP-100; Categorystorage storage; File Size133KB，16 Pages; ManufacturerIDT (Integrated Device Technology)

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IDT707288L25PFI Overview

Dual-Port SRAM, 64KX16, 25ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM, TQFP-100

IDT707288L25PFI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
Parts packaging code	QFP
package instruction	14 X 14 MM, 1.40 MM, TQFP-100
Contacts	100
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	25 ns
Other features	AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE; INTERRUPT FLAG
I/O type	COMMON
JESD-30 code	S-PQFP-G100
JESD-609 code	e0
length	14 mm
memory density	1048576 bit
Memory IC Type	DUAL-PORT SRAM
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of ports	2
Number of terminals	100
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	64KX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Encapsulate equivalent code	QFP100,.63SQ,20
Package shape	SQUARE
Package form	FLATPACK
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	240
power supply	5 V
Certification status	Not Qualified
Maximum seat height	1.6 mm
Maximum standby current	0.01 A
Minimum standby current	4.5 V
Maximum slew rate	0.31 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn85Pb15)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	20
width	14 mm

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HIGH-SPEED

64K x 16 BANK-SWITCHABLE

DUAL-PORTED SRAM WITH

EXTERNAL BANK SELECTS

IDT707288S/L

Features

64K x 16 Bank-Switchable Dual-Ported SRAM Architecture

– Four independent 16K x 16 banks

– 1 Megabit of memory on chip

Fast asynchronous address-to-data access time: 15ns

User-controlled input pins included for bank selects

Independent port controls with asynchronous address &

data busses

Four 16-bit mailboxes available to each port for inter-

processor communications; interrupt option

Interrupt flags with programmable masking

Dual Chip Enables allow for depth expansion without

external logic

and

are available for x8 or x16 bus matching

TTL-compatible, single 5V (±10%) power supply

Available in a 100-pin Thin Quad Flatpack (14mm x 14mm)

Functional Block Diagram

MUX

R/W

16Kx16

MEMORY

ARRAY

(BANK 0)

MUX

I/O

8L-15L

I/O

0L-7L

I/O

CONTROL

MUX

16Kx16

MEMORY

ARRAY

(BANK 1)

MUX

I/O

CONTROL

I/O

8R-15R

I/O

0R-7R

R/W

CONTROL

LOGIC

CONTROL

LOGIC

13L

0L(1)

ADDRESS

DECODE

ADDRESS

DECODE

13R

0R(1)

BANK

DECODE

MUX

16Kx16

MEMORY

ARRAY

(BANK 3)

MUX

BANK

DECODE

BKSEL

3(2)

BKSEL

0(2)

BANK

SELECT

5L(1)

0L(1)

/UB

R/W

MAILBOX

INTERRUPT

LOGIC

5R(1)

0R(1)

/UB

R/W

MBSEL

INT

MBSEL

INT

3592 drw 01

NOTES:

1. The first six address pins for each port serve dual functions. When

MBSEL

= V

, the pins serve as memory address inputs. When

MBSEL

= V

, the pins

serve as mailbox address inputs.

2 . Each bank has an input pin assigned that allows the user to toggle the assignment of that bank between the two ports. Refer to Truth Table I for

more details.

MAY 2000

DSC 3592/7

IDT707288L25PFI Related Products

	IDT707288L25PFI	IDT707288S20PF	IDT707288S15PF	IDT707288S20PFI	IDT707288L15PF	IDT707288S25PFI
Description	Dual-Port SRAM, 64KX16, 25ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM, TQFP-100	Dual-Port SRAM, 64KX16, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM, TQFP-100	Dual-Port SRAM, 64KX16, 15ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM, TQFP-100	Dual-Port SRAM, 64KX16, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM, TQFP-100	Dual-Port SRAM, 64KX16, 15ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM, TQFP-100	Dual-Port SRAM, 64KX16, 25ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM, TQFP-100
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Parts packaging code	QFP	QFP	QFP	QFP	QFP	QFP
package instruction	14 X 14 MM, 1.40 MM, TQFP-100	14 X 14 MM, 1.40 MM, TQFP-100	14 X 14 MM, 1.40 MM, TQFP-100	14 X 14 MM, 1.40 MM, TQFP-100	14 X 14 MM, 1.40 MM, TQFP-100	14 X 14 MM, 1.40 MM, TQFP-100
Contacts	100	100	100	100	100	100
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN code	EAR99	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	EAR99
Maximum access time	25 ns	20 ns	15 ns	20 ns	15 ns	25 ns
Other features	AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE; INTERRUPT FLAG	AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE; INTERRUPT FLAG	AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE; INTERRUPT FLAG	AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE; INTERRUPT FLAG	AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE; INTERRUPT FLAG	AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE; INTERRUPT FLAG
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100
JESD-609 code	e0	e0	e0	e0	e0	e0
length	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM
memory width	16	16	16	16	16	16
Humidity sensitivity level	3	3	3	3	3	3
Number of functions	1	1	1	1	1	1
Number of ports	2	2	2	2	2	2
Number of terminals	100	100	100	100	100	100
word count	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
character code	64000	64000	64000	64000	64000	64000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	70 °C	85 °C	70 °C	85 °C
organize	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QFP	QFP	QFP	QFP	QFP	QFP
Encapsulate equivalent code	QFP100,.63SQ,20	QFP100,.63SQ,20	QFP100,.63SQ,20	QFP100,.63SQ,20	QFP100,.63SQ,20	QFP100,.63SQ,20
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	240	240	240	240	240	240
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm
Maximum standby current	0.01 A	0.015 A	0.015 A	0.03 A	0.005 A	0.03 A
Minimum standby current	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Maximum slew rate	0.31 mA	0.34 mA	0.35 mA	0.37 mA	0.3 mA	0.36 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	20	20	20	20	20	20
width	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm
Base Number Matches	-	1	1	1	1	-

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