Application Specification
Mezza-pede
®
SMT Connector
Low Profile 1.0mm Pitch
Rev. 3 – December 7, 2016
Application Specification
Table of Contents
1.0 Introduction
2.0 Scope
3.0 Product Overview
4.0 Part Number Structure
5.0 Shipping
6.0 PC Board Design
7.0 PC Board Application Procedure
8.0 Solder Paste and Disposition
9.0 Solder Reflow
10.0 Double Sided Reflow
11.0 Cleaning
12.0 Protective – Pick and Place Cover Removal
13.0 Recommended Mating and Unmating Procedure
14.0 Storage
15.0 Revision History
3
3
3
6
7
7
8
8
9
11
11
11
12
13
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Mezza-pede® SMT Connector Application Specification, Rev. 3
Page 2
©2009-16, Mezza-pede is a registered trademark of Advanced Interconnections Corp. Data provided as a general guideline only. Specifications
subject to change without notice. For details relating to proprietary information protected by patents, see Pat. www.advanced.com/patents
Dimensions: inch/(mm)
Application Specification
1.0 Introduction
1.0mm pitch Mezza-pede® SMT Connectors are designed for the mating and unmating of a PC
board (PCB) to a PCB, PCB to flex cable, or flex cable to flex cable. The female connector
(receptacle) may also be used as a surface mount socket for a thru-hole device.
2.0 Scope
This product Application Specification covers the 1.0mm pitch low profile SMT receptacle (socket)
and the SMT and thru-hole headers.
3.0 Product Overview
There are two (2) components that make up this connector system; a header and a socket
(receptacle). The receptacle incorporates terminals consisting of a female shell with an internal
contact, an insulator, and a terminal lead [see Fig 1A]. The receptacle is typically mounted to the
PC board (motherboard).
The SMT header incorporates a male terminal, an insulator, and a terminal lead [see Fig 1B]. The
thru-hole header incorporates a male terminal and an insulator [see Fig 1C]. The header is
attached to a daughter card in board to board applications or to a flex circuit for PCB to cable
assemblies.
Receptacles and headers are each shipped in tape and reel packaging. The headers are shipped
with a protective (pick-and-place) cover that is removed after solder-attach (also available as an
option on the SMT receptacle) [see Fig. 5]. This cover can be left in place for storage or for
protection of the male terminals during the handling processes.
The flexible thru-hole headers are supplied in trays without pick-and-place covers.
Figure
1A
Mezza-pede® SMT Connector Application Specification, Rev. 3
Page 3
©2009-16, Mezza-pede is a registered trademark of Advanced Interconnections Corp. Data provided as a general guideline only. Specifications
subject to change without notice. For details relating to proprietary information protected by patents, see Pat. www.advanced.com/patents
Dimensions: inch/(mm)
Application Specification
SMT
Header
Thru-hole
Header
Figure 1B
Figure 1C
3.1
Dimensions [See Fig. 2]
Model
DHS/DHAM
DHS/DHAM/DHAL
DHS/DHAM
DHS/DHAM
DHS/DHAM
Pin Count
8
14
20
30
36
Rows
2x4
2x7
2 x 10
2 x 15
2 x 18
A
.171/(4.36)
.290/(7.36)
.408/(10.36)
.605/(15.37)
.722/(18.34)
B
.118/(3.00)
.236/(6.00)
.354/(9.00)
.551/(14.00)
.669/(17.00)
3.2
Pitch:
•
•
Spacing in the “X” axis is 0.039/(1.00) TYP. [Fig. 2]
Spacing in the “Y” axis is 0.039/(1.00) TYP. [Fig. 2]
Mezza-pede® SMT Connector Application Specification, Rev. 3
Page 4
©2009-16, Mezza-pede is a registered trademark of Advanced Interconnections Corp. Data provided as a general guideline only. Specifications
subject to change without notice. For details relating to proprietary information protected by patents, see Pat. www.advanced.com/patents
Dimensions: inch/(mm)
Application Specification
3.3
Stack Height (“Z”), which is the resultant distance between two (2) mated and stacked
PCBs as measured from the bottom of the upper PC board to the top of the mating PC
board, is 0.157/(4.00) approx. for the SMT version [Fig 3A] and 0.122/(3.10) for the through
hole version [Fig 3B]. *Note: Mated height will vary depending on reflow profile, paste
volume, and PC board pad size.
Z Dimension: DHAM/DHS: 0.157/(4.00), DHAL/DHS: 0.132/(3.35), DHA/DHS 0.122/(3.10)
Z
Z
Figure 3A (DHAM/DHS)
3.4
Figure 3B (DHA/DHS)
The SMT connector system utilizes a screw-machined terminal that is pressed into and
soldered to a terminal lead to assure a robust connection. This proprietary design allows the
use of screw-machine technology along with metal forming technology. [Fig. 4]
Figure 4
3.5
3.6
The leads are plated with Matte Tin to be RoHS compliant.
The removable cover (cap) is designed to facilitate automated pick-and-place and to protect
the terminals during transportation, storage, and assembly. Covers are provided as a standard
feature on the header [Fig. 5A] and an option on the receptacle [Fig. 5B]. This cover needs to
be removed before the product can be put into use, but only after the solder reflow operation
has taken place.
Protective/pick-and-place cover
SMT
Header
Receptacle
(Socket)
Figure 5A
Mezza-pede® SMT Connector Application Specification, Rev. 3
Figure 5B
Page 5
©2009-16, Mezza-pede is a registered trademark of Advanced Interconnections Corp. Data provided as a general guideline only. Specifications
subject to change without notice. For details relating to proprietary information protected by patents, see Pat. www.advanced.com/patents
Dimensions: inch/(mm)
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