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IDT70V05L15PFG

Description
Dual-Port SRAM, 8KX8, 15ns, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-64
Categorystorage    storage   
File Size158KB,22 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance  
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IDT70V05L15PFG Overview

Dual-Port SRAM, 8KX8, 15ns, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-64

IDT70V05L15PFG Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeQFP
package instructionLQFP, QFP64,.66SQ,32
Contacts64
Reach Compliance Codecompliant
ECCN codeEAR99
Samacsys DescriptionIDT SRAM Memory, IDT70V05L15PFG- 64kbit
Maximum access time15 ns
I/O typeCOMMON
JESD-30 codeS-PQFP-G64
JESD-609 codee3
length14 mm
memory density65536 bit
Memory IC TypeDUAL-PORT SRAM
memory width8
Humidity sensitivity level3
Number of functions1
Number of ports2
Number of terminals64
word count8192 words
character code8000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize8KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Encapsulate equivalent codeQFP64,.66SQ,32
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply3.3 V
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum standby current0.0025 A
Minimum standby current3 V
Maximum slew rate0.185 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceMatte Tin (Sn) - annealed
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width14 mm
HIGH-SPEED 3.3V
8K x 8 DUAL-PORT
STATIC RAM
IDT70V05S/L
Features
True Dual-Ported memory cells which allow simultaneous
reads of the same memory location
High-speed access
– Commercial: 15/20/25/35/55ns (max.)
– Industrial: 20ns (max.)
Low-power operation
– IDT70V05S
Active: 400mW (typ.)
Standby: 3.3mW (typ.)
– IDT70V05L
Active: 380mW (typ.)
Standby: 660
µ
W (typ.)
IDT70V05 easily expands data bus width to 16 bits or more
using the Master/Slave select when cascading more than
one device
M/S = V
IH
for
BUSY
output flag on Master
M/S = V
IL
for
BUSY
input on Slave
Interrupt Flag
On-chip port arbitration logic
Full on-chip hardware support of semaphore signaling
between ports
Fully asynchronous operation from either port
TTL-compatible, single 3.3V (±0.3V) power supply
Available in 68-pin PGA and PLCC, and a 64-pin TQFP
Industrial temperature range (-40°C to +85°C) is available
for selected speeds
Green parts available, see ordering information
Functional Block Diagram
OE
L
CE
L
R/W
L
OE
R
CE
R
R/W
R
I/O
0L
- I/O
7L
I/O
Control
BUSY
L
(1,2)
,
I/O
Control
I/O
0R
-I/O
7R
BUSY
R
A
12R
A
0R
(1,2)
A
12L
A
0L
Address
Decoder
13
MEMORY
ARRAY
13
Address
Decoder
CE
L
OE
L
R/W
L
ARBITRATION
INTERRUPT
SEMAPHORE
LOGIC
CE
R
OE
R
R/W
R
SEM
L
(2)
INT
L
NOTES:
1. (MASTER):
BUSY
is output; (SLAVE):
BUSY
is input.
2.
BUSY
outputs and
INT
outputs are non-tri-stated push-pull.
M/S
SEM
R
INT
R
(2)
2942 drw 01
JUNE 2012
1
©2012 Integrated Device Technology, Inc.
DSC 2941/10

IDT70V05L15PFG Related Products

IDT70V05L15PFG IDT70V05S25J IDT70V05L15JG IDT70V05L15JG8 IDT70V05L20PFGI IDT70V05L20PFGI8 IDT70V05L15PFG8
Description Dual-Port SRAM, 8KX8, 15ns, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-64 Dual-Port SRAM, 8KX8, 25ns, CMOS, PQCC68, 0.950 X 0.950 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-68 Dual-Port SRAM, 8KX8, 15ns, CMOS, PQCC68, 0.950 X 0.950 INCH, 0.170 INCH HEIGHT, GREEN, PLASTIC, LCC-68 Dual-Port SRAM, 8KX8, 15ns, CMOS, PQCC68, 0.950 X 0.950 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-68 Dual-Port SRAM, 8KX8, 20ns, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-64 Dual-Port SRAM, 8KX8, 20ns, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 Dual-Port SRAM, 8KX8, 15ns, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
Is it lead-free? Lead free Contains lead Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to incompatible conform to conform to conform to conform to conform to
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code QFP LCC LCC LCC QFP QFP QFP
package instruction LQFP, QFP64,.66SQ,32 0.950 X 0.950 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-68 QCCJ, LDCC68,1.0SQ QCCJ, LDCC68,1.0SQ LQFP, QFP64,.66SQ,32 LQFP, QFP64,.66SQ,32 LQFP, QFP64,.66SQ,32
Contacts 64 68 68 68 64 64 64
Reach Compliance Code compliant not_compliant compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 15 ns 25 ns 15 ns 15 ns 20 ns 20 ns 15 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code S-PQFP-G64 S-PQCC-J68 S-PQCC-J68 S-PQCC-J68 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64
JESD-609 code e3 e0 e3 e3 e3 e3 e3
length 14 mm 24.2062 mm 24.2062 mm 24.2062 mm 14 mm 14 mm 14 mm
memory density 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit
Memory IC Type DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM
memory width 8 8 8 8 8 8 8
Humidity sensitivity level 3 1 1 1 3 3 3
Number of functions 1 1 1 1 1 1 1
Number of ports 2 2 2 2 2 2 2
Number of terminals 64 68 68 68 64 64 64
word count 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words
character code 8000 8000 8000 8000 8000 8000 8000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 85 °C 85 °C 70 °C
organize 8KX8 8KX8 8KX8 8KX8 8KX8 8KX8 8KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LQFP QCCJ QCCJ QCCJ LQFP LQFP LQFP
Encapsulate equivalent code QFP64,.66SQ,32 LDCC68,1.0SQ LDCC68,1.0SQ LDCC68,1.0SQ QFP64,.66SQ,32 QFP64,.66SQ,32 QFP64,.66SQ,32
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK, LOW PROFILE CHIP CARRIER CHIP CARRIER CHIP CARRIER FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 225 260 260 260 260 260
power supply 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.6 mm 4.572 mm 4.572 mm 4.572 mm 1.6 mm 1.6 mm 1.6 mm
Maximum standby current 0.0025 A 0.005 A 0.0025 A 0.0025 A 0.005 A 0.005 A 0.0025 A
Minimum standby current 3 V 3 V 3 V 3 V 3 V 3 V 3 V
Maximum slew rate 0.185 mA 0.19 mA 0.185 mA 0.185 mA 0.195 mA 0.195 mA 0.185 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL
Terminal surface Matte Tin (Sn) - annealed Tin/Lead (Sn85Pb15) Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed
Terminal form GULL WING J BEND J BEND J BEND GULL WING GULL WING GULL WING
Terminal pitch 0.8 mm 1.27 mm 1.27 mm 1.27 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature 30 30 30 30 30 30 30
width 14 mm 24.2062 mm 24.2062 mm 24.2062 mm 14 mm 14 mm 14 mm
Base Number Matches - 1 1 1 1 1 1

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