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MC68EC030FE25CB1

Description
32-BIT, 25MHz, MICROPROCESSOR, CQFP132, CERAMIC, QFP-132
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size332KB,48 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
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MC68EC030FE25CB1 Overview

32-BIT, 25MHz, MICROPROCESSOR, CQFP132, CERAMIC, QFP-132

MC68EC030FE25CB1 Parametric

Parameter NameAttribute value
MakerMotorola ( NXP )
Parts packaging codeQFP
package instructionQFP,
Contacts132
Reach Compliance Codeunknown
Address bus width32
bit size32
boundary scanNO
maximum clock frequency25 MHz
External data bus width32
FormatFIXED POINT
Integrated cacheYES
JESD-30 codeS-CQFP-G132
length24.13 mm
low power modeYES
Number of terminals132
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Package shapeSQUARE
Package formFLATPACK
Certification statusNot Qualified
Maximum seat height3.175 mm
speed25 MHz
Maximum supply voltage5.25 V
Minimum supply voltage4.75 V
Nominal supply voltage5 V
surface mountYES
technologyHCMOS
Temperature levelCOMMERCIAL
Terminal formGULL WING
Terminal pitch0.635 mm
Terminal locationQUAD
width24.13 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR
MOTOROLA
Order this document
by MC68EC030/D
SEMICONDUCTOR
TECHNICAL DATA
MC68EC030
Technical Summary
Second-Generation 32-Bit Enhanced Embedded
Controller
The MC68EC030 is a 32-bit embedded controller that streamlines the functionality of an MC68030 for
the requirements of embedded control applications. The MC68EC030 is optimized to maintain
performance while using cost-effective memory subsystems. The rich instruction set and addressing
mode capabilities of the MC68020, MC68030, and MC68040 have been maintained, allowing a clear
migration path for M68000 systems. The main features of the MC68EC030 are as follows:
Object-Code Compatible with the MC68020, MC68030, and Earlier M68000 Microprocessors
Burst-Mode Bus Interface for Efficient DRAM Access
On-Chip Data Cache (256 Bytes) and On-Chip Instruction Cache (256 Byte)
Dynamic Bus Sizing for Direct Interface to 8-, 16-, and 32-Bit Devices
25- and 40-MHz Operating Frequency (up to 9.2 MIPS)
Advanced Plastic Pin Grid Array Packaging for Through-Hole Applications
Additional features of the MC68EC030 include:
Complete 32-Bit Nonmultiplexed Address and Data Buses
Sixteen 32-Bit General-Purpose Data and Address Registers
Two 32-Bit Supervisor Stack Pointers and Eight Special-Purpose Control Registers
Two Access Control Registers Allow Blocks To Be Defined for Cacheability Protection
Pipelined Architecture with Increased Parallelism Allows:
– Internal Caches Accesses in Parallel with Bus Transfers
– Overlapped Instruction Execution
Enhanced Bus Controller Supports Asynchronous Bus Cycles (three clocks minimum),
Synchronous Bus Cycle (two clocks minimum), and Burst Data Transfers (one clock)
Complete Support for Coprocessors with the M68000 Coprocessor Interface
Internal Status Indication for Hardware Emulation Support
4-Gbyte Direct Addressing Range
Implemented in Motorola's HCMOS Technology That Allows CMOS and HMOS (High-Density
NMOS) Gates To Be Combined for Maximum Speed, Low Power, and Small Die Size
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
©MOTOROLA INC., 1991
µ MOTOROLA
Rev. 1

MC68EC030FE25CB1 Related Products

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Description 32-BIT, 25MHz, MICROPROCESSOR, CQFP132, CERAMIC, QFP-132 Microprocessor, 32-Bit, HCMOS, PPGA117, PLASTIC, PGA-117 32-BIT, 25MHz, MICROPROCESSOR, CQCC132, CERQUAD-132 32-BIT, 25MHz, MICROPROCESSOR, CQCC132, CERQUAD-132 32-BIT, 25 MHz, MICROPROCESSOR, CPGA128, PGA-128 32-BIT, 33MHz, MICROPROCESSOR, CPGA128, PGA-128 Microprocessor, 32-Bit, HCMOS, PPGA117, PLASTIC, PGA-117 32-BIT, MICROPROCESSOR, PPGA124, PLASTIC, PGA-124 Microprocessor, 32-Bit, HCMOS, PPGA124, PLASTIC, PGA-124
package instruction QFP, PGA, QCCJ, QCCJ, PGA, PGA, PGA, PGA, PGA,
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknow
Address bus width 32 32 32 32 32 32 32 32 32
bit size 32 32 32 32 32 32 32 32 32
boundary scan NO NO NO NO NO NO NO NO NO
External data bus width 32 32 32 32 32 32 32 32 32
Format FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT
Integrated cache YES YES YES YES YES YES YES YES YES
JESD-30 code S-CQFP-G132 S-PPGA-P117 X-CQCC-J132 X-CQCC-J132 S-CPGA-P128 S-CPGA-P128 S-PPGA-P117 S-PPGA-P124 S-PPGA-P124
low power mode YES YES YES YES YES YES YES YES YES
Number of terminals 132 117 132 132 128 128 117 124 124
Package body material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QFP PGA QCCJ QCCJ PGA PGA PGA PGA PGA
Package shape SQUARE SQUARE UNSPECIFIED UNSPECIFIED SQUARE SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK GRID ARRAY CHIP CARRIER CHIP CARRIER GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum supply voltage 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V
Minimum supply voltage 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES NO YES YES NO NO NO NO NO
technology HCMOS HCMOS HCMOS HCMOS HCMOS HCMOS HCMOS HCMOS HCMOS
Terminal form GULL WING PIN/PEG J BEND J BEND PIN/PEG PIN/PEG PIN/PEG PIN/PEG PIN/PEG
Terminal location QUAD PERPENDICULAR QUAD QUAD PERPENDICULAR PERPENDICULAR PERPENDICULAR PERPENDICULAR PERPENDICULAR
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR
Maker Motorola ( NXP ) - Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP )
Parts packaging code QFP - QFN QFN PGA PGA - PGA -
Contacts 132 - 132 132 128 128 - 124 -
maximum clock frequency 25 MHz 40 MHz - - 25 MHz 33 MHz 25 MHz 40 MHz 25 MHz
length 24.13 mm - - - 34.545 mm 34.545 mm - 34.545 mm 34.545 mm
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C - - 70 °C 70 °C 70 °C
speed 25 MHz - 25 MHz 25 MHz 25 MHz 33 MHz - - -
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL - - COMMERCIAL COMMERCIAL COMMERCIAL
Terminal pitch 0.635 mm - - - 2.54 mm 2.54 mm - 2.54 mm 2.54 mm
width 24.13 mm - - - 34.545 mm 34.545 mm - 34.545 mm 34.545 mm
Other features - DYNAMIC BUS SIZING;UPTO 9.2 MIPS DYNAMIC BUS SIZING;UPTO 9.2 MIPS DYNAMIC BUS SIZING;UPTO 9.2 MIPS - - DYNAMIC BUS SIZING;UPTO 9.2 MIPS DYNAMIC BUS SIZING;UPTO 9.2 MIPS DYNAMIC BUS SIZING;UPTO 9.2 MIPS

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